KDF RELEASE 2002
KDF today announced that the Electronic Systems business of Raytheon Company (NYSE: RTN) has ordered a 943NT in-line sputtering tool for use in its El Segundo, California facility. Electronic Systems, which is a world leader in the development and deployment of key defense programs, will use the 943NT in the manufacture of its advanced technology products. This order from Electronic Systems marks the first new tool that Raytheon has purchased from KDF.
Raytheon has been a KDF customer since 1988, and has previously purchased remanufactured equipment from KDF and batch products from MRC, which KDF acquired from Tokyo Electron Limited (TEL) in 1998.
“In order to maintain our position as a global leader in advanced defense programs, it is imperative that our processing equipment provides us with the strongest technology platform possible. We already have an established process with the installed MRC 943 tool, and this new KDF in-line sputtering system will allow us to modernize the equipment without sacrificing process, reliability or cost effectiveness,” said Howard Ito, Principal Engineer of Raytheon’s Electronic Systems business.
Electronic Systems will primarily use the 943NT for thin film hybrid circuitry. This circuitry is subsequently utilized by the company in the development and production of a number of defense programs, including radars and sensors for ground-based, airborne, and space-based systems.
“As Electronic Systems moves to replace its current equipment, our 943NT provided the most seamless and efficient platform for this transition. Electronic Systems is already familiar with our technology, and the 943NT will continue to enable it to produce the most advanced circuits for its defense programs,” said Kurt Flechsig, president of KDF.
The 943NT is part of KDF’s 900 Series of physical vapor deposition (PVD) systems, all of which feature in-line sputter-down capabilities. Popular for their pure metal target deposition and convenient wafer-to-pallet loading abilities, the 900 Series tools can be configured with an optional high vacuum loadlock and three or four target positions. High-rate DC magnetron sputtering and single- or multiple-pass deposition features support the versatility and high-throughput of this production equipment. Cathode and substrate orientation are horizontal, allowing gentle substrate fixturing for users.
