Generated by All in One SEO Pro v4.9.8, this is an llms-full.txt file, used by LLMs to index the site. # KDF Technologies in line with your process ## Posts ### [Revolutionizing Thin Film Deposition: How KDF’s ERPP Technology Achieves ±1% Uniformity](https://www.kdf.com/revolutionizing-thin-film-deposition-how-kdfs-erpp-technology-achieves-±1-uniformity/) **Published:** July 12, 2025 **Author:** KDF Technologies **Content:** **Revolutionizing Thin Film Deposition: How KDF’s ERPP Technology Achieves ±1% Uniformity** by Firas Mahyob **Summary** Meeting the uniformity and repeatability demands of modern microelectronics and optical device manufacturing requires more than incremental improvements to existing equipment. KDF Technologies developed the Enhanced Rotating Planetary Pallet (ERPP) to address this directly, combining planetary substrate motion with linear scanning to achieve metallic film uniformity better than ±1% and run-to-run repeatability exceeding ±0.5%. This article walks through the design rationale, process results, and practical implications of the ERPP for applications ranging from multilayer conductive barriers in integrated circuits to titanium tungsten coatings used in acoustic filter manufacturing. Metallic coatings deposited using the KDF Enhanced Rotating Planetary Pallet (ERPP) show consistently high film uniformity and tight process repeatability. This performance comes from running planetary revolution and linear scanning simultaneously, where each motion compensates for limitations the other cannot address alone. KDF Technologies has developed both reactive and non-reactive sputtering processes for metallic, semi-metallic, semiconductor, and dielectric materials using this approach. Across a wide range of processes, the system achieves film uniformity better than ±1% across the pallet, with repeatability better than ±0.5% pallet to pallet. These results support high-performance processing of multilayer conductive barriers and contact materials for integrated circuits, as well as titanium tungsten films for adhesion and diffusion applications in microelectronics and decorative technologies. The programmability of the rotating motion also provides control over surface morphology, which is discussed in more detail below. The KDF 900 series sputtering tools combine linear scanning with a sophisticated rotating substrate motion, shown schematically in Figure 1. The planetary motion ensures every area of the substrate sees sputtered material arriving from multiple angles, averaging out the angular distribution of sputtered atoms. The linear scan simultaneously compensates for non-uniform target erosion and variations in plasma density. Together, these two motions maximize exposure to the sputtered flux from all directions and reduce spatial non-uniformities in the sputtering plume. Pallet uniformity and run-to-run repeatability on the order of ±1% were demonstrated across several metallic deposition processes, including tungsten (W) and titanium tungsten (TiW). These capabilities support precise, repeatable processing of complex multilayer metallic coatings for optical devices and semiconductor components. ![KDF 943i Sputtering System with ERPP and linear scanning](https://www.kdf.com/wp-content/uploads/2025/07/Figure-1-the-kdf-943i-sputtering-system-incorporates-the-erpp-technique-alongside-standard-linear-scanning-enhancing-deposition-uniformity-and-process-flexibility-300x220.jpg)Figure 1: The KDF 943i Sputtering System with ERPP and linear scanning. ![KDF Enhanced Rotating Planetary Pallet](https://www.kdf.com/wp-content/uploads/2025/07/Figure-2-kdfs-erpp-enhanced-rotating-planetary-pallet-300x214.jpg)Figure 2: KDF’s Enhanced Rotating Planetary Pallet (ERPP). **Process with Standard Deposition** On standard KDF sputtering tools, metallic films such as W and TiW are deposited onto a 12″ x 12″ pallet deposition zone, which scans across a 15″ x 5″ rectangular magnetron cathode. Deposition is performed via DC magnetron sputtering, either reactively using oxygen or nitrogen with elemental targets, or non-reactively from compound targets. The cathode is engineered to optimize uniformity for metallic films, achieving an average thickness variation of approximately ±2% across four 4″ wafers mounted on a planetary rotating pallet. Figure 2 presents a 6″ wafer configuration of KDF’s Enhanced Rotating Planetary Pallet system. **Process with System Enhancement** In advanced microelectronic applications, tungsten films are commonly used as critical layers within frequency-selective components such as surface acoustic wave (SAW) and bulk acoustic wave (BAW) filters. For Solidly Mounted Resonator (SMR) configurations in BAW filters, multilayer silicon-based stacks require film uniformity and run-to-run thickness repeatability on the order of ±1%. Since resonant frequency is inversely proportional to the thickness of the constituent layers, including tungsten, precise thickness control is essential for accurate frequency tuning. KDF 900 series sputtering systems, equipped with three- or four-target configurations, precisely controlled scan speeds, and multistep recipe capabilities, handle these demanding deposition tasks well, offering fine resolution in film thickness across complex multilayer stacks. To achieve stringent film uniformity targets without incorporating uniformity apertures, a new pallet design was introduced: the Enhanced Rotating Planetary Pallet. The ERPP maintains the linear translation characteristic of standard KDF systems. ![Sheet resistance vs. set point values for tungsten film](https://www.kdf.com/wp-content/uploads/2025/07/Figure-3-a-decrease-in-sheet-resistance-with-increasing-set-point-values-suggests-potential-microstructural-improvements-such-as-enhanced-film-density-or-grain-structure-266x300.jpg)Figure 3: Sheet resistance decreasing with increasing set point values, suggesting microstructural improvements in film density or grain structure. On top of the pallet sits a rotating platform, referred to as the “sun,” which can rotate continuously across a broad range of speeds. Mounted to this platform are four wafer holders, each accommodating a 4-inch-diameter wafer, referred to as “planets.” Each planet rotates at a fixed gear ratio relative to the sun, generating a full planetary motion of the wafers within the deposition plane. This motion is superimposed onto the standard linear translation of the pallet underneath the target. By integrating both rotational and translational movement, the planetary architecture averages out spatial variations in deposition rate across the cathode, improving uniformity across all wafers and reducing edge-to-center thickness variation. Step coverage on 3D features is also expected to improve, as varying the incident angle of deposition during rotation should benefit coating of high-aspect-ratio structures. Figure 2 illustrates the schematic configuration of the Enhanced Rotating Planetary Pallet. ![Pallet uniformity results for tungsten and TiW films](https://www.kdf.com/wp-content/uploads/2025/07/Figure-4-pallet-uniformity-improved-with-increasing-set-point-values-indicating-enhanced-deposition-consistency-across-the-wafers-surface-255x300.jpg)Figure 4: Pallet uniformity results for W and TiW films deposited with the ERPP-enabled KDF 900 system. ![Surface roughness vs. set point values](https://www.kdf.com/wp-content/uploads/2025/07/Figure-5-surface-roughness-decreased-with-increasing-set-point-values-indicating-enhanced-surface-quality-while-maintaining-consistent-thickness-258x300.jpg)Figure 5: Surface roughness decreasing with increasing set point values. ![ERPP uniformity chart](https://www.kdf.com/wp-content/uploads/2025/07/Uniformity-chart-erpp-300x131.jpg)Uniformity chart: ERPP performance across pallet. **Results** Tungsten and titanium tungsten films were deposited non-reactively using elemental W and TiW targets. Figures 3 through 5 summarize the results obtained using the ERPP technique. Figure 3 shows a reduction in sheet resistance with increasing setpoint values under constant linear scanning conditions. Wafer rotation during sputtering was found to significantly improve thin-film uniformity by averaging out the spatial non-uniformities inherent in the sputtering process, stabilizing critical film properties such as sheet resistance. Figure 4 presents the uniformity results for W and TiW films deposited with the ERPP-enabled KDF 900 system. The planetary scanning motion consistently achieved within-wafer uniformities better than ±1% and pallet-wide uniformities better than ±2%, confirming the system’s capacity for high-precision film deposition. Table 1 summarizes the performance of planetary scanning for TiW depositions using a standard 15-inch cathode. Figure 5 shows improvements in surface roughness alongside the uniformity gains. The relationship between wafer rotation and surface roughness is not straightforward. Depending on process parameters such as rotation speed, deposition pressure, and target power, surface roughness may increase or decrease. Careful optimization of sputtering conditions is therefore needed to achieve the desired film characteristics for each application. **Discussion** The planetary scanning substrate carrier demonstrated meaningful improvements in both film uniformity and run-to-run repeatability. Non-reactive metallic film uniformities were reduced from typical values of ±2% to less than ±1% across the pallet. This improvement came directly from combining planetary rotation with linear translation, where each motion addresses a different source of non-uniformity in the deposition process. The technique shows potential for other film types as well. Investigations are currently underway into its advantages for optical films and features with high aspect ratios. The ERPP architecture is also compatible with integration of a Plasma Emission Monitoring system and DC Pulsing, which would expand the range of processes and control options available to the operator. **Categories:** Blog, News **Tags:** ERPP technology​, thin film deposition --- ### [Precision without Poisoning: Plasma Emission Monitoring in Reactive Sputtering with KDF Technologies](https://www.kdf.com/precision-without-poisoning-plasma-emission-monitoring-in-reactive-sputtering-with-kdf-technologies/) **Published:** April 8, 2025 **Author:** KDF Technologies **Content:** In the high-stakes world of thin film deposition, especially for functional oxides, nitrides and other compounds made by reactive sputtering with metals, precision is everything. For example, slight variations in nitrogen content can impact the color of titanium nitride films dramatically. Figure 1 shows a variation in color, based on nitrogen content, for titanium nitride thin films deposited by reactive sputtering. Reactive sputtering, when done precisely, walks the fine line between optimal compound formation and catastrophic instability caused by target poisoning. ![](https://www.kdf.com/wp-content/uploads/2025/04/Titanium-nitride-doped-300x115.png)**Fig 1: Samples of Titanium Nitride thin films that are overdoped or under doped with nitrogen. (Ref: N. Franzer, KJLC)**For scientists and process engineers new to the field of thin film deposition, one critical lesson must be learned: *the difference between success and failure in reactive sputtering lies in millisecond-level process control*. This is where Plasma Emission Monitoring excels as a process control tool and why KDF Technologies has emerged as a leader in enabling production-grade precision on its in-line batch thin film sputtering systems. **The Reactive Sputtering Challenge** Reactive sputtering involves doing some inorganic chemistry in the sputter plasma, or at the surface of the substrate. That is a discussion for another article. Typically, a metal target is sputtered and the resulting sputtered adatoms collide and react with active gases, such as oxygen or nitrogen, introduced into the system, forming the desired product, such as SiO2 or TiN, as a thin film. Unfortunately, during the reactive sputtering process, if not controlled properly, some of the reacted material re-deposits on the surface of the target, masking some portion of the metallic sputter track, preventing it from being sputtered as a metal. If a sufficient amount of reacted material blankets the surface of the target, it becomes ‘poisoned’, where an insulating, non-metallic, layer builds up on the target surface causing the sputter rate to crash. Figure 2 shows the impact of nitrogen reactive gas flow on deposition rate, as the target gets poisoned. ![](https://www.kdf.com/wp-content/uploads/2025/04/Deposition-rate-collapse-300x232.jpg)**Fig 2: Nitrogen Flow Rate and Deposition Rate, showing the collapse in Deposition Rate with a Nitrogen Overpressure.**The goal? Stay in the sweet spot of the deposition process where sufficient reactive gas is supplied to make the desired film, without an excess of reactive gas causing re-deposition and poisoning at the target surface. Achieving this balance requires real-time feedback and sub-second responsiveness, which traditional gas delivery systems, like mass flow controllers, with their 250 millisecond response times, struggle to deliver. **Enter Plasa Emission Monitoring: 100 Millisecond Insight** KDF Technologies’ Plasma Emission Monitoring System (PEM) provides a solution to precision control of reactive thin film deposition processes with near 100 millisecond response times to changes in plasma conditions that promote poisoning. This is more than twice as fast as conventional mass flow controllers which work off of total system pressure, for instance. The monitoring of optical emission spectra of ionized species, rather than total system pressure, provides near instantaneous insight into the chemical composition of the plasma and serves as a window into the composition of the thin film as it is deposited. If the reactive gas species, for example nitrogen or oxygen, begins pushing the limits of the process and threaten to move the gas mixture out of the ‘sweet spot’ toward poisoning, the PEM system will detect an unfavorable mixture of precursors and automatically, within 100 ms, adjust the reactive gas flow- in real time. ![](https://www.kdf.com/wp-content/uploads/2025/04/Target-poisoning-.png)**Fig 3: An example of Target Poisoning based on Nitrogen Flow Rate, and the Hysteresis where reactive gas flow rate can be reduced and the target surface cleansed. (Ref: W. Sproul, US patent # 4,428,811 Jan 31, 1984).