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The Linear Moving Magnet sputter cathode – LMM^™ cathode, is a  patented full face erosion rectangular design and it is available for all KDF systems. We continue to innovate this field proven LMM™ cathode design so that our clients now have the full capability to run RF depositions and full dielectrics can be deposited.

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You have been identified in our equipment database as being a KDF “T”, “GT”, “NT” or early “i” sputter system owner who is still using either the obsolete Brooks Techware controller and/or the obsolete MKS 146 gauge package.

Most recently Microsoft has announced as well that its support of the Windows XP operating system has ceased, leaving owners of such vulnerable to both malicious and damaging interruptions. The KDF equipment still using these items can now be 30yrs.old. In regards to the Techware controllers Brooks support both from themselves and through their designated second and third parties ended almost 15 yrs. ago. Replacement hardware availability is now non-existent.

MKS had also announced many years back the end of the popular 146 vacuum gauge controller, due to component obsolescence. MKS support for the gauges which was limited to stock of these obsolete components ended this year. (The 146 was used extensively on GT and NT systems) To that extent KDF has developed and produced a 146-gauge replacement package that is available to customers who are already running on the KDF “i” controller platform or to customers needing the full upgrade. The package includes the MKS series of “Smart” gauging coupled with a VAT throttling gate valve. T and GT system owners already face additional obsolescence with the SX and MKS 287 & 290 controllers as well as NT users who are now also experiencing PC hardware obsolescence. Once upgraded to the “i” series the system can be further enhanced with options and upgrades to improve reliability and performance. Some of the available upgrades include a CPU, Windows 7 replacement kit, a load lock linear positional transducer, zeta scan velocity profiling controller, enhanced power supplies and new load lock heat pallet temperature measurement and control feature utilizing an optical sensor.

Customers that have already upgraded to the KDF “i” controller have insured themselves against further component obsolescence and unplanned down time. All upgraded systems operate on the same platform as the new KDF “i” systems (Windows 7) thus insuring years of compatibility and ongoing enhancements. All upgraded systems now have on line system available remote help from KDF.

For GT and NT system owners the system can be upgraded in the field typically within a week thus minimizing system down time and bringing your upgraded system back on line quickly. “T” systems typically take longer based upon the system’s configuration and are returned to the factory for full blown upgrading and reconditioning. In the past 10 yrs. KDF has successfully upgraded numerous systems both in the U.S., Europe, and the Pacific Rim. All upgrades include KDF’s ESP online Internet support Webex) See individual cut sheets for system type upgrade pricing.

Prudently planning a conversion now to the updated platform will minimize a lengthy unplanned tool down situation. (12-16 weeks)

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As always please don’t hesitate to contact KDF for a quote or for any other of your service or system needs.

Jac P Gnirrep
Director of Customer Satisfaction
jac@kdf.com

KDF acquired the MRC batch product line in 1986 and to that extent we have been supporting and maintaining those customers whose chose to continue with this product line for the last thirty plus years.

The support consisted not only of service, repairs and part sales but also selling factory reconditioned MRC tools which KDF supported and kept under warranty. KDF also maintained a vast inventory of spare parts to support this generation of equipment as well as a working service support system on the factory floor.

For those customers that were MRC users over the years many have migrated to the KDF line which allowed for a seamless transition of enhanced compatibility and familiarity both in vertical and horizontal sputtering. For those customers who have migrated to the family of KDF sputtering systems KDF ‘s roadmap and policy of “no tool left behind” has allowed for them to upgrade their systems over the years as the technologies and components utilized in the tools has evolved or gone obsolete.

For MRC users the end of life for these tools has approached the event horizon.

One of the benefits of crossing over is that it allows for the customer to take advantage of KDF’s complete applications lab that can assist you with transferring process requirements from MRC to KDF and can be done prior to delivery of your new equipment thus insuring minimum start up time.

By migrating to the KDF line of tools many consumable parts that you may have significant inventories of may be able to be utilized on the equipment such as cathodes, targets and shied sets. This alone offers a cost advantage over another competitor’s tool.

Trade in credit is also available for certain MRC systems. Contact Todd in Sales for more information. Todd@kdf.com 201-784- 5005.

Prudently planning a conversion or trading in your old tool now to the KDF equipment line will minimize a lengthy unplanned tool down situation.

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As always please don’t hesitate to contact KDF for a quote or for any other of your service or system needs.

Jac P Gnirrep
Director of Customer Satisfaction
jac@kdf.com

Pirates Abound: The Problem with IP for OEM’s

BY KURT FLECHSIG, KDF[spacer height=”20px”]

There is a growing concern within the competitive semiconductor industry about re-builders and third party companies that make a business from copying the IP of others and then try and spin it into the term of Reverse Engineering. The last time I checked that term is just a PC way of saying you’re not STEALING. Activity of this nature can best be referred to as Pirating since it best describes their activity. As an OEM we develop our core competencies to bring a higher level of value, knowledge
and capabilities to our customers rather than the pirate companies whose premise is to pretend to bring value added to a product they have no rights to.

In todays’ cutthroat, price is all that matters society, the assault against OEM’s is relentless, specifically sputtering cathodes, gas cooling and proprietary software development. Customers seem to lose sight of the benefits when dealing with the OEMs that actually spend the money and create the knowledge base while developing these new concepts and products that other people try to leverage off of. When the foundations of OEM’s are chipped away by the unsavory practices by these Pirate run companies, it will eventually hurt the customer in the long run. Some third party rebuilders will argue that original OEM’s that have gone out of business are fair game for them to offer their alleged parts and services to keep such equipment running.

I would say that why would one want to deal with a company that does not have direct ownership of a product, or the insight behind the design of said product. The company you deal with should have the original parts, knowledge, and documentation to support such, otherwise you’re dealing with a lookalike replica product which will not perform or last as the original design intended.

As an example of such things I will illustrate some of the issues that face new equipment people.

Many pirates install a low-cost PLC retrofit controller with minimal software coding and features to replace the original systems controller. More often than not these controllers are used components or outdated models which allows having a greater profit on the goods sold while providing an inferior product to the customer. Our company provides the newest PLC systems which use a higher end controller than what the pirates offer. To ensure consistency of product, valued service and continued technical support, companies should rely on the original manufacturer’s software knowledge and not an outside source.

Customers afflicted by these pirates have suffered a multitude of problems due to false claims and poorly developed software. These include, but are not limited to out of date versions of software, copies of nonlicensed software, providing shareware as an operating system, and not owning a legal copy of development software licenses.

