KDF RELEASE 2002
KDF today announced that it has successfully completed installation of multiple in-line sputtering systems at two Taiwanese foundries. Micro Electro Magnetical Technologies Corporation (MEMT), based in Chunan, Miaoli, Taiwan, purchased a 603NT tool for critical film applications. Suntek Compound Semiconductor Company, based in Hsinchu Shien, Taiwan, ordered a 943NTX system with a planetary pallet for GaAs wafer production. The orders mark the first business between KDF and both companies.
“These two sales demonstrate the market penetration that KDF continues to gain in Taiwan. This increased interest from Taiwanese companies is based on the performance and cost-effectiveness of our tools,” said Kurt Flechsig, president of KDF. “We are pleased to welcome MEMT and Suntek as our two newest customers. KDF is committed to gaining a strong foothold in Taiwan, and we believe that these installations reflect our growth in this region.”
KDF is well positioned to capitalize on the expanding telecommunications and compound semiconductor market segments in Taiwan because of the breadth of its experience in these markets in the U.S. and Europe. As Taiwan’s gallium arsenide (GaAs) market continues to grow, KDF is focused on penetrating this market in its early stages.
“After evaluating the performance of other equipment, we found that the KDF tool surpassed the competition in terms of uniformity, which is critical in our discrete device production. Further, the cost of ownership advantages and customer support capabilities were key drivers in this purchasing decision,” said Allen Yang, assistant vice president of sales & marketing at MEMT.
According to the Semiconductor Industry Association (SIA), the worldwide discrete market is forecasted to grow in 2003 to $14 billion, a 16 percent increase from 2002. The discrete semiconductor market is predicted to increase another 15 percent in 2004, to total $16 billion.
The 943NTX is part of KDF’s 900 Series of PVD systems, all of which feature in-line sputter-down capabilities. The 943NTX offers the option of extended cathodes and excellent uniformity. Popular for their pure metal target deposition and convenient wafer-to-pallet loading abilities, the 900 Series systems can be configured with an optional high vacuum load-lock and three or four target positions. High-rate DC magnetron sputtering and single- or multiple-pass deposition features support the versatility and high throughput of these production systems. Cathode and substrate orientation are horizontal, allowing gentle substrate fixturing for users.
The 603NT is a vertical, side-sputtering tool that is typically used for sensitive applications requiring target material that produces unusually high particulate contamination. The 600 Series are dual load lock, in-line, vertical batch sputtering systems. They are configured with an optional high vacuum load lock and three or four target positions and have a 13 x 13 inch pallet size.