**This is more than monitoring the condition of the plasma, it is about *control*. The PEM systems provides a closed-loop feedback mechanism, which dynamically stabilizes the deposition process while maintaining conditions which optimize sputtering and deposition rates as well as film stoichiometry. **Batch Production with Precision: The KDF Advantage** KDF’s in-line sputter systems benefit from 50 years of experience providing batch thin film production for industries including medical, electronics, solar panels, and sensors. The systems are particularly suited for batch production of high-performance nitrides and oxides through a combination of mature, robust, system design and PEM controls. Key System Features Include: - **Optimized Gas Rings:** These gas-channeling structures send reactive gases directly into the sputter plasma at the target surface where they will be most effective, in terms of reactivity and stoichiometry control, particularly with challenging gases like diatomic nitrogen. - **Fast-Response Mass Flow Controller Placement:** KDF systems are designed so that there is minimal latency between a control signal and the flow control function, by positioning the mass flow controllers adjacent to gas injection sites, minimizing delays, enabling the rapid modulation of flow required to avoid target poisoning. - **Pulsed DC, RF and HiPIMS Power Options:** PEM control regimes have response times fast enough to provide precise process control for a range of power supply types and deposition techniques, including High Impulse Power Magnetron Sputtering (HiPIMS). - **Advanced Sputter Source Design:** KDF’s novel cathode designs are optimized for reactive sputtering by minimizing the target area subject to poisoning. While maintaining the highest sputter rates, this also reduces arcing, extending target and cathode lifetimes while improving run-to-run process consistency. - **Integrated Software Suite for Intuitive Operation:** KDF’s propriety deposition system control software provide superb visual representations of process status, PEM data, and logs of all system parameters for traceability. The system is also designed to recover from faults, like running out of process gas, without compromising process integrity. **Process Development and Repeatability** One key advantage of any complex deposition system is the ability to quickly develop recipes for the deposition of new materials. KDF systems, equipped with PEM, can utilize a single emission setpoint as the central parameter for tuning a process to produce specific film compositions, reducing the need to endless process iterations to find the ‘sweet spot’. With a ‘tuned’ process in hand, it can be run multiple cycles with minimal drift, due to the ability of the PEM system to adjust reactive gas flows to accommodate the variations in plasma composition due to target aging. This is even more critical in multi-layer, thin film stacks, like thin film batteries and solar panels, where deficiencies in one layer degrade the performance of the entire stack. **Why it Matters** The application of thin, functional, films is ubiquitous, with nearly everything in our daily lives somehow enhanced with a coating of thin films. From semiconductors, to optics, to energy generation and storage, the demand for advanced, high-precision, coatings is growing and will likely never by supplanted by other approaches. These advanced films require extreme stoichiometric controls, combined with thickness uniformity, and process reproducibility. For scientists and engineers working at the cutting edge of technology, these features are non-optional and mission critical. KDF’s fully integrated solution simplifies process development while offering unmatched speed, precision, stability, uniformity, and repeatability. **In line with Your Process** In reactive sputtering, the race is not won by speed alone – but with *precision at speed*. KDF’s in-line, batch thin film coating systems, with integrated Plasma Emission Monitoring, provide a robust, industry proven, platform with real-time process intelligence. The system is designed to keep reactive deposition processes in the metallic regime while achieving the highest possible deposition rates, and complete control over film stoichiometry. KDF’s advanced systems keep you in line with your process. **Categories:** Blog, News **Tags:** Plasma Emission Monitoring --- ### [Built for Production. Trusted for Repeatability. Backed by Kurt J. Lesker Company](https://www.kdf.com/built-for-production-trusted-for-repeatability-backed-by-kurt-j-lesker-company/) **Published:** July 1, 2025 **Author:** KDF Technologies **Content:** If you’re a production engineer, you know what matters: **repeatable results**, **rugged equipment**, and **tools that scale with your line**—without surprises. KDF Technologies, part of the **Kurt J. Lesker Company**, delivers **linear in-line sputtering systems** that are the **gold standard** in reliability and performance. Whether you’re coating medical devices, razor blades, or solar display substrates, our systems are built to run—day in, day out—with minimal downtime and maximum consistency. **Why KDF?** ✅ **Repeatability You Can Rely On** Advanced process control, PEM, and stable reactive gas delivery ensure consistent coatings across batches and substrates. ✅ **Rugged, Production-Grade Design** Our systems are engineered for real-world manufacturing—built to last, easy to maintain, and ready for high-volume throughput. ✅ **Inline Architecture That Scales** Dual-pallet load-locks, high vacuum pumping, and optional pallet stackers support high-mix, high-volume production with minimal operator intervention. ✅ **MRC Legacy, Fully Supported** We are the only provider that fully supports and services legacy MRC sputtering systems—offering upgrades, parts, and process continuity. ✅ **Backed by Kurt J. Lesker Company** You benefit from the global support, vacuum expertise, and long-term reliability of one of the most respected names in thin film technology. **Categories:** Blog, News **Tags:** KDF Technologies --- ### [KDF Announces the Release of its New Improved Pallet Assist Tool, PAT](https://www.kdf.com/kdf-announces-the-release-of-its-new-pallet-assist-tool-pat/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2019 KDF is pleased to announce the release of its new Pallet Assist Tool, PAT. Because of the ever-increasing substrate and pallet sizes in today’s market, KDF recognized the need for a device that would allow the operators safe and efficient handling of these larger pallets. This device will aid workers with heavy lifting and unloading of pallets from an [oversized pallet delivery service](https://www.plexusfreight.com/pallet-delivery/). After much field and vendor investigating for similar products on the market (critical placement and clean room compatible), KDF tasked upon its engineering staff to design and manufacture a pallet handling tool to aid in the loading and unloading of pallets into the Load lock chamber of its 744i and 844i systems. The KDF designed manipulator can safely handle 100 lb payload pallets for both loading and unloading in a precise and controlled fashion. The tool is also integrated and interlocked for operator and system safety. Although originally designed for large glass substrates the tool can also stream line smaller substrates and wafer pallet loading as well. The pallets can be loaded in a vertical or horizontal position and can be rotated a full 180 degrees. Combined with the use of a [shrinkfast 998](https://shrinkwrapcontainments.com/p-34-shrinkfast-998-ul-heat-gun-kit.aspx) heat gun, this makes shrink wrapping the substrates onto the pallets an easy process. The positioning can also accommodate transfer to a customers transport cart by varying the horizontal placement height. The PAT device allows for simple smooth handling utilizing controlled stepped detents riding on linear rail bearings along with twin pneumatically assisted gas cylinders that virtually eliminate any type of operator lifting of heavy payloads. The PAT helps to speed up and insure safe placements of sensitive substrates onto the pallet, thereby increasing Fab productivity and minimizing any substrate damage or breakage due to excessive handling. \# # # **Categories:** News **Tags:** Pallet Assist Tool, substrate handling​ --- ### [KDF Tools Selected for Installation in the USA and Mexico for Use in Manufacture of Pacemaker Components](https://www.kdf.com/kdf-tools-selected-for-installation-in-the-usa-and-mexico-for-use-in-manufacture-of-pacemaker-components/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2010 ### 954i Sputtering Systems Proven Leaders In Medical Device Production Feb. 11, 2010–KDF today announced that a leading industry supplier has selected two of its 954i in-line sputtering system for use in manufacturing pacemaker components. The order verifies that KDF’s technology platforms continues to meet rigorous standards for producing advanced medical devices. The 954i for its ability to create dense adherant coatings, a crucial aspect of medical manufacturing since each device is expected to perform flawlessly. The KDF 954i features Inset(TM) style cathodes, a cathode design that provides long lifetime and high utilization for thick coatings, like those that are used to protect critical pacemaker components. There is no margin for error in pacemaker manufacturing applications and KDF’s superior coating technology meets these standards. As a new customer of KDF critical evaluations had to be met on performance of he 954i provides the process integrity required for producing high stakes medical devices like pacemakers,” said Todd Plaisted, director of marketing. “KDF already maintains a presence in the medical devices market and this order has continued our market penetration for this industry.” KDF offers advanced and reliable batch in-line sputtering systems at the industry’s lowest cost of ownership. These systems are used around the world in the semiconductor, telecommunications, aerospace and medical technology markets, each tailored to meet specific processing needs. For the this process KDF configured the 900 Series system with a newly developed phased dual cathode sputter capability for higher throughput while achieving greater target material utilization. With sputter down capability and easy substrate loading, the 954i is ideally suited for medical applications which produce uniform films with an exacting, but repeatable, high-throughput process. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** Blog, News **Tags:** pacemaker manufacturing, sputtering systems --- ### [KDF Tools Selected for Installation in the USA and China for Use in Manufacture of High Efficiency PV Solar Cells](https://www.kdf.com/kdf-tools-selected-for-installation-in-the-usa-and-china-for-use-in-manufacture-of-high-efficiency-pv-solar-cells/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2012 ### 943i Sputtering Systems for Production of High Efficiency Ge & CIGS PV Solar Cells March 16, 2012–KDF today announced that two leading industry Photovoltaic suppliers have selected Three of its 943i in-line sputtering system for use in PV Solar Cell manufacturing. The order verifies that KDF’s technology platforms continue to step-up to producing advanced Solar PV devices. The 943i for its ability to adapt to changing solar cell process technology, a crucial aspect of space-based PV cell manufacturing since each device is expected to perform in the extreme conditions of space. KDF’s superior coating technology meets these standards. The solar cells need to perform in different conditions. This doesn’t just mean the weather. Hot or cold, it’s also the connected appliances. It’s always a smart idea to check with your [solar charge controller supplier](https://www.zonnaenergy.com/solar-system-parts-supplier/solar-charge-controller-supplier/) to see if the cells of the solar panel, are compatible with the controller. This can have a negative effect on your system if they don’t match or aren’t compatible. Check with the one handling your [solar panel denver](https://suntalksolar.com/solar/) installation before you make your choice to be certain it will all work. As new customers of KDF critical evaluations had to be met on the performance of the 943i provides the process integrity required for producing high-reliability devices,” said Todd Plaisted, director of marketing. “KDF already maintains a presence in the Solar Photovoltaic market and this order has continued our high-efficiency niche market penetration for this industry.” KDF offers advanced and reliable batch in-line sputtering systems at the industry’s lowest cost of ownership. These systems are used around the world in the semiconductor, telecommunications, aerospace and medical technology markets, each tailored to meet specific processing needs. For this process KDF configured the 900 Series system with a newly developed Bi-Polar dual cathode sputter capability for stable reactive processing, a first in the 900 series system. With sputter down capability and easy substrate loading, the 943i is ideally suited for Solar Cell PV applications which produce uniform films with an exacting, but repeatable, high-throughput process. