744i Series
A large area, four-target RF/DC batch sputtering system designed for 200mm semiconductor wafers, OLED, and flat panel displays — with a compact footprint using less than one-third the floor space of competing equipment.
Large Area. Compact Footprint.
The 744i is KDF's large area R&D-to-production platform — a four-target batch sputtering system built for high-density interconnect, 200mm semiconductor wafers, OLED, and flat panel displays up to Gen 2 glass. It delivers throughput four times greater than the 600i Series for 200mm wafer metallurgy, in less than one-third the floor space of competing equipment.
744i Series — System Detail
The 744i features two processing pallets for instantaneous wafer size changes and front/backside processing in a single tool. A high-vacuum loadlock with substrate pre-heat supports efficient degassing and high throughput. The pallet assist tool (PAT) enables safe handling of payloads up to 60 lbs.
All 744i systems support scan velocity profiling and are compatible with the full range of KDF engineered cathodes. Remote PC accessibility via Ethernet is standard for software upgrades and diagnostics.
Standard System Capabilities
- Vertical side sputtering — compact footprint, <⅓ floor space of competing tools
- 19" × 19" pallet size — two processing pallets standard
- Four-target main chamber configuration
- High-vacuum loadlock with quartz heater lamps for substrate degassing
- Processes up to four 200mm wafers simultaneously
- 4× throughput improvement over 600i Series for 200mm wafer metallurgy
- Accommodates glass up to Gen 2
- Pallet assist tool (PAT) for payloads up to 60 lbs
- Scan velocity profiling for enhanced deposition uniformity
- Instantaneous wafer size change — front and backside processing
- Optional robot for particulate-free cassette-to-cassette handling
- Optional integrated RGA for process and fault monitoring
- Optional rotating substrate pallet for optical market applications
- Pulsed DC up to 20 kW via Advanced Energy Pinnacle Plus
- Complies with Semiconductor S2-0706; CE option available
KDF Cathode Options
The 744i accepts the full range of KDF-engineered cathodes — all designed in-house by KDF's cathode engineering team. Each cathode is optimized for specific materials and process requirements.
Measures 24.5 inches in length, accommodating most metal and all precious metal types. Provides higher cathode-to-pallet aspect ratio and improved uniformity across the full pallet area.
A planar-type cathode ideal for magnetron sputtering of ferrous metals such as nickel and iron — delivering high deposition rates and high uniformity for demanding metallization applications.
Optimized for sputtering dielectric materials such as SiO₂ and reactive depositions including indium-tin oxide (ITO). Features improved magnet design for better uniformity and longer cathode life.
KDF's patented Linear Moving Magnetron cathode — RF capable with full-face target erosion. Delivers bulletproof high-rate reactive processes with superior run-to-run repeatability and low particle generation.
KDF's in-house engineering staff models and designs all cathodes to customer and field-proven specifications. Custom cathode configurations are available for unique process requirements.
Optional gas delivery systems enable enhanced reactive sputtering processes across all cathode types — fully integrated with KDF's downstream pressure control and MFC-based gas management architecture.
Vacuum & Facility Requirements
Hardware, Controls & Software
System Hardware
- 20 kW low stored energy DC power supplies (Advanced Energy) — optional Pinnacle Plus pulsed DC up to 20 kW
- Integrated throttling SS VAT valve for upstream or downstream pressure control
- MKS multi-component "Smart" 390 and 925 gauges for integrated vacuum measurement
- Process gas control: up to 4 MFCs, feedback-controlled capacitance manometer, master/slave gas select, gas ratio control
- Stepper motor pallet carrier drive with optical encoder — programmable scan velocity profiling
- Low-pressure hydraulics for safety and smooth operation
- Automated motor-driven load lock door
- Loadlock linear sensor — computer-controlled positioning for accuracy and fail-safe
- Optional 3 kW RF solid-state power supply (Advanced Energy)
- Complies with NFPA 79; CE option available
Computer & Control System
- Windows 10 real-time GUI with 24" LCD touchscreen on umbilical mobile HI cart
- Context-sensitive recipe manager running from Microsoft SQL database
- Real-time data display and logging — compatible with Excel, Lotus, and Windows applications
- Report generation, remote interface, and printing capability
- Optional SECS/GEM connectivity via OPC server interface
- Distributed Rockwell Control System — DeviceNet and EtherNet/IP fieldbus
- Full maintenance test suite with diagnostic and manual process control
- Service-friendly fully enclosed electronic cabinet
- Remote PC accessibility via Ethernet for software upgrades and file repair
Target Markets
Compound Semiconductors
Flat Panel Displays
OLED Technology
Optical Communications
Medical Devices
High-Density Interconnect
Emerging Materials
R&D & Process Development
Configure Your 744i System
Our process engineers can help you select the right cathode configuration and options for your 744i. Download the full datasheet or contact us to start the conversation.
