High Purity
Sputtering
Targets
KDF offers a large selection of high purity metals, alloys, non-metallic materials, and cermets for virtually every sputtering and evaporation application in the industry — including our proprietary Upsilon Inset™ targets designed for up to 60% utilization of precious metals.
Upsilon Inset™ Targets —
Up to 60% Utilization
KDF's proprietary Upsilon Inset™ cathode uses a novel Υ-shaped (upsilon) target geometry that is specifically engineered for high thermal conductivity, high-value materials — delivering up to 60% target utilization compared to the 20–30% typical of standard planar targets.
For precious metals like Gold (Au), Platinum (Pt), Palladium (Pd), and Silver (Ag) — where material cost is a significant production expense — the Upsilon Inset™ target can reduce material cost per wafer by more than half compared to conventional designs.
Upsilon Inset™ targets are sole KDF intellectual property — a patented geometry available only from KDF Technologies. They cannot be replicated by aftermarket target suppliers.
- —Au, Pt, Pd, Ag — precious metal targets optimized for the Upsilon Inset™ cathode
- —Engineered for high thermal conductivity — essential for precious metal sputtering stability
- —Dramatically reduces cost per wafer for medical, photonic, and semiconductor applications
- —Available exclusively from KDF — patented IP, not available from any other supplier
Targets for Every
Sputtering Application
KDF's facility is configured to manufacture production quantities across a broad range of materials, while remaining capable of small research quantities at competitive prices. This manufacturing flexibility demonstrates KDF's commitment to meeting the full spectrum of customer needs — from high-volume OEM production to R&D process development.
Each target is chemically cleaned, individually marked, and carefully packaged under vacuum or inert gas as required by the specific material. Handle only with rubber gloves to preserve target purity.
Target Geometries
Planar
Standard flat geometry for most DC and RF sputtering configurations
Circular
Round targets for circular magnetron cathode configurations
Rectangular
Elongated targets for inline batch sputtering systems including all KDF platforms
Upsilon™
KDF's patented Υ-shape for Inset™ cathodes — up to 60% utilization of precious metals
Conical
For specific cathode geometries requiring angled deposition surfaces
Custom
Ring, delta, and fully custom geometries available for non-standard cathode designs
Material Processing Techniques
KDF incorporates advanced material processing techniques that ensure every target meets the highest standards of purity, density, and dimensional accuracy.
Vacuum Induction Melting
High-purity melting in vacuum to eliminate contamination from atmospheric gases and achieve precise alloy compositions.
Vacuum / Inert Hot Pressing
Consolidation of powder materials under heat and pressure in controlled atmosphere for high-density compound targets.
Hot / Cold Isostatic Pressing
Uniform pressure application from all directions for maximum density and microstructural homogeneity in complex targets.
Electron Beam Melting
Ultra-high purity processing for refractory metals and reactive materials where conventional melting is not viable.
Computer Controlled Machining
CNC machining to tight dimensional tolerances for all target geometries — ensuring precise fit in KDF and MRC cathode assemblies.
Every Target Ships with Full Documentation
Every KDF sputtering target ships with complete quality documentation — giving you full traceability and confidence in material purity and manufacturing consistency from order to deposition.
Included with Every Target
- —Certificate of Conformance
- —Material Purity Certificate
- —MSDS (Material Safety Data Sheet) when required
- —Packaged under vacuum or inert gas as required by the material
Production & Research Quantities
KDF's manufacturing facility is configured for both high-volume production and small research quantities — at competitive pricing for both. Whether you're qualifying a new process or running a mature production line, KDF can supply targets at the quantity and lead time your operation requires.
Targets are dimensioned and qualified for all KDF and MRC cathode configurations. When ordering, provide your cathode model and system series for dimensional confirmation.
Also available from KDF's Process Materials division — sputtering targets for non-KDF system configurations and research applications worldwide.
View Process Materials Targets →Need Sputtering Targets for Your KDF or MRC System?
Contact our team with your cathode model, material, and quantity. We'll confirm geometry, availability, and pricing — including Upsilon Inset™ targets for precious metal applications.