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** PV solar cells, sputtering systems --- ### [KDF News Article as seen in the April 2013 issue of Vacuum & Coating Technology magazine](https://www.kdf.com/kdf-news-article-as-seen-in-the-april-2013-issue-of-vacuum-coating-technology-magazine/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ### Pirates Abound: The Problem with IP for OEM’s ###### BY KURT FLECHSIG, KDF\[spacer height=”20px”\] There is a growing concern within the competitive semiconductor industry about re-builders and third party companies that make a business from copying the IP of others and then try and spin it into the term of Reverse Engineering. The last time I checked that term is just a PC way of saying you’re not STEALING. Activity of this nature can best be referred to as Pirating since it best describes their activity. As an OEM we develop our core competencies to bring a higher level of value, knowledge and capabilities to our customers rather than the pirate companies whose premise is to pretend to bring value added to a product they have no rights to. In todays’ cutthroat, price is all that matters society, the assault against OEM’s is relentless, specifically sputtering cathodes, gas cooling and proprietary software development. Customers seem to lose sight of the benefits when dealing with the OEMs that actually spend the money and create the knowledge base while developing these new concepts and products that other people try to leverage off of. When the foundations of OEM’s are chipped away by the unsavory practices by these Pirate run companies, it will eventually hurt the customer in the long run. Some third party rebuilders will argue that original OEM’s that have gone out of business are fair game for them to offer their alleged parts and services to keep such equipment running. I would say that why would one want to deal with a company that does not have direct ownership of a product, or the insight behind the design of said product. The company you deal with should have the original parts, knowledge, and documentation to support such, otherwise you’re dealing with a lookalike replica product which will not perform or last as the original design intended. As an example of such things I will illustrate some of the issues that face new equipment people. Many pirates install a low-cost PLC retrofit controller with minimal software coding and features to replace the original systems controller. More often than not these controllers are used components or outdated models which allows having a greater profit on the goods sold while providing an inferior product to the customer. Our company provides the newest PLC systems which use a higher end controller than what the pirates offer. To ensure consistency of product, valued service and continued technical support, companies should rely on the original manufacturer’s software knowledge and not an outside source. Customers afflicted by these pirates have suffered a multitude of problems due to false claims and poorly developed software. These include, but are not limited to out of date versions of software, copies of nonlicensed software, providing shareware as an operating system, and not owning a legal copy of development software licenses. These kinds of poorly developed software are not created with [static analysis](https://blog.parasoft.com/how-does-static-analysis-prevent-defects-and-accelerate-delivery) practices or software testing customs in mind. In the fast-paced digital age, the importance of static code analysis cannot be ignored. Our core competency is to make Brand new equipment which includes large investments in Engineering and Process Development for the systems we design, prototype and build. As an OEM we make investments into the R&D aspect of our products lines and we spend a great deal of resources to do so. KDF had designed upgrades into even our oldest product lines which go back 25 years, as an OEM we also continue to offer upgrades for our Legacy systems. KDF provides re-manufactured MRC/KDF tools as a cost savings to the customers with smaller budgets ,while still maintaining a high level of quality. Furthermore, there is a big price point difference between remanufacturing and just performing a software upgrade. Re-manufacturing has the benefits of buying a new tool but at a reduced price. A customer most always keep in mind that certain obsolete components need to be replaced during the re-manufacture in order to ensure the tool is current and supportable for spare parts in the continuing future of the tool. The Pirate will frequently copy KDF’s Cathode or Magnet IP and then tried to pass it off as improved. They tout better system utilization but the truth is customers lose out on uniformity or overall performance. Cathodes are designed for a long manufacturing life, yet pirate replacements often do not stand up to longterm use and cost customers more money over time. As an OEM we have produced thousands of new cathodes, and we track and record the data to back up the performance of our Cathodes. In order to have a successful purchase customers expect and need a company that can supply process support. We have made this investment in thin film expertise and have the metrology instruments and personnel to supply such. A KDF system will leave our production floor with a qualified process running in that tool and arrive at the customer’s site ready for production. In some situations, our staff will visit a customer’s site to provide service and support after one of these re-building companies has intervened. The typical dysfunctional equipment is now riddled with systemic problems along with processes that do not work. While we have a policy of not working on third party sys-Pirates Abound: The problem with IP for OEM’s By Kurt Flechsig, KDF tems, we can sometimes help by supplying parts and offering alternate means of repair. The majority of these customers usually end up paying more for the product and suffering with longer downtimes. We have seen many of these re-building companies come and go along with customers’ trust and budgets. The best way to avoid these problems is to steer clear of these pirates in the first place. Don’t be lured in by low prices and software screen money shots. Before making a purchasing decision, refer to these tips to ferret out pirates: - Documentation: Will the company provide software documentation that reflects their actual product? Software documentation should always be provided and not be left up to the imagination of the user. - Will the company provide the source code? This is a red flag and, generally, should not be done. The vendor should retain ownership in order to provide the full service required over the life time of the tool. - Can the vendor provide a safe code? A system may be able to run on 10k lines of code when it has no recovery actions or well written safety protocols. - Who develops and updates the software, employees, third party or students? The level of experience of the developer is crucial for installation and ongoing service of the tool. Many times the code is created by an additional third party. - Does your supplier own any of the rights to the equipment they are supplying? - Can the vendor supply accurate prints and documentation about the components in the tool that do belong to them? - Can the vendor supply full technical support for the tool and the process running in it? - Can the supplier provide authentic references of actually customers with working equipment? - Are you buying a reversed engineered tool and a one of kind system? - Does the vendor supply new components, or rebuilt third party parts, aka pumps, power supplies, feed-throughs, or instruments? - Does the vendor you have off site back up and file protections for all of their product aspects? - Full remote backup via the internet, with in-house software engineers. - Does the vendor have a full in-house Application Lab staffed with process literate scientists? - Is the system safe? Does it meet any SEMI, S2, CE, NEC or NFPA standards? As an OEM our company stands behind MRC and our own KDF systems. We are the sole official owner of MRC sputtering tools. Furthermore, we have programs in place in which we improve upon our current designs as well as ensure consistency and performance. We also are working with customers to develop new processes and hardware. Our in-house experienced software , mechanical and electrical engineers continually strive to develop products with the most up-to-date improvements and revision control. This is the key that will open the door to customers’ advanced process needs for their sputtering systems, and help them to meet their goals. [View the original article](https://bit.ly/1bmjt5f) \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** Blog, News **Tags:** IP piracy, semiconductor industry​ --- ### [KDF Capabilities 'The Past is Prologue’](https://www.kdf.com/kdf-capabilities-the-past-is-prologue/) **Published:** March 2, 2016 **Author:** Vishal Agrawal **Content:** #### KDF was founded in 1986 however it was really born in 1957 with the beginning of Materials Research Corporation, which became a world leader in vacuum processing technology. As often happens in the cycle of Industry there are births and rebirths with a new enterprise formed from the elements of a past Firm, KDF is one of these. KDF was created during one of the now too common downturns in the Semiconductor industry when the equipment companies discarded anything not perceived as mainstream front-end chip related. Materials Research Corporation, MRC, like others started leaving behind these other applications in pursuit of being the DRAM and CPU ‘Top Gun’ equipment supplier. KDF has, from that beginning, focused on servicing the customer in all aspects from custom integration and system design to individual maintenance planning. KDF has not left behind the semiconductor industry; we have taken the position of not leaving any application that we are capable of supporting and supporting well, behind. As the large front-end semiconductor companies moved on in their almost single-minded pursuit a vacuum was left behind where customers wanted a ‘technology leader’ or ‘best of breed’ sputtering system but they weren’t necessarily coating silicon wafers. They may have been able to utilize the new cluster tool generation of systems coming out and even if sub-micron high-aspect via filling wasn’t on the wish list the stupendous cost of the systems was simply overwhelming and could not keep them in a competitive position. Here is where KDF has moved in and established a position as a leading provider of small and large area multi cathode inline sputtering systems that are evolved from a world standard MRC design. These systems were the first commercially manufactured semiconductor sputtering system with an installed base that grew to over 3,000 systems worldwide and is still growing today. ### KDF today is a system provider to a large and diverse customer base covering a wide range of markets and applications. Here are some examples; DWDM components, laser diode mirrors, digital micro mirrors, replicated diffraction gratings, Super lattice structures, X-Ray Mirrors, super-bright LEDs, ring laser gyroscopes, high power solid state lasers, large area digital X-Ray detector plates, OLED displays, TFT displays, pace maker components, PZT sensors & actuators, Si , GaAs, Ge and other (all) compound semiconductor devices, micro switches, photo masks, reticules, SAW & BAW devices, hybrids and resistor products, superconductor filters, photovoltaic, MCP night vision optics, MEMS-microsystems-nanotechnology, DNA and other medical sensors, thin film magnetic read write heads, HDI & MCM, multilayer nanocomposites, optical fiber coatings, and more. KDF is a small company comprised of less than 50 individuals but one that has over 500 person years of experience in-house today and a heritage that goes back to 1957 with thousands of system delivered, hundreds of ‘specials’, dozens of designs and a few truly unique systems. We at KDF strive to maintain integrity with our customers through our systems and our support as a partner. **Kurt Flechsig** *President & CEO* **Categories:** Blog **Tags:** KDF history, vacuum processing​ --- ### [End of Life](https://www.kdf.com/end-of-life/) **Published:** July 30, 2016 **Author:** Rad Horak **Content:** ### KDF acquired the MRC batch product line in 1986 and to that extent we have been supporting and maintaining those customers whose chose to continue with this product line for the last thirty plus years. The support consisted not only of service, repairs and part sales but also selling factory reconditioned MRC tools which KDF supported and kept under warranty. KDF also maintained a vast inventory of spare parts to support this generation of equipment as well as a working service support system on the factory floor. For those customers that were MRC users over the years many have migrated to the KDF line which allowed for a seamless transition of enhanced compatibility and familiarity both in vertical and horizontal sputtering. For those customers who have migrated to the family of KDF sputtering systems KDF ‘s roadmap and policy of “no tool left behind” has allowed for them to upgrade their systems over the years as the technologies and components utilized in the tools has evolved or gone obsolete. ##### For MRC users the end of life for these tools has approached the event horizon. One of the benefits of crossing over is that it allows for the customer to take advantage of KDF’s complete applications lab that can assist you with transferring process requirements from MRC to KDF and can be done prior to delivery of your new equipment thus insuring minimum start up time. By migrating to the KDF line of tools many consumable parts that you may have significant inventories of may be able to be utilized on the equipment such as cathodes, targets and shied sets. This alone offers a cost advantage over another competitor’s tool. Trade in credit is also available for certain MRC systems. Contact Todd in Sales for more information. 201-784- 5005. ##### Prudently planning a conversion or trading in your old tool now to the KDF equipment line will minimize a lengthy unplanned tool down situation. \[spacer height=”5px”\] As always please don’t hesitate to contact KDF for a quote or for any other of your service or system needs. > **Jac P Gnirrep** > *Director of Customer Satisfaction* > **Categories:** Blog, News **Tags:** equipment migration​, MRC sputtering systems --- ### [Obsolete Operating Systems](https://www.kdf.com/obsolete-operating-system/) **Published:** July 30, 2016 **Author:** Rad Horak **Content:** ### You have been identified in our equipment database as being a KDF “T”, “GT”, “NT” or early “i” sputter system owner who is still using either the obsolete Brooks Techware controller and/or the obsolete MKS 146 gauge package. Most recently Microsoft has announced as well that its support of the Windows XP operating system has ceased, leaving owners of such vulnerable to both malicious and damaging interruptions. The KDF equipment still using these items can now be 30yrs.old. In regards to the Techware controllers Brooks support both from themselves and through their designated second and third parties ended almost 15 yrs. ago. Replacement hardware availability is now non-existent. MKS had also announced many years back the end of the popular 146 vacuum gauge controller, due to component obsolescence. MKS support for the gauges which was limited to stock of these obsolete components ended this year. (The 146 was used extensively on GT and NT systems) To that extent KDF has developed and produced a 146-gauge replacement package that is available to customers who are already running on the KDF “i” controller platform or to customers needing the full upgrade. The package includes the MKS series of “Smart” gauging coupled with a VAT throttling gate valve. T and GT system owners already face additional obsolescence with the SX and MKS 287 & 290 controllers as well as NT users who are now also experiencing PC hardware obsolescence. Once upgraded to the “i” series the system can be further enhanced with options and upgrades to improve reliability and performance. Some of the available upgrades include a CPU, Windows 7 replacement kit, a load lock linear positional transducer, zeta scan velocity profiling controller, enhanced power supplies and new load lock heat pallet temperature measurement and control feature