These kinds of poorly developed software are not created with static analysis practices or software testing customs in mind. In the fast-paced digital age, the importance of static code analysis cannot be ignored.

Our core competency is to make Brand new equipment which includes large investments in Engineering and Process Development for the systems we design, prototype and build. As an OEM we make investments into the R&D aspect of our products lines and we spend a great deal of resources to do so. KDF had designed upgrades into even our oldest product lines which go back 25 years, as an OEM we also continue to offer upgrades for our Legacy systems. KDF provides re-manufactured MRC/KDF tools as a cost savings to the customers with smaller budgets ,while still maintaining a high level of quality.

Furthermore, there is a big price point difference between remanufacturing and just performing a software upgrade. Re-manufacturing has the benefits of buying a new tool but at a reduced price. A customer most always keep in mind that certain obsolete components need to be replaced during the re-manufacture in order to ensure the tool is current and supportable for spare parts
in the continuing future of the tool.

The Pirate will frequently copy KDF’s Cathode or Magnet IP and then tried to pass it off as improved. They tout better system utilization but the truth is customers lose out on uniformity or overall performance. Cathodes are designed for a long manufacturing life, yet pirate replacements often do not stand up to longterm use and cost customers more money over time. As an OEM we have produced thousands of new cathodes, and we track and record the data to back up the performance of our Cathodes. In order to have a successful purchase customers expect and need a company that can supply process support. We have made this investment in thin film expertise and have the metrology instruments and personnel to supply such. A KDF system will leave our production floor with a qualified process running in that tool and arrive at the customer’s site ready for production.

In some situations, our staff will visit a customer’s site to provide service and support after one of these re-building companies has intervened. The typical dysfunctional equipment is now riddled with systemic problems along with processes that do not work. While we have a policy of not working on third party sys-Pirates Abound: The problem with IP for OEM’s By Kurt Flechsig, KDF tems, we can sometimes help by supplying parts and offering alternate means of repair. The majority of these customers usually end up paying more for the product and suffering with longer downtimes. We have seen many of these re-building companies come and go along with customers’ trust and budgets.

The best way to avoid these problems is to steer clear of these pirates in the first place. Don’t be lured in by low prices and software screen money shots. Before making a purchasing decision, refer to these tips to ferret out pirates:

• Documentation: Will the company provide software documentation that reflects their actual product? Software documentation should always be provided and not be left up to the imagination of the user.
• Will the company provide the source code? This is a red flag and, generally, should not be done. The vendor should retain ownership in order to provide the full service required over the life time of the tool.
• Can the vendor provide a safe code? A system may be able to run on 10k lines of code when it has no recovery actions or well written safety protocols.
• Who develops and updates the software, employees, third party or students? The level of experience of the developer is crucial for installation and ongoing service of the tool. Many times the code is created by an additional third party.
• Does your supplier own any of the rights to the equipment they are supplying?
• Can the vendor supply accurate prints and documentation about the components in the tool that do belong to them?
• Can the vendor supply full technical support for the tool and the process running in it?
• Can the supplier provide authentic references of actually customers with working equipment?
• Are you buying a reversed engineered tool and a one of kind system?
• Does the vendor supply new components, or rebuilt third party parts, aka pumps, power supplies, feed-throughs, or instruments?
• Does the vendor you have off site back up and file protections for all of their product aspects?
• Full remote backup via the internet, with in-house software engineers.
• Does the vendor have a full in-house Application Lab staffed with process literate scientists?
• Is the system safe? Does it meet any SEMI, S2, CE, NEC or NFPA standards?

As an OEM our company stands behind MRC and our own KDF systems. We are the sole official owner of MRC sputtering tools. Furthermore, we have programs in place in which we improve upon our current designs as well as ensure consistency and performance. We also are working with customers to develop new processes and hardware. Our in-house experienced software , mechanical and electrical engineers continually strive to develop products with the most up-to-date improvements and revision control. This is the key that will open the door to customers’ advanced process needs for their sputtering systems, and help them to meet their goals.

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KDF RELEASE 2012

943i Sputtering Systems for Production of High Efficiency Ge & CIGS PV Solar Cells

March 16, 2012–KDF today announced that two leading industry Photovoltaic suppliers have selected Three of its 943i in-line sputtering system for use in PV Solar Cell manufacturing. The order verifies that KDF’s technology platforms continue to step-up to producing advanced Solar PV devices.

The 943i for its ability to adapt to changing solar cell process technology, a crucial aspect of space-based PV cell manufacturing since each device is expected to perform in the extreme conditions of space. KDF’s superior coating technology meets these standards. The solar cells need to perform in different conditions. This doesn’t just mean the weather. Hot or cold, it’s also the connected appliances. It’s always a smart idea to check with your solar charge controller supplier to see if the cells of the solar panel, are compatible with the controller. This can have a negative effect on your system if they don’t match or aren’t compatible. Check with the one handling your solar panel denver installation before you make your choice to be certain it will all work.

As new customers of KDF critical evaluations had to be met on the performance of the 943i provides the process integrity required for producing high-reliability devices,” said Todd Plaisted, director of marketing. “KDF already maintains a presence in the Solar Photovoltaic market and this order has continued our high-efficiency niche market penetration for this industry.”

KDF offers advanced and reliable batch in-line sputtering systems at the industry’s lowest cost of ownership. These systems are used around the world in the semiconductor, telecommunications, aerospace and medical technology markets, each tailored to meet specific processing needs.

For this process KDF configured the 900 Series system with a newly developed Bi-Polar dual cathode sputter capability for stable reactive processing, a first in the 900 series system. With sputter down capability and easy substrate loading, the 943i is ideally suited for Solar Cell PV applications which produce uniform films with an exacting, but repeatable, high-throughput process.

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KDF RELEASE 2010

954i Sputtering Systems Proven Leaders In Medical Device Production

Feb. 11, 2010–KDF today announced that a leading industry supplier has selected two of its 954i in-line sputtering system for use in manufacturing pacemaker components. The order verifies that KDF’s technology platforms continues to meet rigorous standards for producing advanced medical devices.

The 954i for its ability to create dense adherant coatings, a crucial aspect of medical manufacturing since each device is expected to perform flawlessly. The KDF 954i features Inset(TM) style cathodes, a cathode design that provides long lifetime and high utilization for thick coatings, like those that are used to protect critical pacemaker components. There is no margin for error in pacemaker manufacturing applications and KDF’s superior coating technology meets these standards.

As a new customer of KDF critical evaluations had to be met on performance of he 954i provides the process integrity required for producing high stakes medical devices like pacemakers,” said Todd Plaisted, director of marketing. “KDF already maintains a presence in the medical devices market and this order has continued our market penetration for this industry.”

