• Home
  • Company
    • About KDF
    • Buying from KDF
    • Events
    • Product literature
    • KDF Clientele
    • Worldwide Locations
    • Careers
  • Products
    • PVD and Sputtering
    • Sputtering Products Overview
      • KDF Sputtering Technology
      • Sputtering Products Overview
      • 600i Series Sputtering System
      • 744i Sputtering System
      • 844i Sputtering System
      • 900i Series Sputtering System
      • 974i Series Sputtering System
      • Opus Robotic C2C Loading System
      • Pre-Owned Products
      • Ci Cluster Tool
    • Thin Film Services & Support
      • Original Batch OEM
      • Repair Services
      • Training
      • Thin Film Services
      • Thin-Film Technology
    • Original OEM Parts
      • KDF Upgrade Kits
      • KDF Spare Parts
      • Sputtering Cathodes
      • Sputtering Targets
      • Backing Plates
      • Retrofit Kits
      • PLC Retrofit Kit
    • Process Materials
      • Sputtering Targets
      • Backing Plates
      • Bonding
  • News
  • Contact
  • Skip to primary navigation
  • Skip to main content
(201) 784-5005
(201) 784-5005 | sales@kdf.com
REQUEST A QUOTE
KDF
  • Home
  • Company
    • About KDF
    • Buying from KDF
    • Events
    • Product Literature
    • KDF Clientele
    • Worldwide Locations
    • Careers
  • Products
    • custom product dropdown
      PVD and Sputtering
      KDF In-Line Solutions
      KDF Sputtering Technology
      Sputtering Products Overview
      600i Series Sputtering System
      744i Sputtering System
      844i Sputtering System
      900i Series Sputtering System
      974i Series Sputtering System
      Opus Robotic C2C Loading System
      Pre-Owned Products
      Ci Cluster Tool
      Thin Film Services & Support
      Original Batch OEM
      Repair Services
      Training
      Thin Film Services
      Thin-Film Technology
      Original OEM Parts
      KDF Upgrade Kits
      KDF Spare Parts
      Sputtering Cathodes
      Sputtering Targets
      Backing Plates
      PLC-Retrofit
      Retrofit Kits
      Process Materials
      Sputtering Targets
      Backing Plates
      Bonding
  • News
  • Contact
  • Show Search
Hide Search

Kdf sputtering solutions

KDF Sputtering Technology

ABOUT

KDF Sputtering Solutions

KDF Sputtering Technology covers all sputtering applications ranging from hard coating and decoration to state-of-the microchips and medical applications.

Linearly Moving Magnetron (LMM™)

The LMM is a KDF proprietary design to achieve the challenging task of target full-face erosion. With the LMM technology, an oscillating magnet behind the target sweeps the plasma across the target to achieve a uniform full-face target erosion and high target utilization. The LMM cathode is by design a superior technology in terms of process stability and repeatability from run-to-run as well as over the target life-time. This, in turn, translates to higher productivity and cost savings for the customer.

Planetary Rotating Pallet

The planetary rotating pallet ERPP™ (enhanced rotating planetary pallet) is a KDF design to achieve exceptionally high uniformity in the sub 1%, as well as tight repeatability.
(Ref: Vacuum Technology and Coating, December 2002).

Related Article:
Highly uniform dielectric films using a combined linear scanning, velocity profiling and planetary rotating motion

This option can be used in all sputtering modes to achieve quality PVD thin films:

  • DC Magnetron Sputtering
  • RF Sputtering
  • Pulsed DC Sputtering
  • Reactive sputtering
  • HIPIMS Sputtering

Down and Side sputtering

KDF offers both Down and Side sputtering systems in different sizes and configuration with deposition area ranging from 12 x 12 inches to 26 x 30 inches area. Both configurations yield high quality PVD thin films in all sputtering modes:

  • DC Magnetron Sputtering
  • RF Sputtering
  • Pulsed DC Sputtering
  • Reactive sputtering
  • HIPIMS Sputtering

Metal and Dielectric sputtering

KDF offers metal and dielectric sputtering for various substrate type and sizes, as well as Transparent Conductive Oxides (TCO’s) utilizing materials like ITO and ZnO.

Dielectric Deposition at High-Metallic Rates

High rate processes for deposition of dielectric films have been developed using Pulsed DC reactive sputtering on scanning batch tools. A typical high rate process for the deposition of silicon dioxide films from a conductively doped silicon target would allow the formation of nearly one micron of SiO2 in fifteen minutes, as compared with nearly five hours when RF magnetron sputtered from a quartz target.
(Ref: Photonics Spectra, pp. 30-31, November 2002)

High-vacuum Loadlock and a pre-heat

All KDF systems can be equipped with a high-vacuum load lock and a pre-heat option to pre-treat the substrates prior to entering the deposition chamber.

Sign up for the latest updates from us

This field is for validation purposes and should be left unchanged.
logo-kdf-electronics

We offer the most advanced and reliable physical vapor deposition batch in-line sputtering tools at the industry’s lowest cost of ownership. KDF systems can be customized to meet the customer’s needs and cover a wide variety of process requirements for the mainstream silicon, emerging materials and flat panel display markets.

Quicks links

  • About KDF
  • Contact / Quote
  • Our Clients
  • Buying From KDF
  • Worldwide Locations
  • News
  • KDF Events
  • Blog
  • Product Literature
  • Careers

Contact Us

(201) 784-5005
(201) 784-0202
sales@kdf.com
10 Volvo Drive, Rockleigh, NJ 07647
© Copyright KDF Electronic & Vacuum Services Inc. © . All rights reserved.