utilizing an optical sensor. Customers that have already upgraded to the KDF “i” controller have insured themselves against further component obsolescence and unplanned down time. All upgraded systems operate on the same platform as the new KDF “i” systems (Windows 7) thus insuring years of compatibility and ongoing enhancements. All upgraded systems now have on line system available remote help from KDF. For GT and NT system owners the system can be upgraded in the field typically within a week thus minimizing system down time and bringing your upgraded system back on line quickly. “T” systems typically take longer based upon the system’s configuration and are returned to the factory for full blown upgrading and reconditioning. In the past 10 yrs. KDF has successfully upgraded numerous systems both in the U.S., Europe, and the Pacific Rim. All upgrades include KDF’s ESP online Internet support Webex) See individual cut sheets for system type upgrade pricing. ##### Prudently planning a conversion now to the updated platform will minimize a lengthy unplanned tool down situation. (12-16 weeks) \[spacer height=”5px”\] As always please don’t hesitate to contact KDF for a quote or for any other of your service or system needs. > **Jac P Gnirrep** > *Director of Customer Satisfaction* > **Categories:** Blog, News **Tags:** obsolete controllers​, sputter system upgrades --- ### [Solutions in Action](https://www.kdf.com/solutions-in-action/) **Published:** February 25, 2017 **Author:** Rad Horak **Content:** ### Today’s consumers are accustomed to a certain level of imperfection in electronic devices. An LED flashlight may fail. A laptop may no longer boot up the way it did just yesterday. But while these everyday equipment deficiencies may be accepted as part of modern living, the stakes are much higher when it comes to medical devices. “Our customers in the implantable medical device industry demand the highest level of quality and precision,” said Todd Plaisted, director of marketing, KDF. “Equipment failure to perform is simply not an option for companies that produce pacemakers and defibrillators.” ###### ![844i Series systems](/wp-content/uploads/2022/09/800i.jpg) **Like all KDF sputtering tools, 844i Series systems are designed to meet demanding processing requirements and feature an intuitive interface to monitor parameters.** \[spacer height=”30px”\] Founded in 1986, KDF is a leading supplier of physical vapor deposition (PVD) batch inline sputtering tools. These vacuum coating systems are used in the production of mainstream silicon, emerging materials, fl at panel displays, optical communications and medical devices. From headquarters in Rockleigh, New Jersey, KDF serves a global customer base and supports more than 3,300 systems in the field. > “More than half of the semiconductor fabs in the world use a KDF system in wafer processing,” Plaisted said. “And we extend the same quality the medical device market demands to all industries we serve.” Virtually always located in a cleanroom environment, sputtering tools precisely deposit thin films of various materials, metals and/or dielectrics onto a substrate. Next, the wafers typically enter etching or patterning equipment. Depending on the application, the substrate can return to the sputtering system several times during the manufacturing process to add different layers. “Recipe management is critical throughout this process,” said Marc Fregeau, software development manager, KDF. “We develop all the programming for our customers – and update the software for them as their processes change.” As more companies embrace contract fabrication, recipe control and monitoring has become increasingly important. In this emerging business model, a manufacturer provides fabrication services for a wide range of customers – each requiring different processes. In 2010, KDF adopted a Rockwell Automation® control and information platform for their equipment featuring an Allen-Bradley® CompactLogix™ controller and an RSView®32 HMI solution. “The initial control solution met our requirements,” Fregeau explained. “But as our customers’ process requirements became more demanding, we needed a more robust visualization solution that could grow with us.” To enhance system performance, the company recently migrated to a FactoryTalk® View Site Edition (SE) HMI platform. In addition, the company opted for a CompactLogix 5370 controller (L36ERM), which features faster processor speeds and supports up to 16 axes of integrated motion over an EtherNet/IP™ network. “Moving from the 32-bit HMI to the 64-bit FactoryTalk View solution was key,” Fregeau explained. “It provides a framework for an easy-to-use recipe management system – and the capacity to meet the demand for real-time information in a complex process environment.” KDF systems are designed to monitor all process parameters including power supply voltages, sputter gas pressures/ratios, residual gas analyzer (RGA) background species vacuum integrity checks, substrate temperatures and more. The FactoryTalk View application helps enable real-time operator monitoring of those parameters through intuitive displays – and provides an audit trail of operator and alarm information in a centralized log database for absolute process validation. “If there’s a process anomaly, the data logging helps determine the root cause,” Fregeau said. “The system also allows us to actively take ‘snapshots’ of the process in real time for reporting purposes.” As an option, KDF customers can add FactoryTalk Historian to their system. FactoryTalk Historian features built-in connectivity to FactoryTalk View and provides robust, high-speed data collection and analysis capabilities. For efficient system development, KDF applies the same Rockwell Automation control and visualization platform across its complete machine portfolio. “Our sputtering tools share many components – as well as the control system,” Plaisted said. “A shared platform allows us to develop versatile equipment very cost-effectively.” Looking toward the future, KDF is positioned to respond to fluctuating customer requirements – and an unpredictable marketplace. “We are constantly changing,” Plaisted said. “And the Rockwell Automation control environment allows us to configure our tools and make changes as we need them.” [View the original article](https://literature.rockwellautomation.com/idc/groups/literature/documents/ap/oem-ap501_-en-p.pdf) **Categories:** Blog, News **Tags:** PVD sputtering, thin film deposition --- ### [LMM™ – Linear Moving Magnet Cathode](https://www.kdf.com/lmm-linear-moving-magnet-cathode/) **Published:** January 6, 2021 **Author:** Rad Horak **Content:** The Linear Moving Magnet sputter cathode – LMM™ cathode, is a patented full face erosion rectangular design and it is available for all KDF systems. We continue to innovate this field proven LMM™ cathode design so that our clients now have the full capability to run RF depositions and full dielectrics can be deposited. The LMM™ cathode offers high material utilization with minimized re-deposition resulting in reduced particulates. The LMM™ cathode enhanced design advances the capability to work in DC pulse reactive sputter mode with all materials. A Magterial™ version of the LMM™ cathode is available providing the ultimate in utilization and lifetime when sputtering magnetic materials such as Nickel. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** Blog, News **Tags:** LMM cathode, sputtering technology​ --- ### [KDF 844i Batch Sputtering System Enhancements](https://www.kdf.com/kdf-844i-batch-sputtering-system-enhancements/) **Published:** January 6, 2021 **Author:** Rad Horak **Content:** The KDF 844i Batch Sputtering System has been re-engineered and updated. KDF introduces many new upgrades and enhancements that allow our clients to process heavier payloads of up to 140 pounds. These enhancements also include drive improvements to support the processing of such loads. One of the world’s premier razor blade suppliers has chosen KDF as one of their core suppliers over our competition. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** Blog, News **Tags:** batch sputtering, system enhancements --- ### [KDF Enhanced Planetary Pallet for 900i Series Batch Sputtering Systems](https://www.kdf.com/kdf-enhanced-planetary-pallet-for-900i-series-batch-sputtering-systems/) **Published:** January 6, 2021 **Author:** Rad Horak **Content:** KDF introduces the newly enhanced Planetary Pallet design. This enhanced Planetary Pallet design is an internally motor-driven pallet which can hold wafers sizes from 2 to 5 inches in a rotational “sun” and “planetary” motion while the pallet linearly traverses under the deposition cathode. These three motions allow for deposition uniformity that is ranging from better than 2% to better than 1%. Our clients have reported better than 1% uniformity with this enhanced Planetary Pallet in production. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** Blog, News **Tags:** batch sputtering, planetary pallet --- ### [DC Sputtering Cathode Design](https://www.kdf.com/dc-sputtering-cathode-design/) **Published:** July 23, 2021 **Author:** Vishal Agrawal **Content:** Written by Kurt Flechsig 7/23/2021 DC Magnetron sputtering is a means to achieve higher rates of sputtering over that of diode operation. KDF offers various cathode designs ranging from sputtering dielectrics, metals and magnetic materials. We have a cathode design that will fit any of your requirements. Our cathode designs not only take into consideration the sputter rate, but also the utilization and film uniformity as well. The KDF family of cathodes are of Linear design and span various sizes, starting from 5 x 15 inch, 5 x 17 inch, 5 x 24.5 inch and finally our largest 5 x 30.5 inch cathode. All of our designs are lab and field proven with thousands of cathodes sold throughout the world. Today’s magnet packs can be comprised of AlNiCo 5, SmCo and NdFe B depending on the application and design of the cathode. KDF uses all of these types of magnets to create the most productive ionized plasma for a reliable sputter source . When these cathodes are used in KDF inline sputtering systems you can be assured of the best possible outcome of your sputtering job. **Categories:** Blog **Tags:** cathode design, DC sputtering --- ### [What is PVD and Sputtering?](https://www.kdf.com/what-is-pvd-and-sputtering-blog/) **Published:** July 23, 2021 **Author:** Vishal Agrawal **Content:** Written by Ammar Derraa 04/30/2021 ## **Introduction to Thin Film Sputtering** Thin film technology is the process of depositing and characterizing functional material layers on a substrate. These layers are the building blocks of modern devices, like computer and cell phone microchips, which require sophisticated know-how and systematic innovation to meet the ever-changing demands of high technology. Physical Vapor Deposition (PVD) commonly known as sputtering is an established and widely used method in the deposition of thin films and device fabrication. KDF has many years of experience in PVD or sputtering of thin films. It has the talents and tools to deposit and characterize, with high precision, various films ranging in thickness from a few angstroms to hundreds of microns. This covers most applications requiring thin film coating. In addition to its state-of-the-art PVD deposition tools, KDF possesses a variety of in-house metrology tools, and has access to an array of test and characterization facilities through its collaboration with research and academic institutions. The R&D team at KDF has a diversified experience in all areas of thin film engineering, devices, process development and characterization, and process integration. KDF research activities are mostly customer oriented and strongly focused on efficient and competitive sputtering technologies to enable production-worthy processes. ## **Basics of sputtering thin films** Sputtering is one of the most versatile deposition techniques of contemporary thin film technology. It involves the deposition of a material ejected from a source called “target” onto another material called “substrate”. This is accomplished by a bombardment of the surface of the target with gas ions accelerated by a high voltage. Particles of atomic dimensions from the target are ejected as a result of momentum transfer between incident ions and the target. The target-ejected particles traverse the vacuum chamber and are subsequently deposited on a substrate as a thin film. Thin film sputtering is carried out in a high vacuum environment with a variety of geometrical shapes and configurations, such as down, up, and side sputtering. KDF offers many sputtering configurations to accommodate different substrate sizes and shapes, as well as custom-made PVD systems. All systems can operate in DC sputtering, RF sputtering, Pulsed DC sputtering, and HIPIMS sputtering. [![](/wp-content/uploads/2022/09/Simple-diagram-of-a-PVD-system.png)](/wp-content/uploads/2022/09/Simple-diagram-of-a-PVD-system.png)**Simple diagram of a PVD system** \[ezcol\_1half\] [![](/wp-content/uploads/2022/09/Side-sputtering.png)](/wp-content/uploads/2022/09/Side-sputtering.png) **Side sputtering** \[/ezcol\_1half\] \[ezcol\_1half\_end\] [![](/wp-content/uploads/2022/09/Down-sputtering.png)](/wp-content/uploads/2022/09/Down-sputtering.png) **Down sputtering** \[/ezcol\_1half\_end\] **Categories:** Blog **Tags:** PVD sputtering, thin-film technology --- ### [Explanation of Various Sputtering Modes](https://www.kdf.com/explanation-of-various-sputtering-modes/) **Published:** July 23, 2021 **Author:** Vishal Agrawal **Content:** Written by Ammar Derraa 04/30/2021 Thin film sputtering, including metal, dielectric, and reactive sputtering can be achieved in one of the following modes: DC sputtering, RF sputtering, Pulsed DC sputtering, and HIPIMS sputtering. Early mode of sputtering was DC (Direct Current), and represented the simplest and most practical method of metal film deposition. As the demand for thin films application has been growing, sputtering technology has been constantly refined and improved to meet the industry challenges. Today’s sputtering involves many configurations such as, DC magnetron, RF (radio frequency), Pulsed DC, and the newly HIPIMS sputtering. DC magnetron is an enhancement for DC sputtering and does improve the deposition rate. RF sputtering expands the use of sputtering to non-metals. Pulsed DC is another enhancement for DC magnetron mode to optimize reactive processes. The recently-developed HIPIMS sputtering has the advantage of yielding hard coating and enhance step coverage in high-aspect applications. ## DC Magnetron Sputtering The DC sputtering mode in a diode configuration is slow and temperature