Integrated Passive Devices
& Thin Film Circuits
IPDs, components, and thin film circuits — resistors, capacitors, inductors, antennas, and resonators — represent a significant and expanding segment of the electronics market. KDF's sputtering systems deliver the precision and repeatability these applications demand.
Thin Film Technology for Miniaturized Electronics
Integrated Passive Devices and components, including thin film circuits like resistors, capacitors, inductors, antennas, and resonators, are fabricated using integrated circuit processing techniques similar to those employed in semiconductor manufacturing — though not exclusively on silicon substrates. The growing importance of these devices is largely attributed to the ongoing trend towards miniaturization in wireless technology.
The principal advantage of using thin film technology for the construction of these devices lies in its ability to achieve extremely close component matching, high area density, and consistent, repeatable performance. This is particularly beneficial in applications where space is at a premium and reliability is critical.
To manufacture these thin film devices and components, companies turn to KDF Technologies' sputtering systems — capable of depositing a wide variety of materials including Au, Cr, Ti, Cu, Ta, TaN, and NiCr — essential for the production of high-quality IPDs and thin film circuits across a range of wireless applications.
Thin Film Devices & Circuit Elements
These devices are integral to the advancement and miniaturization of modern electronic and wireless devices, offering high performance in small, efficient packages.
Thin Film Resistors
High precision and stability, commonly used in RF applications for excellent performance over a wide range of frequencies.
Thin Film Capacitors
Known for compact size and reliability, used in applications requiring high precision and stability with minimal parasitics.
Thin Film Inductors
Utilized in high-frequency circuits for quality performance, occupying less space while providing necessary inductance values.
RF Filters
Integrated passive devices that select or block specific frequency ranges, critical in wireless communication systems for signal clarity.
Baluns
Convert between balanced and unbalanced signals — essential in RF and antenna applications for impedance matching and signal integrity.
Antennas
Thin film technology enables production of miniaturized antennas for wireless devices, supporting the trend towards smaller, more efficient communication hardware.
Resonators
Used to generate or select specific frequencies, essential in clocks and oscillators for BAW, SAW, and FBAR filter applications.
Integrated Passive Networks
Complex networks of resistors, capacitors, and inductors integrated into a single package, performing multiple functions in a compact space.
System Features for IPD & Thin Film Circuit Manufacturing
KDF's inline sputtering platforms include a full range of process and hardware options engineered for the precision, repeatability, and throughput demands of IPD and thin film circuit production.
Pallet Stacker — 900 Series
Increases load lock cassette capacity to 5 pallets, extending run time between load/unload cycles. Each pallet can run the same recipe or its own unique deposition recipe — ideal for unsupervised operation.
Upsilon Inset™ Cathode — Precious Metal Sputtering
Specifically designed for high thermal conductivity, high-value materials including Au, Pt, Pd, and Ag. Novel Upsilon-shape targets enable up to 60% target utilization.
Enhanced Rotating Planetary Pallet (ERPP)
KDF's proprietary ERPP™ achieves exceptionally high uniformity in the sub ±1% range with tight run-to-run repeatability. Available on 900 series systems.
HIPIMS
High Power Impulse Magnetron Sputtering produces highly dense, smooth, and hard films with enhanced conformality for high aspect ratio features in thin film circuit patterning.
Ellipsometer & Optical Measurement Integration
In-situ optical monitoring for real-time checking of film thickness, refractive index (n), and extinction coefficient (k) — critical for optical and RF passive device fabrication.
Auto Rate Adjust (ARA)
Automatically adjusts scan speed or deposition power to compensate for target wear, maintaining a stable and repeatable process throughout the target's full life.
Scan Velocity Control
Create custom velocity profiles for the pallet as it passes through the deposition zone, enabling precise control of film thickness and uniformity across complex pallet layouts.
IR Pallet Temperature Measurement
Integrated pyrometer provides instant feedback on pallet and part temperature, with readings integrated into recipes for controlled heating and cooling steps between depositions.
Water Pump & Process Stability
High-performance water pumps increase water vapor pumping speeds to substantially improve system throughput and process stability — critical for reactive deposition of TaN and TiN.
943ix & 954ix — x Series™
The 943ix and 954ix are two of KDF's flagship x Series™ products. They feature the latest KDF cathode designs, lengthened to 17 inches, offering improved uniformity over the entire pallet — a critical advantage for IPD and thin film circuit manufacturing where component matching tolerances are tight.
x Series™ cathodes are available in Planar™, Inset™, and RF/DC LMM™ cathode form, covering the full range of metallic and reactive deposition processes required for passive device fabrication.
- 17" cathode for improved pallet-wide uniformity
- Planar™, Inset™, and LMM™ cathode configurations
- Compatible with ERPP, HIPIMS, Pallet Stacker, ARA, and ellipsometer options
- Proven at leading IPD and RF component manufacturers
- Full MRC batch system lineage and parts compatibility
Ready to Discuss Your IPD or Thin Film Circuit Application?
KDF's applications, design, and vacuum engineering teams are ready to help configure the right sputtering solution for your component manufacturing process.
