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KDF RELEASE 2006

Multi-Order Includes 654i System, Expands Companies’ Partnership

KDF today announced that Ovonyx, Inc., a Rochester Hills, Mich.-based company specializing in the commercialization of proprietary phase-change semiconductor memory technology, has purchased the new KDF Ci (cluster intelligence) cluster tool for use in support of commercialization programs for its technology. The product, which is expected to ship in the third quarter 2007, marks a first-time cluster tool win for KDF and the company’s entry into a new market.

Non-volatile phase-change memory boasts rapid write and erase speeds, elevated cycling endurance, and superior scaling performance as the industry moves toward newer generations of nonvolatile solid state memory. Ovonyx will continue its programs for Ovonyx Unified Memory (OUM) performance enhancement and cost reduction on KDF’s innovative cluster tool. The customized cluster tool with a hydrogen cleaning station will allow Ovonyx and its customers to develop manufacturing processes in a preproduction environment using a cluster tool that emulates their fab environments.

“KDF has been a very reliable supplier, and through our collaboration with KDF, we will have in hand a cluster tool ideally suited for phase change and associated materials deposition,” said Ed Spall, vice president, Ovonyx. “Our current and future partners will benefit from the new KDF Ci cluster tool’s unique capabilities as we jointly pursue commercialization of OUM phase change technology.”

Ovonyx current licensees include Samsung, BAE Systems, Intel Corp., STMicroelectronics, Nanochip, Inc. and Elpida Memory, Inc. Furthermore, Ovonyx recently bought KDF’s 654i series batch tool to complement the other KDF system it’s currently utilizing, the 643GT in-line, side sputtering batch system.

“Our long-term relationship with Ovonyx signifies the customer’s level of assurance in our technology expertise and manufacturing know-how,” said Kurt Flechsig, president, KDF. “With this versatile process platform, KDF will provide Ovonyx with a superior and unique level of customization for this cluster tool as well as lower cost of ownership.”

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KDF RELEASE 2005

KDF today announced that Beijing Microelectronics Institute (BMI), a leading microelectronics manufacturer in China, has purchased the company’s new 904i in-line sputtering system for use in production as well as research and development. The product, which will ship to BMI in October, helps extend KDF’s market share penetration in the fast-growing Chinese market.

According to researcher IDC, China became the world’s third-largest semiconductor-consuming country in 2004, with revenue from the region surpassing $26 billion. IDC predicts China will grow twice as fast as the entire semiconductor industry over the next five years. Beijing-based BMI chose the 904i system based on its versatility, reliability and ease-of-use.

“As a first-time customer, BMI’s decision to use KDF’s tool speaks volumes about their confidence in our technology leadership. The customizable 904i system also supports a range of BMI’s microelectronics manufacturing needs,” said Kurt Flechsig, KDF president. “Furthermore, the move further solidifies our presence in China as customers continue to ramp up their assembly facilities in that country.”

KDF’s 900 Series of products include dual load lock, in-line, sputter down, batch systems constructed with an optional high vacuum load lock and three or four target positions. Additionally, the 900 series systems can be used in numerous applications where distinctive size, shape, or substrate height is a priority. The 904i is in the preproduction phase and is expected to be available to customers in Q4 2005.

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KDF RELEASE 2005

KDF today announced that Taiwan-based FuPo Electronics Corporation, a turnkey service provider for liquid crystal display (LCD) integrated circuit (IC) manufacturers, purchased KDF’s 844NT batch sputtering system for use in high-volume wafer bumping production. FuPo’s purchase signals a growing acceptance of KDF’s sputtering systems in Taiwan.

Wafer bumping is an important stage during assembly that generates interconnects between the chip and substrate, and KDF’s systems provide the maximum speed and functionality for this process.
“We chose the KDF 844NT for its proven high throughput and performance, as well as its ability to modify wafer size without production delays,” said N.T. Huang, President of FuPo Electronics. “This enables us to better meet the changing requirements of the merchant wafer bumping foundry environment.”