limited. Magnetically Enhanced Sputtering utilizes a magnetic field that is at right angles to the electric field to increase ionization efficiency in the plasma and confine the electrons near the target. Thus, enhancing the deposition rate without overheat. In fact, Magnetron sputtering offers sputtering rates that are an order of magnitude higher than conventional DC method. This is achieved by a set of magnets mounted on the back of the target. ## RF Sputtering RF sputtering is similar to DC sputtering, but uses an applied RF voltage to eliminate charge buildup on the target. RF sputtering can operate in a diode or magnetron-enhanced configuration. The advantage of reactive sputtering is the ability to sputter dielectric target like quartz. ## Pulsed DC Sputtering Pulsed DC sputtering is used to minimize arcing and target poising in reactive processes. This is achieved by pulsing the applied voltage with a frequency in the range of 1-360kHz. The voltage is reversed for about 1 micron-second to clean any reactive buildup on the target. ## Reactive Sputtering Reactive sputtering refers to the sputtering of a chemically reactive target material in the presence of a reactive gas (usually oxygen or nitrogen) in order to deposit a nitride or an oxide compound film. Since the reactive process can occur in both DC and RF sputtering, either mode can be used for reactive sputtering. In DC reactive sputtering, chemical reactions do take place on the target surface forming an insulating layer on the target surface. However, in RF sputtering the insulating layer is sputtered away as soon as it forms. Pulsed DC sputtering minimizes this this target poising issue. ## HIPIMS Sputtering HIPIMS (High Power Impulse Magnetron Sputtering) is a new sputtering technique that can produce highly dense, smooth, and hard films with enhanced conformity or step-coverage for high aspect ratio applications. This is the result of a highly dense and ionized plasma that is generated by HIPIMS. In conventional magnetron sputtering, increasing plasma density through power is limited by heat dissipation for any practical gain, and the production of ionized plasma is not a simple task. HIPIMS is based on the use of special power supplies with of a very high voltage to generate short pulses of energy up to a Megawatt peak power. Thus, creating a very highly dense and ionized plasma. KDF has an extensive experience with HIPIMS, and has already developed and optimized many HIPIMS deposition processes along software integration, some of which are currently being used in a manufacturing environment. **Categories:** Blog **Tags:** sputtering modes, thin film deposition --- ### [KDF 5 Pallet Stacker option for the KDF 900i Series Batch Sputtering Systems](https://www.kdf.com/kdf-5-pallet-stacker-option-for-the-kdf-900i-series-batch-sputtering-systems/) **Published:** April 19, 2023 **Author:** Rad Horak **Content:** KDF introduces the 5 Pallet Stacker option for the KDF 900i Series Batch Sputtering Systems. This new option allows for 5 pallets to be loaded into the system Load Lock where they are automatically indexed in and out for processing in the main deposition chamber. This option allows for extended operational times where operator inputs and attention are not required or needed for longer periods of time. [![](/wp-content/uploads/2022/09/900i.jpg)](/wp-content/uploads/2022/09/900i.jpg) # # # ###### About KDF Technologies LLC Founded in 1986, KDF is a leading supplier of both new and remanufactured physical vapor deposition batch inline sputtering tools for the mainstream silicon, emerging materials and flat panel display markets. KDF services an installed base of over 2,000 systems in the field – over half of the semiconductor fabs in the world use a KDF system in wafer processing. KDF is committed to delivering the most advanced and reliable batch in-line sputtering systems at the industry’s lowest cost of ownership, KDF’s tools cover a wide variety of process requirements and can be customized to meet the customer’s needs. KDF vacuum coating systems are used in the production of devices in a variety of markets, including semiconductors, laser diodes, photo masks, telecommunications networks, wireless circuits, sensors, optoelectronics, medical devices, MEMS, MOEMS, flat panel display and gallium arsenide (GaAs), high density interconnect and radio frequency power devices. ## [**Contact us today!**](https://www.kdf.com/contact-us/) **Categories:** Blog, News **Tags:** batch sputtering, pallet stacker --- ### [KDF Technologies hosts Boston Scientific](https://www.kdf.com/kdf-technologies-hosts-boston-scientific/) **Published:** May 8, 2023 **Author:** KDF Technologies **Content:** *KDF Technologies recently hosted the team from [Boston Scientific](https://www.bostonscientific.com/en-US/Home.html) for acceptance of their new [KDF Technologies, LLC 954i sputter system](https://www.kdf.com/products/in-line-products-kdf-electronics/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/). The 954i will join Boston Scientifics existing fleet of KDF sputter tools to apply critical thin films to medical devices.* KDF has a range of multi-cathode linear sputter platforms for all of your thin film deposition needs. [Contact us for more details.](https://www.kdf.com/contact-us/) #medicaldevices #thinfilms #thinfilmdeposition [KDF Technologies, LLC](https://www.linkedin.com/company/kdf-technologies/) #inlinewithyourprocess [Kurt J. Lesker Company](https://www.linkedin.com/company/kurt-j--lesker-company/) #enablingtechnologyforabetterworld ![](https://www.kdf.com/wp-content/uploads/2023/05/Boston-Sci-KDF-Acceptance.jpg) **Categories:** Blog, News **Tags:** Boston Scientific, sputtering systems --- ### [Enhancing Reactive Sputtering with KDF’s Unique Features](https://www.kdf.com/enhancing-reactive-sputtering-with-kdfs-unique-features/) **Published:** April 2, 2024 **Author:** KDF Technologies **Content:** KDF, with its extensive experience in designing reactive sputtering batch coating production systems, offers several optional features that set it apart from others. These features include: - **Optimally Designed Gas Rings**: KDF’s gas rings are designed to inject the reactive gas into the sputter plasma at the target. This is particularly useful when the reactive gas is nitrogen, an intermediately chemically active gas. The gas ring effectively distributes the reactive gas, utilizing the energy of the sputter plasma to make the reaction more favorable. - **Pressure Control Package**: All [KDF systems](https://www.kdf.com/products/in-line-products-kdf-electronics/) are equipped with downstream pressure control and highly accurate Mass Flow Controllers (MFCs). This technique maintains a constant rate of reactive gas injection throughout the process, making it the most preferable pressure control technique during reactive sputtering. - **Prompt Gas Injection**: The reactive gas Mass Flow Controllers are located as close as possible to the gas injection port on the chamber. This allows for prompt changes in flow rates with little delay. - **Power Supplies**: KDF utilizes pulsed DC supplies with a wide range of pulse frequency and reverse time for conductive target reactive sputtering. This outpaces the arcing and creates a more stable high deposition rate process. KDF also specializes in reactive RF sputtering with in-house made and system-tuned matching networks. **KDF Reactive Sputtering System** [KDF](https://www.kdf.com/company/about-kdf-electronics-inline-sputtering-equipment/) has extensive experience designing reactive sputtering batch coating production systems. What sets KDF apart are the several optional features that can be added to our reactive sputtering systems. - Gas Rings - KDF has optimally designed gas rings to inject the reactive gas into the sputter plasma at the target. This is extremely useful, especially when the reactive gas is nitrogen. Since diatomic nitrogen is considered an intermediately chemically active gas, it is best to cycle it through a plasma to crack it into monoatomic form. Essentially, the gas ring effectively distributes the reactive gas to utilize the energy of the sputter plasma to make the reaction more favorable. - Pressure Control Package - [KDF systems](https://www.kdf.com/products/in-line-products-kdf-electronics/) are all equipped with downstream pressure control and highly accurate Mass Flow Controllers (MFCs). Downstream pressure control is where the high vacuum gate valve will automatically adjust its position to maintain deposition pressure, and the MFCs can be held at a constant flow rate. This is the most preferable pressure control technique during reactive sputtering, as a constant rate of reactive gas is injected throughout the process. - Gas Injection - The reactive gas Mass Flow Controllers are properly located to be as close as possible to the gas injection port on the chamber. This allows for the flow rates to be promptly changed with little delay. - Power Supplies - If using a conductive target to reactively sputter, KDF utilizes pulsed DC supplies with a wide range of pulse frequency and reverse time. This gives more capability to outpace the arcing and creates a more stable high deposition rate process. KDF also specializes in reactive RF sputtering with matching networks made in-house and tuned to each system. - High rate processes for deposition of dielectric films have been developed using Pulsed DC reactive sputtering on scanning batch tools. A typical high rate process for the deposition of silicon dioxide films from a conductively doped silicon target would allow the formation of nearly one micron of SiO2 in fifteen minutes, as compared with nearly five hours when RF magnetron sputtered from a quartz target. (Ref: Photonics Spectra, pp. 30-31, November 2002) - Sputter Sources - KDF has specially designed and patented sputter sources that are a great match for a reactive sputtering process. The LMM sputter source, for example, has nearly full-face erosion of the sputter target greatly reducing the build-up of reacted species on the target surface. Also, the inset sputter sources only have target material where the sputter plasma creates an erosion groove for high target utilization and limited area to build up reactive species on the target surface. By reducing the varied amount of reaction on a target surface decreases the chances of potential differences building up causing dreaded arcing and process instability. - In-situ Monitoring - KDF effectively integrates Plasma Emission Monitoring (PEM) into the system with precisely placed optical sensors and easy-to-use software controls. The PEM tracks the relative emission intensity of the ionized species in the sputtering plasma and controls the reactive gas to maintain an emission intensity setpoint. This emission setpoint correlates to the deposition rate and reactive gas concentration in the films. It is a great solution for rapidly developing a reactive sputtering process and repeatably depositing films of similar quality. ![](https://www.kdf.com/wp-content/uploads/2024/02/image-4.png) ![](https://www.kdf.com/wp-content/uploads/2024/04/Picture3.png)![](https://www.kdf.com/wp-content/uploads/2024/04/Picture4.png) **Categories:** Blog, News **Tags:** Reactive sputtering, thin film deposition --- ### [TFR Technologies Selects KDF 954NTX with ERPP Option for Uniform, Repeatable Thin Film Deposition](https://www.kdf.com/tfr-technologies-selects-kdf-954ntx-with-erpp-option-for-uniform-repeatable-thin-film-deposition/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2004 KDF today announced that TFR Technologies, Inc. has placed an order for a KDF 954NTX in-line sputtering system with an enhanced rotating planetary pallet (ERPP) option. This is the first order of a KDF system ever placed by TFR Technologies. TFR selected the KDF tool after an extensive evaluation of physical vapor deposition (PVD) solutions, which concluded that the KDF 954NTX with an ERPP option provided the best combination of performance, yield and throughput to suit the company’s needs for miniature high performance frequency control device manufacturing. “KDF is very pleased to announce that TFR Technologies has joined our global customer base,” said Kurt Flechsig, KDF president. “By choosing the KDF 954NTX, TFR Technologies validates the superiority of our technology for uniform, stable deposition of thin films in resonator manufacturing.” The expansion of thin film device capabilities is driving the need for better uniformity and higher repeatability for thin film deposition. Using KDF’s proprietary ERPP in conjunction with the standard linear scanning mode on the KDF 954NTX provides excellent uniformity and repeatability, enabling the production of complex multi-layer dielectric coats such as mirrors and filters in a highly repeatable and uniform manner. “TFR is looking forward to the KDF sputtering unit enabling higher volume production by increasing throughput across a wide range of depositions,” said Shane Leiphart, Senior Process Engineer, TFR Technologies, Inc. “It is expected that this tool will meet the company’s requirement for overall thin film performance well into the future.” The 954NTX is a four-target in-line sputtering tool for front- and backside deposition. The tool, which is optimized for compound semiconductor processing applications, features a low cost of ownership, and enables high utilization and throughput. Like all KDF 900 Series tools, the 954NTX offers users the capability of a production tool with the process flexibility typically found in an R&D system. The 900 Series exceeds requirements for deposition of thin films in application critical devices and other applications requiring the absolute in uniformity. The KDF 954NTX is one of KDF’s popular X Series™ products. It features the latest KDF cathode designs, which have been lengthened to 17 inches, offering improved uniformity over the entire pallet. X Series cathodes are also available in both Planar and Inset™ cathode form. