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974i series sputtering equipment in line side sputtering batch systems kdf

974i Series Sputtering System | Flagship Horizontal Sputter-Down | KDF Technologies
KDF Flagship — Sputter-Down Series

974i Series

Flagship Horizontal Sputter-Down Batch System

The top of the KDF sputter-down platform family — a 20"×20" pallet, four-target system delivering 4× the throughput of the 900i Series for 200mm wafer metallurgy, with the process flexibility of an R&D tool and the reliability of a production workhorse.

Request a Quote → Download Datasheet →
Pallet Size
20" × 20"
Target Positions
3 or 4
Max Substrate Thickness
2" standard
Loadlock Stacker
Up to 5 pallets
Cathode Length
24.5"
KDF 974i Series Sputtering System
Flagship System | 4× throughput of 900i Series for 200mm wafer metallurgy | 20" × 20" pallet — largest in the sputter-down family | Optional 5-pallet loadlock stacker for continuous production
600i Series | 744i Series | 844i Series | 900i Series | 974i Series | Ci Cluster Tool
System Overview

Production Scale. R&D Flexibility.

The 974i is the flagship of KDF's sputter-down platform family — designed to meet today's most stringent production requirements while delivering the process flexibility typically found in R&D systems. With a 20"×20" pallet and horizontal sputter-down geometry, the 974i processes dimensional substrates up to 2 inches thick, up to one Gen 2.5 substrate per pallet, and achieves 4× the throughput of the 900i Series for 200mm wafer metallurgy.

KDF 974i Series — System Detail 974i Series — System Detail

The 974i features high-vacuum loadlock with quartz heater lamps, and supports an optional loadlock upgrade to a 5-pallet stack for near-continuous production throughput. The system accepts KDF's full 24.5-inch cathode lineup — including the exclusive Focest Cathode™ for high-aspect ratio deep trench fills.

Like the 900i, the 974i is available with KDF's ERPP™ planetary pallet — achieving better than ±1% uniformity and 0.5% run-to-run repeatability for dielectric materials. It is the platform of choice for defense and aerospace hybrid circuits, compound semiconductor front/backside processing, and application-critical thin film production.

Key Features

Standard System Capabilities

  • Horizontal cathode and substrate orientation — sputter-down geometry
  • 20" × 20" pallet — largest in the KDF sputter-down family
  • Processes dimensional substrates up to 2" thick — standard
  • Capacity for up to one Gen 2.5 substrate per pallet
  • 4× throughput improvement over 900i Series for 200mm wafer metallurgy
  • High-rate DC magnetron sputtering — single and multiple-pass deposition
  • High vacuum loadlock with quartz heater lamps for substrate degassing
  • Optional loadlock upgrade: dual (2) to five (5) pallet stack
  • Optional ERPP™ planetary pallet — <±1% uniformity, <0.5% repeatability
  • Scan velocity profiling for enhanced deposition uniformity
  • Optional integrated RGA for process and fault monitoring
  • 24.5" extended cathodes — Planar™, Inset™, RF/DC LMM™, Focest™
  • Pulsed DC via Advanced Energy Pinnacle Plus available
  • Fully automated self-locking top plate support system
  • Complies with Semiconductor S2-0706; CE option available

★ Denotes capabilities unique to the 974i vs. 900i Series

KDF 974i — Chamber Interior
974i Series — Chamber Interior
KDF 974i — System View
974i Series — Production Configuration
974i vs 900i Series

How the 974i Steps Up

The 974i shares the sputter-down geometry and platform DNA of the 900i — but scales up in every dimension that matters for high-throughput production with larger substrates.

Pallet Size
20" × 20"
vs 12" × 12" (900i)
Area
200mm Throughput
4×
vs 900i Series baseline
Throughput Multiplier
Max Substrate Thickness
2"
vs 1.5" standard (900i)
Standard Spec
Loadlock Capacity
5
vs 2 standard (900i)
Max Pallet Stack
Cathode Technology

974i Cathode Options

The 974i accepts KDF's full 24.5-inch cathode lineup — the longest in the sputter-down family. All cathodes are designed in-house and field-proven for production-critical applications.

Focest Cathode™
High-Aspect Ratio · Deep Trench Fill

Originally developed for high-aspect ratio deep trench fill applications, the Focest Cathode™ is capable of increasing uniformity, deposition rate, and material utilization simultaneously — making it the choice for the most demanding advanced packaging and semiconductor interconnect applications.

LMM™ Cathode
Patented · RF Capable · Full Face Erosion · 24.5"

KDF's patented Linear Moving Magnetron cathode at 24.5-inch length. RF capable with full-face target erosion for low-particle applications. Delivers bulletproof high-rate reactive processes with superior run-to-run repeatability across the entire 20"×20" pallet area.