KDF’s 844NT tool will be delivered to FuPo Electronics ready to accept a robotic-load process called OPUS which allows the customer to upgrade easily to a complete cassette-to-cassette operation. The combination of the 844NT and OPUS creates the fastest wafer-size changeover time in the industry using just software and quick-check calibration.

“KDF is very pleased that our new customer, FuPo Electronics, will use the 844NT during the essential wafer bumping step,” said Kurt Flechsig, KDF president. “The grouping of our OPUS robotic technology and the 844NT’s superior execution will provide FuPo Electronics with excellent results.”

The 844NT is designed to process high-density interconnect, 300 mm semiconductor wafers and flat panel displays through its four-target, batch-sputtering system. The 844NT offers a pallet area of 26.5 x 26.5 inches with a compact footprint that uses less than one-third the floor space of competing equipment. Due to its size the 844NT system is an extremely cost effective way of running batches of small to large wafers or substrates.

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KDF RELEASE 2005

KDF today announced that the Flexible Display Center (FDC) at Arizona State University has purchased a KDF 744NT batch sputtering system for use in flexible display research. The 744NT, installed in May, was among the first physical vapor deposition systems installed and optimized for use in advanced display technology research at the FDC.

In 2004, the U.S. Army awarded Arizona State a $43.7 million, five-year cooperative agreement to establish the FDC for the development of small, lightweight, portable display/information devices that are small enough to roll up and carry or wear. These devices will improve communication between soldiers, allowing them to share information about troop positions, movements, weather and other important variables. New developments are expected to yield new commercial applications for these devices.

“Acquisition of the KDF tool increases FDC GEN II capabilities tremendously with exceptional value. KDF offers exceptional engineering support and customer service,” said Shawn O’Rourke, Flexible Display Center Director of Operations.

“KDF is very pleased that the 744NT batch sputtering system will be playing a key role in the development of this important new technology,” said Kurt Flechsig, KDF president. “The research done at the Flexible Research Center has the potential to yield great benefits, not only for military use, but for consumer electronics and medical device applications as well.”

The 744NT is a large area, four-target, batch sputtering system, designed for processing high-density interconnect, 200 mm semiconductor wafers, flat panel displays and other applications. The 744NT is equipped with a high-vacuum loadlock configured with a substrate pre-heat that enables the tool’s high throughput. The 744NT offers a pallet area of 19 x 19 inches with a compact footprint that uses less than one-third the floorspace of competing equipment. The tool can hold four 200 mm wafers or multiple smaller wafers and features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and back sides of wafers.

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KDF RELEASE 2005

KDF today announced that a leading original health equipment manufacturer has purchased and accepted two KDF 744NT batch sputtering systems. The tools are fully qualified and are currently in production.

The customer will utilize the KDF 744NT sputtering systems for radiography research to advance digital x-ray technology into digital mammography and digital radiography. Advancing x-ray technology to a large area, full-field digital platform will help improve the diagnostic process for breast cancer, and will improve other medical initiatives like stationery and remote diagnosis. Breast cancer diagnosis using a digital platform provides unsurpassed image quality and options for instantaneous re-shoots and eliminates the need to schedule additional appointments.

Over the past year, KDF has helped the customer qualify the KDF 744NT for this production application by providing on-site service including process assistance and software enhancements.

“It is very gratifying for KDF to announce the sale of two KDF 744NT batch sputtering systems to one of the world’s largest leading original health equipment manufacturers,” said Kurt Flechsig, KDF president. “This sale is of particular note because we have been able to extend our tool into a new application that we hope will help to improve the quality of health care and treatment throughout the world.”

The 744NT is a large area, four-target, batch sputtering system, designed for processing high-density interconnect, 200 mm semiconductor wafers, flat panel displays and other applications. The 744NT is equipped with a high-vacuum loadlock configured with a substrate pre-heat that enables the tool’s high throughput. The 744NT offers a pallet area of 19 x 19 inches with a compact footprint that uses less than one-third the floorspace of competing equipment. The tool can hold four 200 mm wafers or multiple smaller wafers and features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and back sides of wafers.

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