900i Series
Dual load lock, in-line sputter-down batch systems with horizontal cathode and substrate orientation — built for gentle substrate fixturing, varied substrate geometries, and the highest uniformity demands in production.
Horizontal Orientation. Vertical Deposition.
The 900i Series is KDF's sputter-down platform — a fundamentally different geometry from the side-sputtering 600i, 744i, and 844i systems. With horizontal cathode and substrate orientation, sputtered material transfers vertically downward onto the substrate, enabling gentle fixturing for varied substrate sizes, shapes, and heights up to 1.5 inches thick (2 inches with optional hardware).
900i Series — Chamber Interior
High-rate DC magnetron sputtering with single-pass or multiple-pass deposition, dual-level high vacuum pumped load lock, and support for KDF's proprietary ERPP™ planetary pallet make the 900i Series the platform of choice for applications demanding better than ±1% film uniformity with better than 0.5% run-to-run repeatability.
The 900i Series includes the 903i, 943i, 943ix, 954i, and 954ix. The ix series features extended 17" X-Series™ cathodes for improved uniformity and supports KDF's LMM™ cathode for demanding reactive process applications.
Standard System Capabilities
- Horizontal cathode and substrate orientation — sputter-down geometry
- 12" × 12" pallet with convenient wafer-to-pallet loading
- Processes dimensional substrates up to 1.5" thick (2" with optional hardware)
- Capacity to process up to one 300mm wafer or multiple smaller wafers
- High-rate DC magnetron sputtering — single and multiple-pass deposition
- Dual-level high vacuum pumped load lock
- Optional high vacuum loadlock with quartz heater lamps for substrate degassing
- Optional ERPP™ planetary substrate pallet for <±1% film uniformity
- Optional pallet stacker — 5-pallet sequential operation
- Scan velocity profiling for enhanced deposition uniformity
- Optional integrated RGA for process and fault monitoring
- LMM™ cathode available (ix series) — full-face erosion, low particles
- Pulsed DC via Advanced Energy Pinnacle Plus available
- Fully automated self-locking top plate support system
- Complies with Semiconductor S2-0706; CE option available
The Sputter-Down Advantage
The 900i's horizontal orientation is a deliberate design choice — not a compromise. It opens up process capabilities and substrate handling options that vertical side-sputtering systems simply cannot match.
Gentle Substrate Fixturing
Horizontal orientation allows substrates to rest flat on the pallet under gravity — no clamping, gripping, or vertical support required. This is critical for fragile substrates, thick components, and unusual geometries that would be difficult to fixture vertically.
Dimensional Substrate Capability
The 900i processes substrates up to 1.5 inches thick as standard, with optional hardware extending this to 2 inches. This accommodates packages, modules, hermetic lids, ceramic substrates, and other dimensional components that exceed the capability of flat-pallet side-sputtering tools.
Pure Metal Target Deposition
The 900i Series is particularly well-suited for pure metal target deposition and contact metallurgy processing. The sputter-down geometry and convenient wafer-to-pallet loading make it the preferred choice for hybrid circuits, defense electronics, and medical implant metallization.
ERPP™ Uniformity Performance
With KDF's ERPP™ planetary pallet, the 900i achieves better than ±1% uniformity across the pallet and better than 0.5% run-to-run repeatability for dielectrics including SiO₂ and TiO₂ — compared to ±15–20% for traditional pallets. Unmatched for application-critical thin film production.
900i Series Model Lineup
The 900i family spans from the base 903i to the four-target 954ix — each model building on the last with additional vacuum, process, and cathode capabilities. All share the defining sputter-down horizontal geometry.
900i Series — System Detail
Targeted at contact metallurgy processing for pure metal target deposition and convenient wafer-to-pallet loading. The rough-pumped load lock enables fast production exchange cycles for high-throughput manufacturing.
Builds on the 903i with a high-vacuum pumped load lock and quartz heat lamps. Ideally suited for application-critical thin films for hybrid circuits in defense, aerospace, and space telecommunications — where repeatable, high-throughput processes for uniform films are non-negotiable.
Designed for GaAs and compound semiconductor applications. A four-target batch sputtering tool supporting both front and backside deposition — providing high utilization, cost-effectiveness, and productivity for leading-edge microelectronic component manufacturing.
KDF's X-Series™ with 17-inch extended cathodes for improved uniformity across the full pallet. Available in Planar™, Inset™, and RF/DC LMM™ configurations. The LMM™ cathode delivers full-face erosion and bulletproof high-rate reactive processes for the most demanding applications.
Enhanced Rotating Planetary Pallet — <±1% Uniformity
All 900i Series systems can be equipped with KDF's proprietary ERPP™. In tandem with KDF cathodes, this option achieves better than ±1% uniformity across the pallet and better than 0.5% run-to-run repeatability for dielectrics such as SiO₂ and TiO₂ — compared to ±15–20% for traditional pallets. The ERPP™ is also available with scan velocity profiling for further optimization.
Vacuum & Facility Requirements
Hardware, Controls & Software
System Hardware
- 12 kW low stored energy DC power supplies (Advanced Energy) — optional Pinnacle Plus pulsed DC
- Integrated throttling SS VAT valve for upstream or downstream pressure control
- MKS multi-component "Smart" 390 and 925 gauges for integrated vacuum measurement
- Fully automated self-locking top plate support system
- Process gas control: up to 4 MFCs, feedback-controlled capacitance manometer, master/slave gas select, gas ratio control
- Stepper motor pallet carrier drive with optical encoder — programmable scan velocity profiling
- Low-pressure hydraulics for safety and smooth operation
- Loadlock linear sensor — computer-controlled positioning for accuracy and fail-safe
- Optional pallet stacker — 6-shelf hanger for 5-pallet sequential operation
- 1.25 kW RF solid-state power supply (Advanced Energy) standard
- Complies with NFPA 79; CE option available
Computer & Control System
- Windows 10 real-time GUI with 24" LCD touchscreen on umbilical mobile HI cart
- Context-sensitive recipe manager running from Microsoft SQL database
- Real-time data display and logging — compatible with Excel, Lotus, and Windows applications
- Report generation, remote interface, and printing capability
- Optional SECS/GEM connectivity via OPC server interface
- Distributed Rockwell Control System — DeviceNet and EtherNet/IP fieldbus
- Full maintenance test suite with diagnostic and manual process control
- Service-friendly fully enclosed electronic cabinet
- Remote PC accessibility via Ethernet for software upgrades and file repair
Target Markets
Defense & Aerospace
Medical Devices
Compound Semiconductors
Space Telecom
Hybrid Circuits
Optical Communications
Emerging Materials
Mainstream Silicon
Configure Your 900i System
Our process engineers can help you select the right 900i variant, pallet configuration, and cathode options for your application. Download the full datasheet or contact us to start the conversation.
