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600 series sputtering equipment in line side sputtering batch systems kdf

600i Series Sputtering System | Vertical Batch PVD | KDF Technologies
Entry Production Series

600i Series

Vertical Batch Sputtering System

Dual load lock, in-line RF/DC side sputtering batch systems built for sensitive applications requiring the lowest defect rates. Full KDF process heritage in a compact, cost-effective platform.

Request a Quote → Download Datasheet →
Pallet Size
12" × 12"
Target Positions
3 or 4
Wafer Capacity
Up to 36 × 2"
Series
603i · 643i · 654i · ix
KDF 600i Series Sputtering System
600i Series | 744i Series | 844i Series | 900i Series | 974i Series | Ci Cluster Tool
System Overview

Built for Sensitive Applications

The 600i Series is KDF's entry production platform — purpose-built for applications using target materials that produce unusually high particulate contamination. These systems surpass the criteria for thin film deposition in high-density devices and applications requiring absolutely minimal defects.

KDF 600i Series — Interior View 600i Series — Chamber Interior

The 600i Series supports multi-process sputtering for maximum process flexibility. The 600ix family features KDF's patented Linear Moving Magnetron™ (LMM™) cathode — engineered for high-rate reactive processes, full-face target erosion, and low particle generation.

All 600i systems handle one 8" wafer or up to thirty-six 2" wafers, with optional gas delivery systems for enhanced reactive processes. Remote PC accessibility via Ethernet is standard for software upgrades and diagnostics.

Key Features

Standard System Capabilities

  • Vertical side sputtering — small footprint
  • 12" × 12" pallet with unique pallet designs available
  • Dual-process loadlock for production exchange cycles
  • Optional high vacuum loadlock with quartz heater lamps
  • Multiple bias types enabling denser films and planarization
  • Multi-size capability — substrate size changeable run to run
  • Scan velocity profiling for enhanced uniformity
  • Optional robot for particulate-free cassette-to-cassette handling
  • Optional integrated RGA for process and fault monitoring
  • In-situ pallet optical temperature measurement and control
  • LMM™ cathode available (ix series) — full-face erosion, low particles
  • Pulsed DC via Advanced Energy Pinnacle Plus available
  • SECS/GEM connectivity via OPC server interface
  • Complies with NFPA 79 and Semiconductor S2-0706 safety specs
System Variants

600i Series Model Lineup

The 600i family spans from the base 603i to the four-target 654ix — each model building on the last with additional vacuum, process, and cathode capabilities.

603i
Base Model · 3-Target

The entry-level 600i configuration. Rough-pumped load lock for fast production exchange cycles. Optimized for sensitive applications with high-particulate target materials. Widely used in telecommunications manufacturing, chip resistor, and resistor network applications.

643i
4-Target · High Vacuum Loadlock

Builds on the 603i with a high-vacuum pumped load lock with quartz heat lamps for tighter process control. Features palletized batch processing with instantaneous wafer size changes run to run. KDF maintains an extensive pallet library for a wide range of substrate applications including GaAs front/back-side processes.

654i
4-Target · Telecom & Compound Semi

Developed for the telecommunications and compound semiconductor markets. Four-target versatility supports the full range of leading-edge microelectronic component manufacturing. Enhanced etch and deposition uniformity with high-speed batch processing capability.

643ix & 654ix
X-Series™ · Extended Cathode · LMM™

KDF's X-Series™ with 17" extended cathodes for improved uniformity across the entire pallet. Available in Planar™, Inset™, and RF/DC LMM™ configurations. The LMM™ cathode delivers bulletproof high-rate reactive processes with full-face target erosion and industry-leading low particle generation.

Technical Specifications

Vacuum & Facility Requirements

Vacuum Performance
Chamber Ultimate ≤1 × 10⁻⁷ torr
Chamber Leak Rate 20 min to 1 × 10⁻⁴ torr
HV Dome Ultimate ≤1 × 10⁻⁷ torr
HV Dome Leak Rate 15 min to 1 × 10⁻⁴ torr
Pump Down from Atm. ≤110 min to 1 × 10⁻⁶ torr
Overnight Pump Down 2 × 10⁻⁷ torr
Facility Requirements
Power 208 VAC, 3-phase, 100A
Cooling Water 6.5 GPM, 70 PSI min
Water Temp Range 10°C – 24°C
Compressed Air 85 – 100 PSIG
Process Gas 25 PSIG, 99.999% purity
Pure Gas Dry N₂
Process Capability
Pallet Size 12" × 12" (304mm × 304mm)
Max Wafer (single) 1 × 8"
Max 2" Wafers 36
Target Positions 3 or 4
DC Power Supply 12 kW (Adv. Energy)
RF Power Supply 1.25 or 3.0 kW (opt.)
System Detail

Hardware, Controls & Software

System Hardware

  • 12 kW low stored energy DC power supplies (Advanced Energy) — optional Pinnacle Plus pulsed DC
  • Integrated throttling SS VAT valve for upstream or downstream pressure control
  • MKS multi-component "Smart" 390 and 925 gauges for integrated vacuum measurement
  • Process gas control: up to 4 MFCs, feedback-controlled capacitance manometer, master/slave gas select, gas ratio control
  • Stepper motor pallet carrier drive with optical encoder — programmable scan velocity profiling
  • Low-pressure hydraulics for safety and smooth operation
  • Loadlock linear sensor — computer-controlled positioning for increased accuracy and fail-safe
  • Optional 1.25 or 3.0 kW RF solid-state power supply (Advanced Energy)
  • Complies with NFPA 79 guidelines; CE option available

Computer & Control System

  • Windows 10 real-time GUI with 24" LCD touchscreen on umbilical mobile HI cart
  • Context-sensitive recipe manager running from Microsoft SQL database
  • Real-time data display and logging — compatible with Excel, Lotus, and Windows applications
  • Report generation, remote interface, and printing capability
  • Optional SECS/GEM connectivity via OPC server interface
  • Distributed Rockwell Control System — DeviceNet and EtherNet/IP fieldbus
  • Full maintenance test suite with diagnostic and manual process control
  • Service-friendly fully enclosed electronic cabinet
  • Remote PC accessibility via Ethernet for software upgrades and file repair
Applications

Target Markets

Medical Devices

Optical Communications

Compound Semiconductors

Flat Panel Displays

Chip Resistors & Networks

Telecom Manufacturing

Emerging Materials

Mainstream Silicon

Next Steps

Configure Your 600i System

Our process engineers can help you select the right 600i variant and options for your application. Download the full datasheet or contact us to start the conversation.

Let's Talk Process → Download 600i Datasheet →
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We offer the most advanced and reliable physical vapor deposition batch in-line sputtering tools at the industry’s lowest cost of ownership. KDF systems can be customized to meet the customer’s needs and cover a wide variety of process requirements for the mainstream silicon, emerging materials and flat panel display markets.

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