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PVD sputtering

What is PVD and Sputtering?

Vishal Agrawal · July 23, 2021 ·

Written by Ammar Derraa

04/30/2021

Introduction to Thin Film Sputtering

Thin film technology is the process of depositing and characterizing functional material layers on a substrate. These layers are the building blocks of modern devices, like computer and cell phone microchips, which require sophisticated know-how and systematic innovation to meet the ever-changing demands of high technology.

Physical Vapor Deposition (PVD) commonly known as sputtering is an established and widely used method in the deposition of thin films and device fabrication.  KDF has many years of experience in PVD or sputtering of thin films. It has the talents and tools to deposit and characterize, with high precision, various films ranging in thickness from a few angstroms to hundreds of microns. This covers most applications requiring thin film coating.

In addition to its state-of-the-art PVD deposition tools, KDF possesses a variety of in-house metrology tools, and has access to an array of test and characterization facilities through its collaboration with research and academic institutions. The R&D team at KDF has a diversified experience in all areas of thin film engineering, devices, process development and characterization, and process integration. KDF research activities are mostly customer oriented and strongly focused on efficient and competitive sputtering technologies to enable production-worthy processes.

Basics of sputtering thin films

Sputtering is one of the most versatile deposition techniques of contemporary thin film technology. It involves the deposition of a material ejected from a source called “target” onto another material called “substrate”.  This is accomplished by a bombardment of the surface of the target with gas ions accelerated by a high voltage.  Particles of atomic dimensions from the target are ejected as a result of momentum transfer between incident ions and the target. The target-ejected particles traverse the vacuum chamber and are subsequently deposited on a substrate as a thin film. Thin film sputtering is carried out in a high vacuum environment with a variety of geometrical shapes and configurations, such as down, up, and side sputtering. KDF offers many sputtering configurations to accommodate different substrate sizes and shapes, as well as custom-made PVD systems. All systems can operate in DC sputtering, RF sputtering, Pulsed DC sputtering, and HIPIMS sputtering.

Simple diagram of a PVD system

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Side sputtering

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Down sputtering

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Solutions in Action

Rad Horak · February 25, 2017 ·

Today’s consumers are accustomed to a certain level of imperfection in electronic devices.

An LED flashlight may fail. A laptop may no longer boot up the way it did just yesterday. But while these everyday equipment deficiencies may be accepted as part of modern living, the stakes are much higher when it comes to medical devices.

“Our customers in the implantable medical device industry demand the highest level of quality and precision,” said Todd Plaisted, director of marketing, KDF. “Equipment failure to perform is simply not an option for companies that produce pacemakers and defibrillators.”

844i Series systems
Like all KDF sputtering tools, 844i Series systems are designed to meet demanding processing
requirements and feature an intuitive interface to monitor parameters.

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Founded in 1986, KDF is a leading supplier of physical vapor deposition (PVD) batch inline sputtering tools. These vacuum coating systems are used in the production of mainstream silicon, emerging materials, fl at panel displays, optical communications and medical devices. From headquarters in Rockleigh, New Jersey, KDF serves a global customer base and supports more than 3,300 systems in the field.

“More than half of the semiconductor fabs in the world use a KDF system in wafer processing,” Plaisted said. “And we extend the same quality the medical device market demands to all industries we serve.”

Virtually always located in a cleanroom environment, sputtering tools precisely deposit thin films of various materials, metals and/or dielectrics onto a substrate.

Next, the wafers typically enter etching or patterning equipment. Depending on the application, the substrate can return to the sputtering system several times during the manufacturing process to add different layers.

“Recipe management is critical throughout this process,” said Marc Fregeau, software development manager, KDF. “We develop all the programming for our customers – and update the software for them as their processes change.”

As more companies embrace contract fabrication, recipe control and monitoring has become increasingly important. In this emerging business model, a manufacturer provides fabrication services for a wide range of customers – each requiring different processes.

In 2010, KDF adopted a Rockwell Automation® control and information platform for their equipment featuring an Allen-Bradley® CompactLogix™ controller and an RSView®32 HMI solution.

“The initial control solution met our requirements,” Fregeau explained. “But as our customers’ process requirements became more demanding, we needed a more robust visualization solution that could grow with us.”

To enhance system performance, the company recently migrated to a FactoryTalk® View Site Edition (SE) HMI platform. In addition, the company opted for a CompactLogix 5370 controller (L36ERM), which features faster processor speeds and supports up to 16 axes of integrated motion over an EtherNet/IP™ network.

“Moving from the 32-bit HMI to the 64-bit FactoryTalk View solution was key,” Fregeau explained. “It provides a framework for an easy-to-use recipe management system – and the capacity to meet the demand for real-time information in a complex process environment.”

KDF systems are designed to monitor all process parameters including power supply voltages, sputter gas pressures/ratios, residual gas analyzer (RGA) background species vacuum integrity checks, substrate temperatures and more. The FactoryTalk View application helps enable real-time operator monitoring of those parameters through intuitive displays – and provides an audit trail of operator and alarm information in a centralized log database for absolute process validation.

“If there’s a process anomaly, the data logging helps determine the root cause,” Fregeau said. “The system also allows us to actively take ‘snapshots’ of the process in real time for reporting purposes.”

As an option, KDF customers can add FactoryTalk Historian to their system. FactoryTalk Historian features built-in connectivity to FactoryTalk View and provides robust, high-speed data collection and analysis capabilities.

For efficient system development, KDF applies the same Rockwell Automation control and visualization platform across its complete machine portfolio.

“Our sputtering tools share many components – as well as the control system,” Plaisted said. “A shared platform allows us to develop versatile equipment very cost-effectively.”

Looking toward the future, KDF is positioned to respond to fluctuating customer requirements – and an unpredictable marketplace.

“We are constantly changing,” Plaisted said. “And the Rockwell Automation control environment allows us to configure our tools and make changes as we need them.”

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We offer the most advanced and reliable physical vapor deposition batch in-line sputtering tools at the industry’s lowest cost of ownership. KDF systems can be customized to meet the customer’s needs and cover a wide variety of process requirements for the mainstream silicon, emerging materials and flat panel display markets.

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