KDF offers advanced and reliable batch in-line sputtering systems at the industry’s lowest cost of ownership. These systems are used around the world in the semiconductor, telecommunications, aerospace and medical technology markets, each tailored to meet specific processing needs.

For the this process KDF configured the 900 Series system with a newly developed phased dual cathode sputter capability for higher throughput while achieving greater target material utilization. With sputter down capability and easy substrate loading, the 954i is ideally suited for medical applications which produce uniform films with an exacting, but repeatable, high-throughput process.

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KDF RELEASE 2009

After two years of development and testing KDF is pleased to announce the release of the G-12 full-face erosion cathode, The G 12 will be exclusively featured in our Ci Cluster tool system line up.

This new design round cathode utilizes a proprietary hi-strength close coupled magnet assembly which allows the cathode to be perfectly suited for today’s more demanding applications such as compound semiconductor apps and unique Oxide depositions. The variable speed controlled motor driven magnet pack will run at speeds that allow materials to be put down at varying rates, yet able to maintain excellent uniformity over an eight inch substrate. This Patent Pending design further strengthens KDF’s position in critical film technologies. Preliminary testing has indicated that basic metal uniformity of > 2% is easily achieved. This cathode coupled with KDF’s Ci cluster tool, with counter rotating anode stage will enable uniformities of less then 1% wafer to wafer. With over 23 years of engineering and manufacturing expertise KDF is ready to offer another World Class Product.

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KDF RELEASE 2008

LMM™ Patented Device Full Face Erosion Cathode

The LMM or Linear Moving Magnetron was a leap forward in the production environment for Compound Semiconductor market place, allowing greater run times and improved films for reactive process’s.
KDF has just released its newest version of the field proven LMM cathodes , this latest generation cathode now offers a lateral motion magnet pac that increases the the overall utilization to approx 60%. This recently engineered improvement allows for longer run times between target changes and aids in the decrease to target poisoning during long fully reactive runs. This new revision cathode will be Patent Pending as well , securing KDF position as a leader in cathode design technologies. By creating this new Pivotal end turn around method , burn through at corners has been significantly reduced and there by extending the usable target life for Full Face Erosion cathode.

Currently this cathode is only available for KDF tool sets thereby enabling KDF end users to benefit from this extraordinary cathode. Customers that are interested in this cathode should contact KDF to discuss their technical needs, KDF can also run customer demo’s in a Process Lab Tools.

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KDF RELEASE 2008

After ten months of engineering KDF has released and installed the new 844i systems. KDF had listen to their customers and realized that the 844 platform had to grow in order to accommodate the new generations of hi-end displays and CCD pickups , hence the larger format 844 was born. The new 844i offers a pallet size of 26.5 by 30 inchs , which also increase throughput for other users which utilize wafers or alumna substrates.

The new system only grew a few inches externally , but KDF was able to give back by repackaging the overall computers and PLC controls, the new Cybertronics all in one computer and keyboard assembly allowed us to utilize a small portable round around computer station and touch screen to run all system functions. All motions in the tool are executed by either stepper driven encoder feedback drives or in the case of the Load Lock elevator a linear encoder for positional readouts. Motion control and speed controls are extremely critical for exacting process , so speed regulation pallet scanning is resoluted at .001%. RF and DC power supplies communicate directly through RS232 type ports to provide all data and information from that power supply, which are done in real time. The use of MKS cluster gauges simplify the wiring and allow greater interlocking of sensitive gauge types . KDF’s extensive in-house expertise of software allows us to integrate all our gained experience of process and machine tool operation into a seamless operating system for the customer.

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KDF RELEASE 2007

After years of testing and evaluation, KDF has introduced the new i series controller, replacing the Brooks Automation Controller with new technology. This control system has been designed to be retofitable, allowing an easy upgrade path for previous KDF models (“T “, “GT”, and “NT”). Although some older systems may require additional hardware upgrades to maintain compatibility with current and future system enhancements, doing so will bring these field proven systems to an even higher level of performance and reliability.

This i series platform is based on a distributed Rockwell Automation Control System utilizing Devicenet and Ethernet I/P fieldbus technologies. These interfaces dramatically reduce the need for point to point wiring allowing for greatly increased reliability, easier troubleshooting, and a higher level of system integration reducing system part count (and spare part inventory). Easy system upgrade is accomplished with the use of flash memory.

Windows XP Pro^™ industrialized computer using the latest Intel Pentium Processor^™ technology, Large Hard disk drive (80 mb or better) for local recipe and data log storage, and an advanced graphics controller.

Real-time GUI Environment, coupled with a SAW Touch screen and 19″ LCD monitor.Surface Acoustic Wave touch screen technology guarantees virtually 100% optical transmission, and is not affected by the use of gloves.

Context sensitive, multi-step (up to 200 steps / recipe) recipe manager is compatible with Microsoft Access^™ database. Recipe storage is limited only by hard drive space (additional recipes can be stored on network drive). Any lost data that you may experience concerning your hard drive can be restored through places like DriveSavers, to ensure that you can make the most out of this new technology.

Fully integrated package for real-time data display, data logging is fully compatible with Excel^™, Lotus^™ and other windows applications, report generation, remote interface and printing. Secure remote diagnostics and software support available over the Internet (high speed connection required) with local firewall and anti-virus protection.

OPC server interface allows SECS/GEM communication package (optional) and other applications to connect to a common database of machine I/O and system level data such as Datalogs, recipes, RGA data, etc.

Maintenance test suite with full diagnostic and manual process control capability, along with a host of other macro sub routine programs.

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KDF RELEASE 2006

Customers Buy Batch Sputtering Systems for Digital X-ray Technology, Pacemaker Production

KDF today announced that leading original health equipment manufacturers continue to purchase and accept the Company’s 700 and 900 series batch sputtering systems for use in the manufacture of essential digital radiography diagnostic equipment and pacemaker components. The systems are installed and currently in qualification phase.

“The procurement of our tools by two of the world’s largest health equipment OEMs further solidifies our strong relationship with these companies and confirms that our sophisticated technology platforms meet meticulous standards for producing advanced medical devices,” said Todd Plaisted, KDF director of Marketing. “We are proud to be part of a process that advances the quality of health care and treatment for thousands of people around the globe.”

One of the leading health OEMs first purchased two KDF 744NT systems in April 2005. Today, all three tools are being used to manufacture digital X-ray diagnostic equipment that will enhance the diagnostic process for breast cancer doctors and patients, as well as expand medical applications such as fixed and remote diagnosis. The digital approach to diagnosis presents patients with matchless image quality, while also providing instantaneous re-shoots that eliminate the need to schedule additional appointments. The firm has brought in other changes in the past to speed processes, such as ccm software and other communication tools.