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** KDF 954NTX​, thin film deposition --- ### [Advancements in Reactive Sputtering with KDF’s Sputter Sources and PEM](https://www.kdf.com/advancements-in-reactive-sputtering-with-kdfs-sputter-sources-and-pem/) **Published:** April 9, 2024 **Author:** KDF Technologies **Content:** [KDF](https://www.kdf.com/company/about-kdf-electronics-inline-sputtering-equipment/) continues to innovate in the field of reactive sputtering with its specially designed and patented sputter sources and the integration of Plasma Emission Monitoring (PEM). - **Sputter Sources**: KDF’s sputter sources, such as the LMM sputter source, are designed for a reactive sputtering process. They reduce the build-up of reacted species on the target surface, decreasing the chances of potential differences building up, causing dreaded arcing and process instability. - **In-situ Monitoring with PEM**: KDF integrates PEM into the system with precisely placed optical sensors and easy-to-use software controls. PEM tracks the relative emission intensity of the ionized species in the sputtering plasma and controls the reactive gas to maintain an emission intensity setpoint. This setpoint correlates to the deposition rate and reactive gas concentration in the films, making it a great solution for rapidly developing a reactive sputtering process and repeatably depositing films of similar quality. [KDF](https://www.kdf.com/company/about-kdf-electronics-inline-sputtering-equipment/) is proud to implement PEM to further improve the capability and reliability of our production batch coaters. It is an excellent solution to control and develop a reactive sputtering process. Being fully integrated allows for straightforward recipe development, process monitoring, and parameter recording. We continue to be in line with your process! Plasma Emission Monitoring (PEM) analyzes the light emission generated by ionized species during a physical vapor deposition (PVD) process. Observing this emission provides real-time insights into the plasma chemical makeup. When reactive gas, such as oxygen or nitrogen, is introduced to a deposition process, the intensity of light emitted by the different species of the sputtering plasma changes. The PEM can then be used as a closed-loop control method to adjust the reactive gas flow to maintain the emission intensity of the species you choose throughout the entire deposition process. This makes a PEM a critical tool for a production batch coating reactive PVD systems for several reasons. - This allows for straightforward process development, as one parameter can be adjusted to easily explore different compositions of the deposited film. - The transition zone can be determined in a reactive sputtering process, and the operation in that zone can be maintained to achieve the highest deposition rate possible for the compound film. - By analyzing the plasma spectra, the PEM can indicate if there is any unwanted gas contamination. - The emission intensity of certain species is correlated with the deposition rate. This allows predictability in film thickness before the sample is removed from the PVD system. - After using the PEM to rapidly develop the process, it can be used to repeatably perform the same process to deposit films of similar characteristics. [At KDF,](https://www.kdf.com/company/about-kdf-electronics-inline-sputtering-equipment/) we took our effectively [designed production batch-coating reactive sputtering systems](https://www.kdf.com/products/in-line-products-kdf-electronics/kdf-sputtering-solutions/) and seamlessly integrated PEM. We have precisely placed the optical sensors to optimally view the sputtering plasma from any target in the system. Most importantly, the PEM is highly integrated into the KDF software, making it simple to use and easy to monitor. The KDF recipe builder allows the user to effectively modify the amount of reaction for a deposition process to create a film of a single composition or even deposit films of graded composition. During the deposition process the KDF software will graphically display the PEM information for the user. In the background the KDF software will monitor the control quality of the PEM, and it will quickly abort if there are any issues with trying to maintain a particular emission setpoint. Once the issues are resolved (say the reactive gas bottle was emptied and is now replaced) the KDF software can pick up the process from exactly when it aborted. Furthermore, the KDF software records all the important parameters and PEM information in a deposition process so a user can track operation over time. Overall, KDF is proud to implement PEM to further improve the capability and reliability of our production batch coaters. It is an excellent solution to control and develop a reactive sputtering process. Being fully integrated allows for straightforward recipe development, process monitoring, and parameter recording. We continue to be in line with your process! ![](https://www.kdf.com/wp-content/uploads/2024/04/Picture3.png) ![](https://www.kdf.com/wp-content/uploads/2024/04/Picture2.png) ![](https://www.kdf.com/wp-content/uploads/2024/04/Picture4.png) **Categories:** Blog, News **Tags:** Reactive sputtering, Sputter sources --- ### [Leading Health Equipment OEM Purchases Two KDF 744NT Batch Sputtering Systems for Digital X-Ray Technology Production](https://www.kdf.com/leading-health-equipment-oem-purchases-two-kdf-744nt-batch-sputtering-systems-for-digital-x-ray-technology-production/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2005 KDF today announced that a leading original health equipment manufacturer has purchased and accepted two KDF 744NT batch sputtering systems. The tools are fully qualified and are currently in production. The customer will utilize the KDF 744NT sputtering systems for radiography research to advance digital x-ray technology into digital mammography and digital radiography. Advancing x-ray technology to a large area, full-field digital platform will help improve the diagnostic process for breast cancer, and will improve other medical initiatives like stationery and remote diagnosis. Breast cancer diagnosis using a digital platform provides unsurpassed image quality and options for instantaneous re-shoots and eliminates the need to schedule additional appointments. Over the past year, KDF has helped the customer qualify the KDF 744NT for this production application by providing on-site service including process assistance and software enhancements. “It is very gratifying for KDF to announce the sale of two KDF 744NT batch sputtering systems to one of the world’s largest leading original health equipment manufacturers,” said Kurt Flechsig, KDF president. “This sale is of particular note because we have been able to extend our tool into a new application that we hope will help to improve the quality of health care and treatment throughout the world.” The 744NT is a large area, four-target, batch sputtering system, designed for processing high-density interconnect, 200 mm semiconductor wafers, flat panel displays and other applications. The 744NT is equipped with a high-vacuum loadlock configured with a substrate pre-heat that enables the tool’s high throughput. The 744NT offers a pallet area of 19 x 19 inches with a compact footprint that uses less than one-third the floorspace of competing equipment. The tool can hold four 200 mm wafers or multiple smaller wafers and features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and back sides of wafers. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** batch sputtering systems​, digital X-ray production --- ### [KDF 744NT Batch Sputtering System Installed for Research at Arizona State University](https://www.kdf.com/kdf-744nt-batch-sputtering-system-installed-for-research-at-arizona-state-university/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2005 KDF today announced that the Flexible Display Center (FDC) at Arizona State University has purchased a KDF 744NT batch sputtering system for use in flexible display research. The 744NT, installed in May, was among the first physical vapor deposition systems installed and optimized for use in advanced display technology research at the FDC. In 2004, the U.S. Army awarded Arizona State a $43.7 million, five-year cooperative agreement to establish the FDC for the development of small, lightweight, portable display/information devices that are small enough to roll up and carry or wear. These devices will improve communication between soldiers, allowing them to share information about troop positions, movements, weather and other important variables. New developments are expected to yield new commercial applications for these devices. “Acquisition of the KDF tool increases FDC GEN II capabilities tremendously with exceptional value. KDF offers exceptional engineering support and customer service,” said Shawn O’Rourke, Flexible Display Center Director of Operations. “KDF is very pleased that the 744NT batch sputtering system will be playing a key role in the development of this important new technology,” said Kurt Flechsig, KDF president. “The research done at the Flexible Research Center has the potential to yield great benefits, not only for military use, but for consumer electronics and medical device applications as well.” The 744NT is a large area, four-target, batch sputtering system, designed for processing high-density interconnect, 200 mm semiconductor wafers, flat panel displays and other applications. The 744NT is equipped with a high-vacuum loadlock configured with a substrate pre-heat that enables the tool’s high throughput. The 744NT offers a pallet area of 19 x 19 inches with a compact footprint that uses less than one-third the floorspace of competing equipment. The tool can hold four 200 mm wafers or multiple smaller wafers and features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and back sides of wafers. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **About the FDC and ASU** The Flexible Display Center (FDC) at Arizona State University (ASU) is a university/industry/government collaborative venture designed to advance full color flexible display technology and flexible display manufacturing to the brink of commercialization. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** batch sputtering system​, flexible display research --- ### [Fupo Electronics Purchases KDF's 844NT Batch Sputtering System for High-Volume Wafer Bumping Manufacturing](https://www.kdf.com/fupo-electronics-purchases-kdfs-844nt-batch-sputtering-system-for-high-volume-wafer-bumping-manufacturing/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2005 KDF today announced that Taiwan-based FuPo Electronics Corporation, a turnkey service provider for liquid crystal display (LCD) integrated circuit (IC) manufacturers, purchased KDF’s 844NT batch sputtering system for use in high-volume wafer bumping production. FuPo’s purchase signals a growing acceptance of KDF’s sputtering systems in Taiwan. Wafer bumping is an important stage during assembly that generates interconnects between the chip and substrate, and KDF’s systems provide the maximum speed and functionality for this process. “We chose the KDF 844NT for its proven high throughput and performance, as well as its ability to modify wafer size without production delays,” said N.T. Huang, President of FuPo Electronics. “This enables us to better meet the changing requirements of the merchant wafer bumping foundry environment.” KDF’s 844NT tool will be delivered to FuPo Electronics ready to accept a robotic-load process called OPUS which allows the customer to upgrade easily to a complete cassette-to-cassette operation. The combination of the 844NT and OPUS creates the fastest wafer-size changeover time in the industry using just software and quick-check calibration. “KDF is very pleased that our new customer, FuPo Electronics, will use the 844NT during the essential wafer bumping step,” said Kurt Flechsig, KDF president. “The grouping of our OPUS robotic technology and the 844NT’s superior execution will provide FuPo Electronics with excellent results.” The 844NT is designed to process high-density interconnect, 300 mm semiconductor wafers and flat panel displays through its four-target, batch-sputtering system. The 844NT offers a pallet area of 26.5 x 26.5 inches with a compact footprint that uses less than one-third the floor space of competing equipment. Due to its size the 844NT system is an extremely cost effective way of running batches of small to large wafers or substrates. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **About Fupo Electronics Corporation** Based in Hsinchu, Taiwan, FuPo Electronics provides it customers with one-stop turnkey services for LCD driver IC. FuPo’s in-house capabilities include wafer bumping, circuit probing, chip tray packing (for COG application), final testing (for transmission control protocol application) and other applications. As a result of these services, FuPo offers its customers shorter cycle time from bump to final test, along with integrated engineering resources for troubleshooting. [www.fupo.com.tw](https://www.fupo.com.tw) ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** LCD IC manufacturing​, wafer bumping --- ### [KDF Expands Presence in China with Sale of 900 Series In-line Sputtering Tool to Beijing Microelectronics Institute](https://www.kdf.com/kdf-expands-presence-in-china-with-sale-of-900-series-in-line-sputtering-tool-to-beijing-microelectronics-institute/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2005 KDF today announced that Beijing Microelectronics Institute (BMI), a leading microelectronics manufacturer in China, has purchased the company’s new 904i in-line sputtering system for use in production as well as research and development. The product, which will ship to BMI in October, helps extend KDF’s market share penetration in the fast-growing Chinese market. According to researcher IDC, China became the world’s third-largest semiconductor-consuming country in 2004, with revenue from the region surpassing $26 billion. IDC predicts China will grow twice as fast as the entire semiconductor industry over the next five years. Beijing-based BMI chose the 904i system based on its versatility, reliability and ease-of-use. “As a first-time customer, BMI’s decision to use KDF’s tool speaks volumes about their confidence in our technology leadership. The customizable 904i system also supports a range of BMI’s microelectronics manufacturing needs,” said Kurt Flechsig, KDF president. “Furthermore, the move further solidifies our presence in China as customers continue to ramp up their assembly facilities in that country.” KDF’s 900 Series of products include dual load lock, in-line, sputter down, batch systems constructed with an optional high vacuum load lock and three or four target positions. Additionally, the 900 series systems can be used in numerous applications where distinctive size, shape, or substrate height is a priority. The 904i is in the preproduction phase and is expected to be available to customers in Q4 2005. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** Beijing Microelectronics Institute​, KDF 904i --- ### [KDF's First Sale of New Cluster Intelligence Tool Extends Ovonyx's Non-Volatile Memory Technology Capabilities](https://www.kdf.com/kdfs-first-sale-of-new-cluster-intelligence-tool-extends-ovonyxs-non-volatile-memory-technology-capabilities/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2006 ### Multi-Order Includes 654i System, Expands Companies’ Partnership KDF today announced that Ovonyx, Inc., a Rochester Hills, Mich.