Inset Cathode™
24.5" Length · Metals & Precious Metals

Full 24.5-inch length for the 974i, accommodating most metal and all precious metal types. Improved cathode-to-pallet aspect ratio delivers superior uniformity across the expanded 20"×20" pallet vs. shorter cathode configurations.

Planar™ & Custom
Full Cathode Family · In-House Engineering

The full KDF planar cathode range is available for the 974i, along with custom designs from KDF's in-house cathode engineering team. Optional gas delivery systems enable enhanced reactive sputtering processes across all cathode types.

5Pallet Stack Option

Optional Loadlock Upgrade — 2 to 5 Pallet Stack

The 974i offers an optional loadlock upgrade that expands capacity from the standard dual (2) pallet configuration to a five (5) pallet stack. This enables near-continuous sequential processing — significantly increasing tool utilization and reducing operator intervention for high-volume production environments.

ERPP™Proprietary Technology

Enhanced Rotating Planetary Pallet — <±1% Uniformity Across 20"×20"

The ERPP™ planetary pallet option on the 974i achieves better than ±1% uniformity across the full 20"×20" pallet and better than 0.5% run-to-run repeatability for dielectrics such as SiO₂ and TiO₂ — compared to ±15–20% for traditional pallets. With KDF cathodes in tandem, this is the highest-performance uniformity option available in the in-line batch sputtering category.

Technical Specifications

Vacuum & Facility Requirements

Vacuum Performance
Chamber Ultimate≤1 × 10⁻⁷ torr
Chamber Leak Rate20 min to 1 × 10⁻⁴ torr
HV Dome Ultimate≤1 × 10⁻⁷ torr
HV Dome Leak Rate15 min to 1 × 10⁻⁴ torr
Pump Down from Atm.≤110 min to 1 × 10⁻⁶ torr
Overnight Pump Down2 × 10⁻⁷ torr
Loadlock PumpCTI-8 cryo pump
Facility Requirements
Power208 VAC, 3-phase, 100A
Cooling Water6.5 GPM, 70 PSI min
Water Temp Range10°C – 24°C
Compressed Air85 – 100 PSIG
Process Gas25 PSIG, 99.999% purity
Pure GasDry N₂
Process Capability
Pallet Size20" × 20" (508mm × 508mm)
Max Substrate Thickness2" standard
Glass SizeUp to Gen 2.5
Target Positions3 or 4
DC Power Supply20 kW (Adv. Energy)
RF Power Supply3 kW (optional)
System Detail

Hardware, Controls & Software

System Hardware

  • 20 kW low stored energy DC power supplies (Advanced Energy) — optional Pinnacle Plus pulsed DC
  • Integrated throttling SS VAT valve for upstream or downstream pressure control
  • MKS multi-component "Smart" 390 and 925 gauges for integrated vacuum measurement
  • Fully automated self-locking top plate support system
  • Process gas control: up to 4 MFCs, feedback-controlled capacitance manometer, master/slave gas select, gas ratio control
  • Stepper motor pallet carrier drive with optical encoder — programmable scan velocity profiling
  • Loadlock linear sensor — computer-controlled positioning for accuracy and fail-safe
  • Low-pressure hydraulics for safety and smooth operation
  • Optional 3 kW RF solid-state power supply (Advanced Energy)
  • Complies with NFPA 79; CE option available

Computer & Control System

  • Windows 10 real-time GUI with 24" LCD touchscreen on umbilical mobile HI cart
  • Context-sensitive recipe manager running from Microsoft SQL database
  • Real-time data display and logging — compatible with Excel, Lotus, and Windows applications
  • Report generation, remote interface, and printing capability
  • Optional SECS/GEM connectivity via OPC server interface
  • Distributed Rockwell Control System — DeviceNet and EtherNet/IP fieldbus
  • Full maintenance test suite with diagnostic and manual process control
  • Service-friendly fully enclosed electronic cabinet
  • Remote PC accessibility via Ethernet for software upgrades and file repair
Applications

Target Markets

Defense & Aerospace

Medical Devices

Compound Semiconductors

Space Telecom

Hybrid Circuits

Optical Communications

High-Density Interconnect

Advanced Packaging

Next Steps

Configure Your 974i System

Our process engineers can help you select the right cathode configuration, loadlock option, and pallet setup for your 974i application. Download the full datasheet or contact us to start the conversation.

Let's Talk Process → Download 974i Datasheet →
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We offer the most advanced and reliable physical vapor deposition batch in-line sputtering tools at the industry’s lowest cost of ownership. KDF systems can be customized to meet the customer’s needs and cover a wide variety of process requirements for the mainstream silicon, emerging materials and flat panel display markets.

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