“The KDF 744NT provides physical vapor deposition sputtering, or state-of-the-art coating, of the X-ray screens in a high-throughput environment,” Plaisted said. “Additional features like the vacuum loadlock, multiple substrate capacity and two processing pallets continue to enhance the speed and quality of manufacturing.” The 744NT is a large area, four-target, batch-sputtering system, designed for processing high-density interconnect, 200 mm semiconductor wafers, flat panel displays and other applications. The 744NT is equipped with a high-vacuum loadlock configured with a substrate pre-heat that enables the tool’s high throughput. The tool’s pallet area and compact footprint uses less than one-third the floorspace of competing equipment.

Additionally, KDF’s 954NTX in-line sputtering system is being used for the manufacture of pacemaker components by another leading OEM. This marks the second 900NTX product purchased in less than two years by this company, which selected KDF’s tool for its ability to create solid coatings and its Inset style cathodes feature. This cathode design provides extended lifetime and high utilization for thick coatings used on critical pacemaker components. The 954NTX comes equipped with sputter-down capability and easy substrate loading suited for medical applications which produce uniform films with an exacting, but repeatable, high-throughput process.

The customer also recently bought the 954ix tool, a new generation i system from KDF. This 954ix product has integrated the Company’s newly patented Linear Moving Magnetron^™ (LMM) full-face erosion sputter cathode in the Magterial^™. This version has one of the highest material efficiencies for magnetic substances in the industry, providing increased source material lifetime and high performance for design and utilization.

“There is no margin for error in pacemaker manufacturing applications and KDF’s superior coating technology meets these standards,” Plaisted said. “We look forward to continuing our commitment to meet our customers’ needs as medical technology advancements improve and change.”

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KDF RELEASE 2006

KDF announces its role in the opening of a $165 million state-of-the-art digital X-Ray mammography production facility in New York state. The facility is headlined by by one of the world’s largest health equipment OEMs and will manufacture and transfer its innovative technology to healthcare facilities worldwide. KDF, a producer of batch-sputtering systems used in the manufacture of a variety of R&D and production formats, provided two 844i systems that support essential digital diagnostic radiography equipment.

KDF’s 844i systems are used in the development of digital X-ray diagnostic equipment. The radiographic equipment enhances the diagnostic process for breast cancer doctors and patients by providing digital images at a matchless quality, while also providing instantaneous re-shoots, thereby eliminating the need to schedule additional appointments.

The 844i is a large area, four-target, batch-sputtering system, designed for processing high-density interconnect, 300 mm semiconductor wafers, solar photovoltaic cells and flat panel displays. The 844i accommodates glass sizes up to Gen 3. Because of its size, the 844i system is an extremely cost-effective way to run batches of small to large wafers or substrates. The 844i is equipped with a high-vacuum load lock configured with a substrate pre-heat that enables the tool’s high throughput.

The 844i offers a pallet area of 26.5 x 30 inches with a compact footprint that uses less than one-third the floor space of competing equipment. The tool can hold four 300mm wafers or multiple smaller wafers and features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and backsides of the wafers.

The system can also be enhanced with scan velocity profiling. The 844i system meets the Semiconductor S2-0200 safety specification as part of the standard system package, a CE option for the European community is available. Pulsed DC sputtering up to 20kw via Advanced Energy Pinnacle Plus is also available. The 844i system has remote PC accessibility allowing for software upgrades and file repair via an Internet/Ethernet connection.

The use of KDF’s 844i systems by one of the world’s largest health equipment manufacturers is a comment on the sophistication of the technology and its capabilities when incorporated into advanced medical devices, such as digital X-ray mammography equipment.

Todd Plaisted, KDF Director of Marketing, comments, “The KDF 844i systems were modified to larger 26.5″ x 30″ pallets to meet new requirements. The system is newly designed to accommodate 90 degree thru-wall clean room interface and roll-around system control cart, saving clean room space. In addition, the systems have new, cost effective pallet-assist loading tools as an alternative to an expensive roboticized system.

Says Plaisted, “It is with great pride that we know our efforts developing quality technology, combined with those of the manufacturer, will result in the care and treatment of an untold number of people around the globe.”

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KDF RELEASE 2006

Multi-Order Includes 654i System, Expands Companies’ Partnership

KDF today announced that Ovonyx, Inc., a Rochester Hills, Mich.-based company specializing in the commercialization of proprietary phase-change semiconductor memory technology, has purchased the new KDF Ci (cluster intelligence) cluster tool for use in support of commercialization programs for its technology. The product, which is expected to ship in the third quarter 2007, marks a first-time cluster tool win for KDF and the company’s entry into a new market.

Non-volatile phase-change memory boasts rapid write and erase speeds, elevated cycling endurance, and superior scaling performance as the industry moves toward newer generations of nonvolatile solid state memory. Ovonyx will continue its programs for Ovonyx Unified Memory (OUM) performance enhancement and cost reduction on KDF’s innovative cluster tool. The customized cluster tool with a hydrogen cleaning station will allow Ovonyx and its customers to develop manufacturing processes in a preproduction environment using a cluster tool that emulates their fab environments.

“KDF has been a very reliable supplier, and through our collaboration with KDF, we will have in hand a cluster tool ideally suited for phase change and associated materials deposition,” said Ed Spall, vice president, Ovonyx. “Our current and future partners will benefit from the new KDF Ci cluster tool’s unique capabilities as we jointly pursue commercialization of OUM phase change technology.”

Ovonyx current licensees include Samsung, BAE Systems, Intel Corp., STMicroelectronics, Nanochip, Inc. and Elpida Memory, Inc. Furthermore, Ovonyx recently bought KDF’s 654i series batch tool to complement the other KDF system it’s currently utilizing, the 643GT in-line, side sputtering batch system.

“Our long-term relationship with Ovonyx signifies the customer’s level of assurance in our technology expertise and manufacturing know-how,” said Kurt Flechsig, president, KDF. “With this versatile process platform, KDF will provide Ovonyx with a superior and unique level of customization for this cluster tool as well as lower cost of ownership.”

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KDF RELEASE 2005

KDF today announced that Beijing Microelectronics Institute (BMI), a leading microelectronics manufacturer in China, has purchased the company’s new 904i in-line sputtering system for use in production as well as research and development. The product, which will ship to BMI in October, helps extend KDF’s market share penetration in the fast-growing Chinese market.

