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844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf

844i Series Sputtering System | Large Area 300mm Batch PVD | KDF Technologies
Large Area Production Series

844i Series

Large Area Vertical Batch Sputtering System

A large area, four-target RF/DC batch sputtering system for 300mm semiconductor wafers, solar photovoltaics, and flat panel displays up to Gen 3.5 — with through-the-wall cleanroom compatibility and dual cryo pump performance.

Request a Quote → Download Datasheet →
Pallet Size
26.5" × 30"
Target Positions
4
300mm Wafer Capacity
Up to 4
Glass Size
Up to Gen 3.5
KDF 844i Series Sputtering System
600i Series | 744i Series | 844i Series | 900i Series | 974i Series | Ci Cluster Tool
System Overview

300mm Scale. Cleanroom Ready.

The 844i is KDF's largest area production platform — a second-generation redesign with an expanded pallet, reduced footprint, and upgrades across hardware and software. It handles the demanding process requirements of high-density interconnect, 300mm semiconductor wafers, OLED, solar photovoltaics, and flat panel display manufacturing.

KDF 844i Series — System Detail 844i Series — Production Configuration

The 844i features a fully redesigned 3-door front access to the main chamber, dual CTI 10 cryo pumps with optional isolated water pump, and fully shielded chamber walls for faster cleaning and reduced cleanroom contamination. A through-the-wall design enables direct cleanroom integration.

Two processing pallets allow instantaneous wafer size changes and front/backside processing. The pallet assist tool (PAT) handles payloads up to 100 lbs safely and repeatably. Target utilization rate is up to 60%.

Key Features

Standard System Capabilities

  • Vertical side sputtering — compact footprint, <⅓ floor space of competing tools
  • 26.5" × 30" pallet — largest area in the KDF product line
  • Four-target main chamber configuration
  • Dual-process high-vacuum loadlock with substrate pre-heat
  • Processes up to four 300mm wafers simultaneously
  • 4× throughput improvement over 600i Series for 300mm wafer metallurgy
  • Glass sizes up to Gen 3.5
  • Pallet assist tool (PAT) for payloads up to 100 lbs
  • Through-the-wall design for cleanroom compatibility
  • 3-door front access to main chamber — second generation redesign
  • Dual CTI 10 cryo pumps; optional isolated water pump
  • Fully shielded chamber — faster cleaning, less cleanroom contamination
  • Scan velocity profiling for enhanced deposition uniformity
  • Target utilization rate up to 60%
  • Optional robot for particulate-free cassette-to-cassette handling
  • Pulsed DC up to 20 kW via Advanced Energy Pinnacle Plus
  • Complies with Semiconductor S2-0706; CE option available
KDF 844i — Chamber Interior
844i Series — Chamber Interior
KDF 844i — System View
844i Series — System Detail
Second Generation Design

What's New in the 844i Gen 2

KDF's second generation 844i builds on the original with expanded pallet size, reduced footprint, and significant hardware and software upgrades — engineered to meet increasing customer demand for higher throughput with larger substrates.

Expanded Pallet Area

Increased pallet size to 26.5" × 30" to accommodate higher throughput demands with larger substrates, including Gen 3.5 glass and four 300mm wafers simultaneously.

Dual Cryo Pump System

Equipped with dual CTI 10 cryo pumps for superior pumping performance. Optional CTI isolated water pump available for the ultimate in vacuum performance and process repeatability.

Through-the-Wall Design

Purpose-built for cleanroom integration. The through-the-wall configuration allows the process chamber to interface directly with the cleanroom environment while keeping support equipment in the facility chase.

3-Door Front Access

Completely redesigned main chamber access with 3-door front entry — reducing downtime for maintenance, target changes, and chamber cleaning. Fully shielded walls minimize cross-contamination.

60% Target Utilization

Targets on the 844i Series achieve up to 60% utilization — significantly reducing material cost per wafer and extending target service intervals for lower total cost of ownership.

PAT — 100 lb Payload

The pallet assist tool (PAT) safely handles pallet payloads up to 100 lbs in a repeatable, ergonomic manner — critical for large area substrates and high-density pallet configurations.

Cathode Technology

KDF Cathode Options

The 844i accepts KDF's full cathode range — all designed in-house and validated in customer and field applications. Each cathode is optimized for specific target materials, deposition modes, and uniformity requirements.

