KDF RELEASE 2005
KDF today announced that Taiwan-based FuPo Electronics Corporation, a turnkey service provider for liquid crystal display (LCD) integrated circuit (IC) manufacturers, purchased KDF’s 844NT batch sputtering system for use in high-volume wafer bumping production. FuPo’s purchase signals a growing acceptance of KDF’s sputtering systems in Taiwan.
Wafer bumping is an important stage during assembly that generates interconnects between the chip and substrate, and KDF’s systems provide the maximum speed and functionality for this process.
“We chose the KDF 844NT for its proven high throughput and performance, as well as its ability to modify wafer size without production delays,” said N.T. Huang, President of FuPo Electronics. “This enables us to better meet the changing requirements of the merchant wafer bumping foundry environment.”
KDF’s 844NT tool will be delivered to FuPo Electronics ready to accept a robotic-load process called OPUS which allows the customer to upgrade easily to a complete cassette-to-cassette operation. The combination of the 844NT and OPUS creates the fastest wafer-size changeover time in the industry using just software and quick-check calibration.
“KDF is very pleased that our new customer, FuPo Electronics, will use the 844NT during the essential wafer bumping step,” said Kurt Flechsig, KDF president. “The grouping of our OPUS robotic technology and the 844NT’s superior execution will provide FuPo Electronics with excellent results.”
The 844NT is designed to process high-density interconnect, 300 mm semiconductor wafers and flat panel displays through its four-target, batch-sputtering system. The 844NT offers a pallet area of 26.5 x 26.5 inches with a compact footprint that uses less than one-third the floor space of competing equipment. Due to its size the 844NT system is an extremely cost effective way of running batches of small to large wafers or substrates.
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