According to researcher IDC, China became the world’s third-largest semiconductor-consuming country in 2004, with revenue from the region surpassing $26 billion. IDC predicts China will grow twice as fast as the entire semiconductor industry over the next five years. Beijing-based BMI chose the 904i system based on its versatility, reliability and ease-of-use.

“As a first-time customer, BMI’s decision to use KDF’s tool speaks volumes about their confidence in our technology leadership. The customizable 904i system also supports a range of BMI’s microelectronics manufacturing needs,” said Kurt Flechsig, KDF president. “Furthermore, the move further solidifies our presence in China as customers continue to ramp up their assembly facilities in that country.”

KDF’s 900 Series of products include dual load lock, in-line, sputter down, batch systems constructed with an optional high vacuum load lock and three or four target positions. Additionally, the 900 series systems can be used in numerous applications where distinctive size, shape, or substrate height is a priority. The 904i is in the preproduction phase and is expected to be available to customers in Q4 2005.

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KDF RELEASE 2005

KDF today announced that Taiwan-based FuPo Electronics Corporation, a turnkey service provider for liquid crystal display (LCD) integrated circuit (IC) manufacturers, purchased KDF’s 844NT batch sputtering system for use in high-volume wafer bumping production. FuPo’s purchase signals a growing acceptance of KDF’s sputtering systems in Taiwan.

Wafer bumping is an important stage during assembly that generates interconnects between the chip and substrate, and KDF’s systems provide the maximum speed and functionality for this process.
“We chose the KDF 844NT for its proven high throughput and performance, as well as its ability to modify wafer size without production delays,” said N.T. Huang, President of FuPo Electronics. “This enables us to better meet the changing requirements of the merchant wafer bumping foundry environment.”

KDF’s 844NT tool will be delivered to FuPo Electronics ready to accept a robotic-load process called OPUS which allows the customer to upgrade easily to a complete cassette-to-cassette operation. The combination of the 844NT and OPUS creates the fastest wafer-size changeover time in the industry using just software and quick-check calibration.

“KDF is very pleased that our new customer, FuPo Electronics, will use the 844NT during the essential wafer bumping step,” said Kurt Flechsig, KDF president. “The grouping of our OPUS robotic technology and the 844NT’s superior execution will provide FuPo Electronics with excellent results.”

The 844NT is designed to process high-density interconnect, 300 mm semiconductor wafers and flat panel displays through its four-target, batch-sputtering system. The 844NT offers a pallet area of 26.5 x 26.5 inches with a compact footprint that uses less than one-third the floor space of competing equipment. Due to its size the 844NT system is an extremely cost effective way of running batches of small to large wafers or substrates.

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KDF RELEASE 2005

KDF today announced that the Flexible Display Center (FDC) at Arizona State University has purchased a KDF 744NT batch sputtering system for use in flexible display research. The 744NT, installed in May, was among the first physical vapor deposition systems installed and optimized for use in advanced display technology research at the FDC.

In 2004, the U.S. Army awarded Arizona State a $43.7 million, five-year cooperative agreement to establish the FDC for the development of small, lightweight, portable display/information devices that are small enough to roll up and carry or wear. These devices will improve communication between soldiers, allowing them to share information about troop positions, movements, weather and other important variables. New developments are expected to yield new commercial applications for these devices.

“Acquisition of the KDF tool increases FDC GEN II capabilities tremendously with exceptional value. KDF offers exceptional engineering support and customer service,” said Shawn O’Rourke, Flexible Display Center Director of Operations.

“KDF is very pleased that the 744NT batch sputtering system will be playing a key role in the development of this important new technology,” said Kurt Flechsig, KDF president. “The research done at the Flexible Research Center has the potential to yield great benefits, not only for military use, but for consumer electronics and medical device applications as well.”

The 744NT is a large area, four-target, batch sputtering system, designed for processing high-density interconnect, 200 mm semiconductor wafers, flat panel displays and other applications. The 744NT is equipped with a high-vacuum loadlock configured with a substrate pre-heat that enables the tool’s high throughput. The 744NT offers a pallet area of 19 x 19 inches with a compact footprint that uses less than one-third the floorspace of competing equipment. The tool can hold four 200 mm wafers or multiple smaller wafers and features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and back sides of wafers.

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KDF RELEASE 2005

KDF today announced that a leading original health equipment manufacturer has purchased and accepted two KDF 744NT batch sputtering systems. The tools are fully qualified and are currently in production.

The customer will utilize the KDF 744NT sputtering systems for radiography research to advance digital x-ray technology into digital mammography and digital radiography. Advancing x-ray technology to a large area, full-field digital platform will help improve the diagnostic process for breast cancer, and will improve other medical initiatives like stationery and remote diagnosis. Breast cancer diagnosis using a digital platform provides unsurpassed image quality and options for instantaneous re-shoots and eliminates the need to schedule additional appointments.

Over the past year, KDF has helped the customer qualify the KDF 744NT for this production application by providing on-site service including process assistance and software enhancements.

“It is very gratifying for KDF to announce the sale of two KDF 744NT batch sputtering systems to one of the world’s largest leading original health equipment manufacturers,” said Kurt Flechsig, KDF president. “This sale is of particular note because we have been able to extend our tool into a new application that we hope will help to improve the quality of health care and treatment throughout the world.”

The 744NT is a large area, four-target, batch sputtering system, designed for processing high-density interconnect, 200 mm semiconductor wafers, flat panel displays and other applications. The 744NT is equipped with a high-vacuum loadlock configured with a substrate pre-heat that enables the tool’s high throughput. The 744NT offers a pallet area of 19 x 19 inches with a compact footprint that uses less than one-third the floorspace of competing equipment. The tool can hold four 200 mm wafers or multiple smaller wafers and features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and back sides of wafers.

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KDF RELEASE 2004

KDF today announced that TFR Technologies, Inc. has placed an order for a KDF 954NTX in-line sputtering system with an enhanced rotating planetary pallet (ERPP) option. This is the first order of a KDF system ever placed by TFR Technologies.

TFR selected the KDF tool after an extensive evaluation of physical vapor deposition (PVD) solutions, which concluded that the KDF 954NTX with an ERPP option provided the best combination of performance, yield and throughput to suit the company’s needs for miniature high performance frequency control device manufacturing.

“KDF is very pleased to announce that TFR Technologies has joined our global customer base,” said Kurt Flechsig, KDF president. “By choosing the KDF 954NTX, TFR Technologies validates the superiority of our technology for uniform, stable deposition of thin films in resonator manufacturing.”