-based company specializing in the commercialization of proprietary phase-change semiconductor memory technology, has purchased the new KDF Ci (cluster intelligence) cluster tool for use in support of commercialization programs for its technology. The product, which is expected to ship in the third quarter 2007, marks a first-time cluster tool win for KDF and the company’s entry into a new market. Non-volatile phase-change memory boasts rapid write and erase speeds, elevated cycling endurance, and superior scaling performance as the industry moves toward newer generations of nonvolatile solid state memory. Ovonyx will continue its programs for Ovonyx Unified Memory (OUM) performance enhancement and cost reduction on KDF’s innovative cluster tool. The customized cluster tool with a hydrogen cleaning station will allow Ovonyx and its customers to develop manufacturing processes in a preproduction environment using a cluster tool that emulates their fab environments. “KDF has been a very reliable supplier, and through our collaboration with KDF, we will have in hand a cluster tool ideally suited for phase change and associated materials deposition,” said Ed Spall, vice president, Ovonyx. “Our current and future partners will benefit from the new KDF Ci cluster tool’s unique capabilities as we jointly pursue commercialization of OUM phase change technology.” Ovonyx current licensees include Samsung, BAE Systems, Intel Corp., STMicroelectronics, Nanochip, Inc. and Elpida Memory, Inc. Furthermore, Ovonyx recently bought KDF’s 654i series batch tool to complement the other KDF system it’s currently utilizing, the 643GT in-line, side sputtering batch system. “Our long-term relationship with Ovonyx signifies the customer’s level of assurance in our technology expertise and manufacturing know-how,” said Kurt Flechsig, president, KDF. “With this versatile process platform, KDF will provide Ovonyx with a superior and unique level of customization for this cluster tool as well as lower cost of ownership.” \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** Ci Cluster Tool, phase-change memory​ --- ### [Equipping A Multi-Million Dollar Digital X-Ray Production Facility](https://www.kdf.com/equipping-a-multi-million-dollar-digital-x-ray-production-facility/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2006 KDF announces its role in the opening of a $165 million state-of-the-art digital X-Ray mammography production facility in New York state. The facility is headlined by by one of the world’s largest health equipment OEMs and will manufacture and transfer its innovative technology to healthcare facilities worldwide. KDF, a producer of batch-sputtering systems used in the manufacture of a variety of R&D and production formats, provided two 844i systems that support essential digital diagnostic radiography equipment. KDF’s 844i systems are used in the development of digital X-ray diagnostic equipment. The radiographic equipment enhances the diagnostic process for breast cancer doctors and patients by providing digital images at a matchless quality, while also providing instantaneous re-shoots, thereby eliminating the need to schedule additional appointments. The 844i is a large area, four-target, batch-sputtering system, designed for processing high-density interconnect, 300 mm semiconductor wafers, solar photovoltaic cells and flat panel displays. The 844i accommodates glass sizes up to Gen 3. Because of its size, the 844i system is an extremely cost-effective way to run batches of small to large wafers or substrates. The 844i is equipped with a high-vacuum load lock configured with a substrate pre-heat that enables the tool’s high throughput. The 844i offers a pallet area of 26.5 x 30 inches with a compact footprint that uses less than one-third the floor space of competing equipment. The tool can hold four 300mm wafers or multiple smaller wafers and features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and backsides of the wafers. The system can also be enhanced with scan velocity profiling. The 844i system meets the Semiconductor S2-0200 safety specification as part of the standard system package, a CE option for the European community is available. Pulsed DC sputtering up to 20kw via Advanced Energy Pinnacle Plus is also available. The 844i system has remote PC accessibility allowing for software upgrades and file repair via an Internet/Ethernet connection. The use of KDF’s 844i systems by one of the world’s largest health equipment manufacturers is a comment on the sophistication of the technology and its capabilities when incorporated into advanced medical devices, such as digital X-ray mammography equipment. Todd Plaisted, KDF Director of Marketing, comments, “The KDF 844i systems were modified to larger 26.5″ x 30″ pallets to meet new requirements. The system is newly designed to accommodate 90 degree thru-wall clean room interface and roll-around system control cart, saving clean room space. In addition, the systems have new, cost effective pallet-assist loading tools as an alternative to an expensive roboticized system. Says Plaisted, “It is with great pride that we know our efforts developing quality technology, combined with those of the manufacturer, will result in the care and treatment of an untold number of people around the globe.” \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** 844i sputtering systems​, digital X-ray production --- ### [KDF Broadens Customer Relationships with Leading Medical Equipment OEMS](https://www.kdf.com/kdf-broadens-customer-relationships-with-leading-medical-equipment-oems/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2006 ### Customers Buy Batch Sputtering Systems for Digital X-ray Technology, Pacemaker Production KDF today announced that leading original health equipment manufacturers continue to purchase and accept the Company’s 700 and 900 series batch sputtering systems for use in the manufacture of essential digital radiography diagnostic equipment and pacemaker components. The systems are installed and currently in qualification phase. “The procurement of our tools by two of the world’s largest health equipment OEMs further solidifies our strong relationship with these companies and confirms that our sophisticated technology platforms meet meticulous standards for producing advanced medical devices,” said Todd Plaisted, KDF director of Marketing. “We are proud to be part of a process that advances the quality of health care and treatment for thousands of people around the globe.” One of the leading health OEMs first purchased two KDF 744NT systems in April 2005. Today, all three tools are being used to manufacture digital X-ray diagnostic equipment that will enhance the diagnostic process for breast cancer doctors and patients, as well as expand medical applications such as fixed and remote diagnosis. The digital approach to diagnosis presents patients with matchless image quality, while also providing instantaneous re-shoots that eliminate the need to schedule additional appointments. The firm has brought in other changes in the past to speed processes, such as [ccm software](https://us.epsilon.com/epsilon-peoplecloud-overview/messaging) and other communication tools. “The KDF 744NT provides physical vapor deposition sputtering, or state-of-the-art coating, of the X-ray screens in a high-throughput environment,” Plaisted said. “Additional features like the vacuum loadlock, multiple substrate capacity and two processing pallets continue to enhance the speed and quality of manufacturing.” The 744NT is a large area, four-target, batch-sputtering system, designed for processing high-density interconnect, 200 mm semiconductor wafers, flat panel displays and other applications. The 744NT is equipped with a high-vacuum loadlock configured with a substrate pre-heat that enables the tool’s high throughput. The tool’s pallet area and compact footprint uses less than one-third the floorspace of competing equipment. Additionally, KDF’s 954NTX in-line sputtering system is being used for the manufacture of pacemaker components by another leading OEM. This marks the second 900NTX product purchased in less than two years by this company, which selected KDF’s tool for its ability to create solid coatings and its Inset style cathodes feature. This cathode design provides extended lifetime and high utilization for thick coatings used on critical pacemaker components. The 954NTX comes equipped with sputter-down capability and easy substrate loading suited for medical applications which produce uniform films with an exacting, but repeatable, high-throughput process. The customer also recently bought the 954ix tool, a new generation i system from KDF. This 954ix product has integrated the Company’s newly patented Linear Moving Magnetron™ (LMM) full-face erosion sputter cathode in the Magterial™. This version has one of the highest material efficiencies for magnetic substances in the industry, providing increased source material lifetime and high performance for design and utilization. “There is no margin for error in pacemaker manufacturing applications and KDF’s superior coating technology meets these standards,” Plaisted said. “We look forward to continuing our commitment to meet our customers’ needs as medical technology advancements improve and change.” \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** batch sputtering systems​, medical equipment manufacturing --- ### [KDF Announces the new i series System Controls Platform](https://www.kdf.com/kdf-announces-the-new-i-series-system-controls-platform/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2007 After years of testing and evaluation, KDF has introduced the new i series controller, replacing the Brooks Automation Controller with new technology. This control system has been designed to be retofitable, allowing an easy upgrade path for previous KDF models (“T “, “GT”, and “NT”). Although some older systems may require additional hardware upgrades to maintain compatibility with current and future system enhancements, doing so will bring these field proven systems to an even higher level of performance and reliability. This i series platform is based on a distributed Rockwell Automation Control System utilizing Devicenet and Ethernet I/P fieldbus technologies. These interfaces dramatically reduce the need for point to point wiring allowing for greatly increased reliability, easier troubleshooting, and a higher level of system integration reducing system part count (and spare part inventory). Easy system upgrade is accomplished with the use of flash memory. Windows XP Pro™ industrialized computer using the latest Intel Pentium Processor™ technology, Large Hard disk drive (80 mb or better) for local recipe and data log storage, and an advanced graphics controller. Real-time GUI Environment, coupled with a SAW Touch screen and 19″ LCD monitor.Surface Acoustic Wave touch screen technology guarantees virtually 100% optical transmission, and is not affected by the use of gloves. Context sensitive, multi-step (up to 200 steps / recipe) recipe manager is compatible with Microsoft Access™ database. Recipe storage is limited only by hard drive space (additional recipes can be stored on network drive). Any lost data that you may experience concerning your hard drive can be restored through places like [DriveSavers](https://drivesaversdatarecovery.com/welcome/welcome-buffalo-data-recovery/), to ensure that you can make the most out of this new technology. Fully integrated package for real-time data display, data logging is fully compatible with Excel™, Lotus™ and other windows applications, report generation, remote interface and printing. Secure remote diagnostics and software support available over the Internet (high speed connection required) with local firewall and anti-virus protection. OPC server interface allows SECS/GEM communication package (optional) and other applications to connect to a common database of machine I/O and system level data such as Datalogs, recipes, RGA data, etc. Maintenance test suite with full diagnostic and manual process control capability, along with a host of other macro sub routine programs. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** i Series controls, sputtering automation​ --- ### [KDF Releases and Installs the New 844i Systems](https://www.kdf.com/kdf-releases-and-installs-the-new-844i-systems/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2008 After ten months of engineering KDF has released and installed the new 844i systems. KDF had listen to their customers and realized that the 844 platform had to grow in order to accommodate the new generations of hi-end displays and CCD pickups , hence the larger format 844 was born. The new 844i offers a pallet size of 26.5 by 30 inchs , which also increase throughput for other users which utilize wafers or alumna substrates. The new system only grew a few inches externally , but KDF was able to give back by repackaging the overall computers and PLC controls, the new Cybertronics all in one computer and keyboard assembly allowed us to utilize a small portable round around computer station and touch screen to run all system functions. All motions in the tool are executed by either stepper driven encoder feedback drives or in the case of the Load Lock elevator a linear encoder for positional readouts. Motion control and speed controls are extremely critical for exacting process , so speed regulation pallet scanning is resoluted at .001%. RF and DC power supplies communicate directly through RS232 type ports to provide all data and information from that power supply, which are done in real time. The use of MKS cluster gauges simplify the wiring and allow greater interlocking of sensitive gauge types . KDF’s extensive in-house expertise of software allows us to integrate all our gained experience of process and machine tool operation into a seamless operating system for the customer. