Metallic &
Silver-Filled
Epoxy Bonding
KDF incorporates proprietary metallic and silver-filled epoxy bonding techniques to guarantee the highest thermal conductivity, electrical properties, and adhesive characteristics — with a pre-bond sputtered barrier layer for maximum adhesion and diffusion resistance.
Proprietary Bonding for Maximum Performance
KDF incorporates proprietary metallic and silver-filled epoxy bonding techniques to guarantee that the highest thermal conductivity, electrical properties, and adhesive characteristics are achieved in every target-to-backing-plate assembly.
Prior to bonding, targets are sputtered with a protective barrier layer to prevent material diffusion and to increase target surface adhesion — ensuring a bond that maintains integrity through the thermal cycling and power demands of production sputtering.
KDF enjoys a highly regarded reputation for void-free and defect-free bonding. Each assembly is individually inspected and properly packaged to ensure all customer requirements are satisfied before shipment.
KDF also offers indium and indium alloy bonding for high-power applications, as well as picture frame bonding for fragile materials like SiO₂, Pyrex, and ITO where conventional bonding methods would compromise target integrity.
Why Bonding Quality Matters
A poor bond between target and backing plate is one of the most common causes of process instability, premature target failure, and unplanned system downtime in production sputtering. Voids in the bond line reduce thermal conductivity, causing hot spots that can crack or delaminate the target during deposition.
All Bonding Methods Available
Silver-Filled Epoxy
KDF's primary bonding method for most target-to-backing-plate assemblies. Silver-filled epoxy provides excellent thermal and electrical conductivity combined with strong adhesive properties and CTE tolerance.
Best for: Most metallic and compound targets with moderate to high power requirements.
Indium & Indium Alloy
Develops the highest-strength bond with superior thermal transfer — the preferred method for high-power sputtering and thermally demanding processes. Indium alloys extend the operating temperature range.
Best for: High-power applications, precious metals, and thermally challenging target materials.
Metallic Epoxy
Metallic filler epoxies provide both good conductivity and the ability to bond materials with highly dissimilar coefficients of thermal expansion — where pure indium bonding would be mechanically unsuitable.
Best for: Dissimilar CTE pairings, compound targets, and applications requiring reworkable bonds.
Picture Frame Bonding
Specialized technique for brittle and fragile target materials. The picture frame bond distributes stress around the perimeter of the target rather than across the full face — preventing cracking of brittle dielectric and oxide targets.
Best for: SiO₂, Pyrex, ITO, Al₂O₃, and other brittle ceramic or oxide targets.
KDF's Bonding Process
Surface Prep
Target and backing plate surfaces are precision cleaned and prepared
Barrier Layer
Protective layer sputtered onto target to prevent diffusion and enhance adhesion
Bonding
Epoxy or indium bond applied using KDF's proprietary controlled process
Inspection
Full visual and dimensional inspection — every assembly verified void-free and defect-free
Packaging
Properly packaged to preserve assembly integrity and purity during shipping and storage
Also Available from KDF
Need Bonding for Your Sputtering Targets?
Contact KDF with your target material, geometry, and backing plate specification. We'll recommend the right bonding method and provide a fast quote.