The expansion of thin film device capabilities is driving the need for better uniformity and higher repeatability for thin film deposition. Using KDF’s proprietary ERPP in conjunction with the standard linear scanning mode on the KDF 954NTX provides excellent uniformity and repeatability, enabling the production of complex multi-layer dielectric coats such as mirrors and filters in a highly repeatable and uniform manner.

“TFR is looking forward to the KDF sputtering unit enabling higher volume production by increasing throughput across a wide range of depositions,” said Shane Leiphart, Senior Process Engineer, TFR Technologies, Inc. “It is expected that this tool will meet the company’s requirement for overall thin film performance well into the future.”

The 954NTX is a four-target in-line sputtering tool for front- and backside deposition. The tool, which is optimized for compound semiconductor processing applications, features a low cost of ownership, and enables high utilization and throughput. Like all KDF 900 Series tools, the 954NTX offers users the capability of a production tool with the process flexibility typically found in an R&D system. The 900 Series exceeds requirements for deposition of thin films in application critical devices and other applications requiring the absolute in uniformity.

The KDF 954NTX is one of KDF’s popular X Series^™ products. It features the latest KDF cathode designs, which have been lengthened to 17 inches, offering improved uniformity over the entire pallet. X Series cathodes are also available in both Planar and Inset^™ cathode form.

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KDF RELEASE 2004

KDF today announced that the company has received an order for a KDF 954NT in-line sputtering system from the Sichuan Institute of Piezoelectric & Acousto-optic Technology (SIPAT), a leading research and development facility in China. The system will be used in the production of surface acoustic wave (SAW) devices, which are commonly used in the growing wireless and mobile communications market.

SIPAT is a repeat customer and has been using a KDF 943 Series tool for several years. The institute chose the 954NT based on the system’s throughput, versatility, reliability and established history as a production-worthy tool. SIPAT was particularly interested in the 954NT’s uniform, stable deposition of thin films and ability to deposit on various substrate sizes.

“It is always gratifying when a customer returns to buy a second tool from KDF,” said Kurt Flechsig, KDF president. “In doing so, the Sichuan Institute of Piezoelectric & Acousto-optic Technology has demonstrated satisfaction with our technology, service and support. It is also important to note that SIPAT’s purchase represents recognition of the value that the KDF 954NT brings to the production of SAWs and other compound semiconductors. ”

SAW devices are used to control and process electrical signals. Increasingly, SAWs are making their way into in mass market consumer electronics. The proliferation of wireless products and new technologies coming online for wireless data have lead to a dramatic spike in the demand for SAWs. The worldwide market for SAW devices is already worth more than $1 billion, and is projected to continue growing.

The 954NT is a four-target batch sputtering tool for front- and backside deposition. The tool, which is optimized for processing GaAs and other compound semiconductor applications, features a low cost of ownership, and enables high utilization and throughput. Like all KDF 900 Series tools, the 954NT offers users the capability of a production tool with the process flexibility typically found in an R&D system. The 900 Series exceeds requirements for deposition of thin films in application critical devices and other applications requiring the absolute in uniformity.

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KDF RELEASE 2004

KDF today named Ammar Derraa, an award-winning scientist and author of more than 50 U.S. patents and disclosures, to the position of director of technology. Dr. Derraa succeeds Su Gupta, who left KDF late last year to pursue a university teaching career. Dr. Derraa will report directly to KDF CEO Kurt Flechsig.

“Dr. Derraa brings to KDF impeccable credentials and an outstanding record of technological achievement. His technical expertise will drive the creation of competitive solutions at KDF for years to come,” Mr. Flechsig said. “We are honored to welcome him aboard. We are also gratified that KDF was able to replace our departed director of technology in such a timely manner, which will ensure that we do not lose momentum as we continue along our product development roadmap.”

As director of technology, Dr. Derraa assumes responsibility for all KDF technology, with a particular emphasis on research and development. This includes overseeing the development of new KDF technology, including advancements upon the company’s series of sputtering tools, and service and customization of pre-owned MRC systems.

“It is with great pleasure that I assume the duties of director of technology at KDF,” Dr. Derraa said. “With nearly 20 years of history in the semiconductor industry and a reputation for innovative technology, KDF is an exciting company to be part of. I look forward to participating in the next phase of the company’s development.”

Prior to joining KDF, Dr. Derraa worked for NanoOpto Corp., where he led a nanotechnology project developing new nano-devices with dimensions smaller than the wavelength of light. Previously he was at Micron Technology, where he worked on many projects focused on the development of new technologies, including flat panel displays and various computer memory devices. Dr. Derraa has a rich background in academic and commercial research. He holds a PhD in physics from the University of Toronto, an MSc in physics from Queen’s University, and a BSc in physics from the University of Constantine. His achievements include the Reginald Blyth Award (1994-94), the E. Burton Fellowship (1990-93), and the John Nadeau Award (1990). He has filed 54 patents (36 awarded, 18 pending) and has more than a dozen technical and conference publications to his credit.

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KDF RELEASE 2003

Aerospace business will use tool for commercial satellite applications and guidance systems
KDF today announced that Honeywell International (NYSE: HON) has placed a follow-on order for a 943NT in-line sputtering system. This follow-on order provides production-proven validation for KDF’s 943NT system in aerospace applications, and highlights KDF’s ability to respond to commercial and government contractors’ manufacturing needs with extensive customer support.

A KDF customer since 2001, Honeywell installed its first 943NT system at its Minneapolis facility in June 2001. The current order for Honeywell’s second 943NT system was installed at the same facility in January 2003 and will be used to produce ring laser gyroscopes for Honeywell’s aerospace business.

“Over the past year and a half, Honeywell has developed an established process with KDF’s 943NT tool,” said Kurt Flechsig, president of KDF. “We are proud to renew and strengthen our relationship with Honeywell and help them to further realize success.”

With sputter down capability and easy substrate loading, the 943NT is ideally suited for ring laser gyroscope production because it delivers a repeatable, high-throughput process for producing uniform films. Popular for their pure metal target deposition and convenient wafer to pallet loading abilities, the 900 Series systems can be configured with an optional high vacuum loadlock and three or four target positions.

High-rate DC magnetron sputtering and single- or multiple-pass deposition features support the versatility and high-throughput of these production systems. The 900 series systems can be used in the semiconductor, telecommunications, aerospace and a growing list of other technology markets because they can be tailored to meet specific processing needs.

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KDF RELEASE 2003

943NTX Sputtering System Meets Medical Device Production Standards

KDF today announced that Medtronic (NYSE: MDT) has selected its 943NTX in-line sputtering system for use in manufacturing pacemaker components. The order verifies that KDF’s technology platforms meet rigorous standards for producing advanced medical devices. The KDF system began installation at Medtronic’s Minneapolis facility in December 2002.