Inset Cathode™
Up to 30.5" Length · Metals & Precious Metals

Up to 30.5 inches in length — the longest in the KDF lineup. Accommodates most metal and all precious metal types with improved cathode-to-pallet aspect ratio for superior uniformity across the full 844i pallet area.

Magterial Cathode™
Planar Type · Ferrous Metals

A planar-type cathode ideal for magnetron sputtering of ferrous metals such as nickel and iron — delivering high deposition rates and high uniformity for demanding metallization applications including HDI and power device fabrication.

LMM™ Cathode
Patented · RF Capable · Full Face Erosion

KDF's newest patented Linear Moving Magnetron cathode — now available with RF option for the 844i. Delivers full-face target erosion for low-particle applications with bulletproof high-rate reactive process stability and run-to-run repeatability.

Custom Designs
In-House Engineering · Reactive Options

KDF's in-house engineering team models and designs all cathodes to customer and field-proven specifications. Optional gas delivery systems enable enhanced reactive sputtering processes across all cathode types.

Technical Specifications

Vacuum & Facility Requirements

Vacuum Performance
Chamber Ultimate<9.0 × 10⁻⁸ torr
Chamber Leak Rate25 min to 1 × 10⁻⁴ torr
HV Dome Ultimate<9.0 × 10⁻⁸ torr
HV Dome Leak Rate15 min to 1 × 10⁻⁴ torr
Pump Down from Atm.≤110 min to 1 × 10⁻⁶ torr
Overnight Pump Down1.0 × 10⁻⁷ torr
Facility Requirements
Power208 VAC, 3-phase, 225A
Cooling Water8 GPM, 70 PSI min
Water Temp Range10°C – 24°C
Compressed Air85 – 100 PSIG
Process Gas25 PSIG, 99.999% purity
Pure GasDry N₂
Process Capability
Pallet Size26.5" × 30" (673mm × 762mm)
300mm WafersUp to 4
Glass SizeUp to Gen 3.5
Target Positions4
DC Power Supply20 kW (Adv. Energy)
Target UtilizationUp to 60%
System Detail

Hardware, Controls & Software

System Hardware

  • 20 kW low stored energy DC power supplies (Advanced Energy) — optional Pinnacle Plus pulsed DC
  • Integrated dual throttling SS VAT valves for upstream or downstream gas pressure control
  • MKS multi-component "Smart" 390 and 925 gauges for integrated vacuum measurement
  • Process gas control: up to 4 MFCs, feedback-controlled capacitance manometer, master/slave gas select, gas ratio control
  • Stepper motor pallet carrier and shutter drive with optical encoder — scan velocity profiling available
  • Low-pressure hydraulics for safety and smooth operation
  • Stepper-driven automated load lock door
  • Loadlock linear sensor — computer-controlled positioning for accuracy and fail-safe
  • Fully shielded chamber for faster cleaning and reduced contamination
  • Complies with NFPA 79; CE option available

Computer & Control System

  • Windows 10 real-time GUI with 24" LCD touchscreen on umbilical mobile HI cart
  • Context-sensitive recipe manager running from Microsoft SQL database
  • Real-time data display and logging — compatible with Excel, Lotus, and Windows applications
  • Report generation, remote interface, and printing capability
  • Optional SECS/GEM connectivity via OPC server interface
  • Distributed Rockwell Control System — DeviceNet and EtherNet/IP fieldbus
  • Full maintenance test suite with diagnostic and manual process control
  • Service-friendly fully enclosed electronic cabinet
  • Remote PC accessibility via Ethernet for software upgrades and file repair
Applications

Target Markets

Solar Photovoltaics

Flat Panel Displays

300mm Semiconductor

OLED Technology

High-Density Interconnect

Medical Devices

Optical Communications

Emerging Materials

Next Steps

Configure Your 844i System

Our process engineers can help you select the right cathode configuration and cleanroom integration options for your 844i. Download the full datasheet or contact us to start the conversation.

Let's Talk Process → Download 844i Datasheet →
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We offer the most advanced and reliable physical vapor deposition batch in-line sputtering tools at the industry’s lowest cost of ownership. KDF systems can be customized to meet the customer’s needs and cover a wide variety of process requirements for the mainstream silicon, emerging materials and flat panel display markets.

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