KDF Integrated Passive Devices and Components, Thin-Film Circuits
ABOUT
Integrated Passive Devices (IPDs) and components, including thin film circuits like resistors, capacitors, inductors, antennas, and resonators, represent a significant and expanding segment of the electronics market.
These components are fabricated using integrated circuit processing techniques similar to those employed in semiconductor manufacturing, though not exclusively on silicon substrates. The growing importance of these devices is largely attributed to the ongoing trend towards miniaturization in wireless technology.
The principal advantage of using thin film technology for the construction of these devices lies in its ability to achieve extremely close component matching, high area density, and consistent, repeatable performance. This is particularly beneficial in applications where space is at a premium and reliability is critical.
To manufacture these thin film devices and components, companies often turn to KDF Technologies' sputtering systems. These systems are capable of depositing a wide variety of materials—including gold (Au), chromium (Cr), titanium (Ti), copper (Cu), tantalum (Ta), tantalum nitride (TaN), and nickel-chromium (NiCr)—which are essential for the production of high-quality IPDs and thin film circuits. This technology supports the industry's need for efficient, reliable, and miniaturized components across a range of wireless applications.
Thin Film Resistors:
These offer high precision and stability, commonly used in RF applications for their excellent performance over a wide range of frequencies.
Thin Film Capacitors:
Known for their compact size and reliability, these capacitors are used in applications requiring high precision and stability.
Thin Film Inductors:
These are utilized in high-frequency circuits for their quality performance, occupying less space while providing the necessary inductance values.
RF Filters:
Integrated passive devices that select or block specific frequency ranges, critical in wireless communication systems to ensure signal clarity and reduce interference.
Baluns (Balanced to Unbalanced Transformers):
Used to convert between balanced and unbalanced signals, essential in RF and antenna applications.
Antennas:
Thin film technology enables the production of miniaturized antennas for various wireless devices, supporting the trend towards smaller and more efficient communication devices.
Resonators:
These components are used to generate or select specific frequencies, essential in clocks and oscillators for various electronic devices.
Integrated Passive Networks:
Complex networks of resistors, capacitors, and inductors integrated into a single package, used to perform multiple functions in a compact space.
These devices are integral to the advancement and miniaturization of modern electronic and wireless devices, offering high performance in small, efficient packages, and KDF Technologies equipment plays a critical role.
KDF Magnetron Sputtering
KDF Technologies specializes in magnetron sputtering, a process highly effective for depositing thin films required by the latest technologies. Utilizing KDF's advanced sputtering systems, top device manufacturers can apply a variety of films, including gold (Au), titanium tungsten (TiW), iridium (Ir), silver (Ag), zirconium (Zr), tantalum (Ta), tantalum nitride (TaN), titanium (Ti), and titanium nitride (TiN). Leveraging cutting-edge techniques such as High Power Impulse Magnetron Sputtering (HIPIMS) and Pulsed DC reactive sputtering, KDF is perfectly equipped to customize solutions for any application. This customization is supported by a dedicated team of experts in applications, design, and vacuum technology, ensuring that each medical device benefits from the most advanced and suitable thin film deposition process.
Key Capabilities
Pallet Stacker (900 series only):
Increases the load lock cassette capacity to 5 pallets. This allows a longer run time between load and un-load cycles, ideal for un-supervised operation.
Note each pallet can run the same deposition recipe or its own unique deposition recipe.
Precious Metal Sputtering with Upsilon Inset™ Cathode:
Specifically designed for high thermal conductivity, high value materials such as Gold (Au), Platinum (Pt), Palladium (Pd), Silver (Ag)
Utilizes novel ‘Upsilon’ shape targets that enables up to 60% target utilization
Water Pump:
Water pumps are high-performance pumps used in conjunction with the high vacuum pump (turbo or cryo) that increase water vapor pumping speeds to substantially improve system throughput and process stability.
Enhanced Rotating Planetary Pallet (ERPP) (900 series only):
The planetary rotating pallet ERPP™ (enhanced rotating planetary pallet) is a KDF design to achieve exceptionally high uniformity in the sub 1%, as well as tight repeatability.
(Ref: Vacuum Technology and Coating, December 2002).
HIPIMS:
HIPIMS (High Power Impulse Magnetron Sputtering) is a sputtering power supply and technique that can produce highly dense, smooth, and hard films with enhanced conformality or step-coverage for high aspect ratio applications.
Auto Rate Adjust (ARA):
Auto-rate-adjust will automatically adjust the scan speed or deposition power to account for a decrease in deposition rate from target wear, thereby maintaining a stable process thru the life of the target.
Scan Velocity Control:
Allows the operator to create velocity profiles for the pallet as it passes through the deposition zone, enhancing film uniformities and rates.
IR Pallet Temperature Measurement:
Integrated pyrometer pallet/part temperature measurement. Instant feedback on temperature of your pallet and/or parts. Temperature readings can be integrated into recipes allowing for continued cooling, or heating, before proceeding with further recipe steps.
Ellipsometer or Optical Measurement Integration:
Integration of insitu optical monitoring equipment for checking film thickness, n, and k values.
Have questions? Contact KDF about our in line sputtering tools
In line with your process
The most reliable in-line sputtering tools in the industry are developed and manufactured by KDF. All of KDF’s systems are engineered to meet versatility and high throughput demands across a number of markets at the industry’s lowest cost of ownership.
- Mainstream silicon
- Emerging materials
- Flat panel displays
- Optical communications
- Medical devices
Across all platforms, KDF’s in-line batch sputtering systems are easier to use and maintain than cluster tools. KDF’s solutions provide users with increased:
- Film uniformity
- Throughput run to run
- Process stability
- ROI
- Automation
- Tool uptime
- Reliability
- Environmental health and safety benefits
KDF meets the needs of its customers by quickly developing tailored solutions and building on its core competencies. KDF can specifically engineerits tools for increased throughput, ROI or time to market. All existing KDF equipment is supported with upgrades and retrofits. In addition, as theOEM for MRC batch systems, KDF sustains all MRC batch products offering complete parts and service support on a world wide basis.
943ix and 954ix
The 943ix and 954ix are two of KDF’s x Series™ products. They feature the latest KDF cathode designs, which have been lengthened to 17 inches, offering improved uniformity over the entire pallet. x Series™ cathodes are available in both Planar™, Inset™ and RF/DC LMM™ cathode form.