Medtronic selected the 943NTX for its ability to create impervious coatings, a crucial aspect of medical manufacturing since each device is expected to perform flawlessly. The KDF 943NTX features InsetÔ style cathodes, a cathode design that provides long lifetime and high utilization for thick coatings, like those that are used to protect critical pacemaker components. There is no margin for error in pacemaker manufacturing applications and KDF’s superior coating technology meets these standards.

“As an existing customer of KDF, Medtronic is familiar with the strength and capabilities of our 900 Series sputtering systems. The 943NTX provides the process integrity required for producing high stakes medical devices like pacemakers,” said Kurt Flechsig, president of KDF. “KDF already maintains a presence in the medical devices market and this order will serve to increase our market penetration for this industry.”

KDF offers advanced and reliable batch in-line sputtering systems at the industry’s lowest cost of ownership. These systems are used around the world in the semiconductor, telecommunications, aerospace and medical technology markets, each tailored to meet specific processing needs.

For the Medtronic process KDF configured the 900 Series system with an InsetÔ style cathode which supports long-term use in the production of durable and impenetrable coatings. With sputter down capability and easy substrate loading, the 943NTX is ideally suited for medical applications which produce uniform films with an exacting, but repeatable, high-throughput process.

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KDF RELEASE 2002

High rate processes for deposition of dielectric films have been developed using DC reactive sputtering on scanning batch tools. A typical high rate process for the deposition of silicon dioxide films from a conductively doped silicon target would allow the formation of nearly one micron of SiO2 in fifteen minutes, as compared with nearly five hours when RF magnetron sputtered from a quartz target. This can represent a very large increase in throughput for the deposition of complex multilayer dielectric waveguides, mirrors or filters.

(Ref: Photonics Spectra, pp. 30-31, November 2002).

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KDF RELEASE 2002

KDF today announced that Plasmion Corporation has ordered a custom engineered KDF 744NT batch sputtering system for installation at Hanwha L&C’s Korean facility. The KDF 744NT was ordered as the result of a strategic alliance between Plasmion and Hanwha L&C wherein, Hanwha licensed Plasmion’s Negative Sputter Ion Beam (NSIB) technology and ordered a production system from Plasmion. After critical review, Plasmion and Hanwha selected KDF’s 744NT tool retrofitted with Plasmion’s Negative Sputter Ion Beam. By developing a tailored solution quickly, KDF demonstrated its ability to meet the needs of partners and customers based on its core competencies. The production system is scheduled for installation at Hanwha L&C in December 2002.

Hanwha will use the enhanced 744NT system to manufacture and process ITO coated glass for use in the production of Organic Light Emitting Displays (OLED). OLED is a new type of flat panel display that is currently used in automotive audio and cellular telephone applications. Hanwha plastics manufactured with the new production system will be able to replace the glass used to manufacture OLEDs, providing the display industry with a more cost-efficient way of manufacturing displays for miniature and mobile applications.

“We selected the KDF 700 Series production platform because this batch sputtering system can be easily upgraded to utilize our ITO coating process,” commented James A. Ionson, CEO, Plasmion Corporation. Mr. Ionson further disclosed that “Our strategic alliance with Hanwha is the first of many production partnerships we plan to form with end-users of our process technology, and we will be actively working with major equipment manufacturers such as KDF to embed our cost-effective process within their systems.”

“This is a reliable and advanced solution that will meet our requirements for ITO coated glass production,” said Jin Ki Paik, vice president, business development, Hanwha. “Uniting Plasmion’s Negative Sputter Ion Beam technology with KDF’s production-proven sputter system provides us with the best of both worlds.”

“This design win demonstrates how flexible and customer-focused we are. In this instance our systems will be customized to meet the customer’s specific needs and cover a wide variety of process requirements. Partnering with a leading-edge technology provider such as Plasmion Corporation gave us the opportunity to participate in this design win for Hanwha, the top petrochemical company in Korea,” said Kurt Flechsig, president of KDF.

The KDF 744NT is a large area, four-target, batch sputtering system, designed for processing high-density interconnect, 200mm semiconductor wafers and flat panel displays. The Plasmion enhancement of the KDF 744NT includes an NSIB that provides excellent ITO coatings on polycarbonate substrates at very low temperatures. Plasmion’s technology creates solid ion beams during the coating process to achieve an atomically smooth surface.

The 744NT is equipped with a high-vacuum loadlock configured with a substrate pre-heat that enables the tool’s high throughput. The 744NT offers a pallet area of 19 x 19 inches with a compact footprint that uses less than one-third the floorspace of competing equipment. The tool can hold four 200mm wafers or multiple smaller wafers and features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and back sides of wafers.

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KDF RELEASE 2002

KDF today announced that the Electronic Systems business of Raytheon Company (NYSE: RTN) has ordered a 943NT in-line sputtering tool for use in its El Segundo, California facility. Electronic Systems, which is a world leader in the development and deployment of key defense programs, will use the 943NT in the manufacture of its advanced technology products. This order from Electronic Systems marks the first new tool that Raytheon has purchased from KDF.

Raytheon has been a KDF customer since 1988, and has previously purchased remanufactured equipment from KDF and batch products from MRC, which KDF acquired from Tokyo Electron Limited (TEL) in 1998.

“In order to maintain our position as a global leader in advanced defense programs, it is imperative that our processing equipment provides us with the strongest technology platform possible. We already have an established process with the installed MRC 943 tool, and this new KDF in-line sputtering system will allow us to modernize the equipment without sacrificing process, reliability or cost effectiveness,” said Howard Ito, Principal Engineer of Raytheon’s Electronic Systems business.

Electronic Systems will primarily use the 943NT for thin film hybrid circuitry. This circuitry is subsequently utilized by the company in the development and production of a number of defense programs, including radars and sensors for ground-based, airborne, and space-based systems.

“As Electronic Systems moves to replace its current equipment, our 943NT provided the most seamless and efficient platform for this transition. Electronic Systems is already familiar with our technology, and the 943NT will continue to enable it to produce the most advanced circuits for its defense programs,” said Kurt Flechsig, president of KDF.

The 943NT is part of KDF’s 900 Series of physical vapor deposition (PVD) systems, all of which feature in-line sputter-down capabilities. Popular for their pure metal target deposition and convenient wafer-to-pallet loading abilities, the 900 Series tools can be configured with an optional high vacuum loadlock and three or four target positions. High-rate DC magnetron sputtering and single- or multiple-pass deposition features support the versatility and high-throughput of this production equipment. Cathode and substrate orientation are horizontal, allowing gentle substrate fixturing for users.

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KDF RELEASE 2002

KDF today announced that it has successfully completed installation of multiple in-line sputtering systems at two Taiwanese foundries. Micro Electro Magnetical Technologies Corporation (MEMT), based in Chunan, Miaoli, Taiwan, purchased a 603NT tool for critical film applications. Suntek Compound Semiconductor Company, based in Hsinchu Shien, Taiwan, ordered a 943NTX system with a planetary pallet for GaAs wafer production. The orders mark the first business between KDF and both companies.

“These two sales demonstrate the market penetration that KDF continues to gain in Taiwan. This increased interest from Taiwanese companies is based on the performance and cost-effectiveness of our tools,” said Kurt Flechsig, president of KDF. “We are pleased to welcome MEMT and Suntek as our two newest customers. KDF is committed to gaining a strong foothold in Taiwan, and we believe that these installations reflect our growth in this region.”

KDF is well positioned to capitalize on the expanding telecommunications and compound semiconductor market segments in Taiwan because of the breadth of its experience in these markets in the U.S. and Europe. As Taiwan’s gallium arsenide (GaAs) market continues to grow, KDF is focused on penetrating this market in its early stages.

“After evaluating the performance of other equipment, we found that the KDF tool surpassed the competition in terms of uniformity, which is critical in our discrete device production. Further, the cost of ownership advantages and customer support capabilities were key drivers in this purchasing decision,” said Allen Yang, assistant vice president of sales & marketing at MEMT.

According to the Semiconductor Industry Association (SIA), the worldwide discrete market is forecasted to grow in 2003 to $14 billion, a 16 percent increase from 2002. The discrete semiconductor market is predicted to increase another 15 percent in 2004, to total $16 billion.

The 943NTX is part of KDF’s 900 Series of PVD systems, all of which feature in-line sputter-down capabilities. The 943NTX offers the option of extended cathodes and excellent uniformity. Popular for their pure metal target deposition and convenient wafer-to-pallet loading abilities, the 900 Series systems can be configured with an optional high vacuum load-lock and three or four target positions. High-rate DC magnetron sputtering and single- or multiple-pass deposition features support the versatility and high throughput of these production systems. Cathode and substrate orientation are horizontal, allowing gentle substrate fixturing for users.

The 603NT is a vertical, side-sputtering tool that is typically used for sensitive applications requiring target material that produces unusually high particulate contamination. The 600 Series are dual load lock, in-line, vertical batch sputtering systems. They are configured with an optional high vacuum load lock and three or four target positions and have a 13 x 13 inch pallet size.

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ORIGINAL ARTICLE DATE: APRIL 22, 2002

By Kurt Flechsig

Electronic News – A decade ago, the development of cluster tools in the IC manufacturing industry seemed to herald the end of batch processing systems. Single-wafer, multichamber tools were the wave of the future-they promised much in terms of throughput, uniformity, process control and unmanned automation. In contrast, the multiwafer, single-chamber batch tool was the thing we were moving away from, so much like VCRs and tape cassettes today.

In high-tech manufacturing, we’re naturally drawn to the cutting edge, to the promise of better processes and higher return on investment. For example, many industries use tools like this parylene coating machine from Para Tech Coating to help streamline processes. That’s what pushed the cluster movement more than 10 years ago, and plasma vapor deposition (PVD) processes were not immune to the trend. Chipmakers needed serious sputtering process improvements to keep up with Moore’s Law, and, to be truthful, the existing batch tools weren’t doing the job.

Batch processing may be a reason as to why companies opt to invest in systems like six sigma certifications, as a way to streamline automation processes, be more cost-effective and time-efficient within an organization.

Since then, batch suppliers have developed a new generation of tools that meet the same processing requirements that drove IC manufacturers to the cluster tool format but with much lower cost. This is how providers such as Octopart manage to get such a wide variety of stock at affordable prices for the industry to make use of. Unfortunately, there still exists a mindset in and outside of the industry that batch equals lagging-edge technology. This misperception can lead manufacturers to invest more in their sputtering processes than is necessary, depending on the application.

For example, a purchasing manager for a telecommunications device customer was at a crossroads. His company’s sputtering technology had moved to cluster PVD, in line with the industry trend, but he now juggled a shrinking budget and a continuing need to produce photonic components. Batch systems could meet his performance specs in terms of film uniformity, throughput, process control and automation as well as SEMI and European CE standards governing tool uptime, reliability, and environmental health and safety, and do so on a platform that was simple to use and maintain.

There were differences in two other critical areas: cost and flexibility. The manufacturer’s cluster tools required an up-front investment of about four times what a comparable batch system would cost; and because batch systems offer simpler design and operation, the cluster tool cost of ownership and tool maintenance costs were also much higher. On the flexibility front, the cluster format limited the company’s ability to move between substrate sizes, and its full automation didn’t allow for manual control of equipment when needed.

Batch systems can run a wide variety of substrate sizes and materials, from fractions of an inch up to 26 inches and larger, square or round, tall or short-and substrate sizes can be changed from run-to-run, if needed. The bottom line: In this case, cluster PVD was overkill. It was like using a backhoe when a shovel would do.

Three trends are shaping the answers to today’s batch-or-cluster PVD question. First, there have been major improvements in sputtering process control through better cathode designs and supporting components, such as residual gas analyzers, power supplies and software. This has resulted in batch tools that offer the process stability, control, uniformity and throughput for many advanced device applications, such as titanium oxide/silicon oxide electric thin-film mirror stacks in the optoelectronics industry.

Second, customer demand for process expertise on the part of the PVD supplier has led to early customer partnerships and the development of customized software and hardware for advanced applications. Batch suppliers, just like other advanced tool suppliers, are now more than ever being asked to prove out customer processes even before the sale of the system.

Third, an increasing variety of new and growing end-markets has led to demand for a flexible, cost-efficient processing platform such as the batch format. A broad customer base illustrates this trend. Potential markets span not just two or three, but 20 to 30 markets, including semiconductors, light-emitting diodes, thin-film resistors and capacitors, medical devices, ring laser gyros, flat panel displays and microelectromechanical systems.

This is not to diminish the value of cluster tools. There’s no doubt that certain applications, such as high aspect ratio via filling in chip manufacturing, will continue to require the complete process isolation offered by cluster tools. But the question between cluster and batch should arise for those many applications that don’t require such a stringent environment.

Author Information: Kurt Flechsig is president of KDF Inc.

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