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** 844i sputtering system, batch sputtering enhancements​ --- ### [Sipat Orders Another KDF 900 Series In-Line Sputtering Tool for High Throughput Surface Acoustic Wave Manufacturing](https://www.kdf.com/sipat-orders-another-kdf-900-series-in-line-sputtering-tool-for-high-throughput-surface-acoustic-wave-manufacturing/) **Published:** September 23, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2004 KDF today announced that the company has received an order for a KDF 954NT in-line sputtering system from the Sichuan Institute of Piezoelectric & Acousto-optic Technology (SIPAT), a leading research and development facility in China. The system will be used in the production of surface acoustic wave (SAW) devices, which are commonly used in the growing wireless and mobile communications market. SIPAT is a repeat customer and has been using a KDF 943 Series tool for several years. The institute chose the 954NT based on the system’s throughput, versatility, reliability and established history as a production-worthy tool. SIPAT was particularly interested in the 954NT’s uniform, stable deposition of thin films and ability to deposit on various substrate sizes. “It is always gratifying when a customer returns to buy a second tool from KDF,” said Kurt Flechsig, KDF president. “In doing so, the Sichuan Institute of Piezoelectric & Acousto-optic Technology has demonstrated satisfaction with our technology, service and support. It is also important to note that SIPAT’s purchase represents recognition of the value that the KDF 954NT brings to the production of SAWs and other compound semiconductors. ” SAW devices are used to control and process electrical signals. Increasingly, SAWs are making their way into in mass market consumer electronics. The proliferation of wireless products and new technologies coming online for wireless data have lead to a dramatic spike in the demand for SAWs. The worldwide market for SAW devices is already worth more than $1 billion, and is projected to continue growing. The 954NT is a four-target batch sputtering tool for front- and backside deposition. The tool, which is optimized for processing GaAs and other compound semiconductor applications, features a low cost of ownership, and enables high utilization and throughput. Like all KDF 900 Series tools, the 954NT offers users the capability of a production tool with the process flexibility typically found in an R&D system. The 900 Series exceeds requirements for deposition of thin films in application critical devices and other applications requiring the absolute in uniformity. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **About Sipat** Sichuan Institute of Piezoelectric and Acousto-optic Technology(SIPAT), is the key Chinese institute specializing in research on piezoelectric and acousto-optic technology. Founded in 1970, SIPAT currently has about 900 employees, including about 100 senior researches and nearly 200 are engineers. SIPAT’s research is focused on SAW technology, piezoelectric and acousto-optic crystal materials, BAW microwave delay line, DWDM and piezoelectric or ferroelectric ceramic materials and devices. Since its founding, SIPAT has recorded nearly 400 strong technical achievements. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** sputtering system​, surface acoustic wave --- ### [KDF Names Ammar Derra Director of Technology](https://www.kdf.com/kdf-names-ammar-derra-director-of-technology/) **Published:** September 23, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2004 KDF today named Ammar Derraa, an award-winning scientist and author of more than 50 U.S. patents and disclosures, to the position of director of technology. Dr. Derraa succeeds Su Gupta, who left KDF late last year to pursue a university teaching career. Dr. Derraa will report directly to KDF CEO Kurt Flechsig. “Dr. Derraa brings to KDF impeccable credentials and an outstanding record of technological achievement. His technical expertise will drive the creation of competitive solutions at KDF for years to come,” Mr. Flechsig said. “We are honored to welcome him aboard. We are also gratified that KDF was able to replace our departed director of technology in such a timely manner, which will ensure that we do not lose momentum as we continue along our product development roadmap.” As director of technology, Dr. Derraa assumes responsibility for all KDF technology, with a particular emphasis on research and development. This includes overseeing the development of new KDF technology, including advancements upon the company’s series of sputtering tools, and service and customization of pre-owned MRC systems. “It is with great pleasure that I assume the duties of director of technology at KDF,” Dr. Derraa said. “With nearly 20 years of history in the semiconductor industry and a reputation for innovative technology, KDF is an exciting company to be part of. I look forward to participating in the next phase of the company’s development.” Prior to joining KDF, Dr. Derraa worked for NanoOpto Corp., where he led a nanotechnology project developing new nano-devices with dimensions smaller than the wavelength of light. Previously he was at Micron Technology, where he worked on many projects focused on the development of new technologies, including flat panel displays and various computer memory devices. Dr. Derraa has a rich background in academic and commercial research. He holds a PhD in physics from the University of Toronto, an MSc in physics from Queen’s University, and a BSc in physics from the University of Constantine. His achievements include the Reginald Blyth Award (1994-94), the E. Burton Fellowship (1990-93), and the John Nadeau Award (1990). He has filed 54 patents (36 awarded, 18 pending) and has more than a dozen technical and conference publications to his credit. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** Ammar Derraa, KDF Director of Technology​ --- ### [KDF Releases its Newest Version of the Field Proven LMM Cathodes](https://www.kdf.com/kdf-releases-its-newest-version-of-the-field-proven-lmm-cathodes/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2008 ### LMM™ Patented Device Full Face Erosion Cathode The LMM or Linear Moving Magnetron was a leap forward in the production environment for Compound Semiconductor market place, allowing greater run times and improved films for reactive process’s. KDF has just released its newest version of the field proven LMM cathodes , this latest generation cathode now offers a lateral motion magnet pac that increases the the overall utilization to approx 60%. This recently engineered improvement allows for longer run times between target changes and aids in the decrease to target poisoning during long fully reactive runs. This new revision cathode will be Patent Pending as well , securing KDF position as a leader in cathode design technologies. By creating this new Pivotal end turn around method , burn through at corners has been significantly reduced and there by extending the usable target life for Full Face Erosion cathode. Currently this cathode is only available for KDF tool sets thereby enabling KDF end users to benefit from this extraordinary cathode. Customers that are interested in this cathode should contact KDF to discuss their technical needs, KDF can also run customer demo’s in a Process Lab Tools. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** LMM cathodes, sputtering efficiency​ --- ### [KDF Announces the Release of the G-12 Full-Face Erosion Cathode](https://www.kdf.com/kdf-announces-the-release-of-the-g-12-full-face-erosion-cathode/) **Published:** September 24, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2009 After two years of development and testing KDF is pleased to announce the release of the G-12 full-face erosion cathode, The G 12 will be exclusively featured in our Ci Cluster tool system line up. This new design round cathode utilizes a proprietary hi-strength close coupled magnet assembly which allows the cathode to be perfectly suited for today’s more demanding applications such as compound semiconductor apps and unique Oxide depositions. The variable speed controlled motor driven magnet pack will run at speeds that allow materials to be put down at varying rates, yet able to maintain excellent uniformity over an eight inch substrate. This Patent Pending design further strengthens KDF’s position in critical film technologies. Preliminary testing has indicated that basic metal uniformity of > 2% is easily achieved. This cathode coupled with KDF’s Ci cluster tool, with counter rotating anode stage will enable uniformities of less then 1% wafer to wafer. With over 23 years of engineering and manufacturing expertise KDF is ready to offer another World Class Product. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** G-12 cathode, sputtering technology​ --- ### [Honeywell Places Follow-On Order for 943NT Sputtering System with KDF](https://www.kdf.com/honeywell-places-follow-on-order-for-943nt-sputtering-system-with-kdf/) **Published:** September 23, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2003 Aerospace business will use tool for commercial satellite applications and guidance systems KDF today announced that Honeywell International (NYSE: HON) has placed a follow-on order for a 943NT in-line sputtering system. This follow-on order provides production-proven validation for KDF’s 943NT system in aerospace applications, and highlights KDF’s ability to respond to commercial and government contractors’ manufacturing needs with extensive customer support. A KDF customer since 2001, Honeywell installed its first 943NT system at its Minneapolis facility in June 2001. The current order for Honeywell’s second 943NT system was installed at the same facility in January 2003 and will be used to produce ring laser gyroscopes for Honeywell’s aerospace business. “Over the past year and a half, Honeywell has developed an established process with KDF’s 943NT tool,” said Kurt Flechsig, president of KDF. “We are proud to renew and strengthen our relationship with Honeywell and help them to further realize success.” With sputter down capability and easy substrate loading, the 943NT is ideally suited for ring laser gyroscope production because it delivers a repeatable, high-throughput process for producing uniform films. Popular for their pure metal target deposition and convenient wafer to pallet loading abilities, the 900 Series systems can be configured with an optional high vacuum loadlock and three or four target positions. High-rate DC magnetron sputtering and single- or multiple-pass deposition features support the versatility and high-throughput of these production systems. The 900 series systems can be used in the semiconductor, telecommunications, aerospace and a growing list of other technology markets because they can be tailored to meet specific processing needs. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. **Categories:** News **Tags:** 943NT sputtering system, aerospace manufacturing​ --- ### [KDF Tool Selected By Medtronic for use in Manufacture of Pacemaker Components](https://www.kdf.com/kdf-tool-selected-by-medtronic-for-use-in-manufacture-of-pacemaker-components/) **Published:** September 23, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2003 ### 943NTX Sputtering System Meets Medical Device Production Standards KDF today announced that Medtronic (NYSE: MDT) has selected its 943NTX in-line sputtering system for use in manufacturing pacemaker components. The order verifies that KDF’s technology platforms meet rigorous standards for producing advanced medical devices. The KDF system began installation at Medtronic’s Minneapolis facility in December 2002. Medtronic selected the 943NTX for its ability to create impervious coatings, a crucial aspect of medical manufacturing since each device is expected to perform flawlessly. The KDF 943NTX features InsetÔ style cathodes, a cathode design that provides long lifetime and high utilization for thick coatings, like those that are used to protect critical pacemaker components. There is no margin for error in pacemaker manufacturing applications and KDF’s superior coating technology meets these standards. “As an existing customer of KDF, Medtronic is familiar with the strength and capabilities of our 900 Series sputtering systems. The 943NTX provides the process integrity required for producing high stakes medical devices like pacemakers,” said Kurt Flechsig, president of KDF. “KDF already maintains a presence in the medical devices market and this order will serve to increase our market penetration for this industry.” KDF offers advanced and reliable batch in-line sputtering systems at the industry’s lowest cost of ownership. These systems are used around the world in the semiconductor, telecommunications, aerospace and medical technology markets, each tailored to meet specific processing needs. For the Medtronic process KDF configured the 900 Series system with an InsetÔ style cathode which supports long-term use in the production of durable and impenetrable coatings. With sputter down capability and easy substrate loading, the 943NTX is ideally suited for medical applications which produce uniform films with an exacting, but repeatable, high-throughput process. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **About Medtronic** Medtronic, Inc., headquartered in Minneapolis, is the world’s leading medical technology company, providing lifelong solutions for people with chronic disease. [www.medtronic.com](https://www.medtronic.com). **Categories:** News **Tags:** 943NTX sputtering system​, pacemaker manufacturing --- ### [New High Rate DC Reactive Processes for Dielectric Films](https://www.kdf.com/new-high-rate-dc-reactive-processes-for-dielectric-films/) **Published:** September 23, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2002 High rate processes for deposition of dielectric films have been developed using DC reactive sputtering on scanning batch tools. A typical high rate process for the deposition of silicon dioxide films from a conductively doped silicon target would allow the formation of nearly one micron of SiO2 in fifteen minutes, as compared with nearly five hours when RF magnetron sputtered from a quartz target. This can represent a very large increase in throughput for the deposition of complex multilayer dielectric waveguides, mirrors or filters. *(Ref: Photonics Spectra, pp. 30-31, November 2002).* \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. **Categories:** News **Tags:** DC reactive sputtering, dielectric film deposition​ --- ### [KDF Sputtering System Selected By Plasmion and Leading Korean Manufacturer Hanwha L & C for Advanced Oled Production](https://www.kdf.com/kdf-sputtering-system-selected-by-plasmion-and-leading-korean-manufacturer-hanwha-l-c-for-advanced-oled-production/) **Published:** September 23, 2015 **Author:** Rad Horak **Content:** KDF today announced that Plasmion Corporation has ordered a custom engineered KDF 744NT batch sputtering system for installation at Hanwha L&C’s Korean facility. The KDF 744NT was ordered as the result of a strategic alliance between Plasmion and Hanwha L&C wherein, Hanwha licensed Plasmion’s Negative Sputter Ion Beam (NSIB) technology and ordered a production system from Plasmion. After critical review, Plasmion and Hanwha selected KDF’s 744NT tool retrofitted with Plasmion’s Negative Sputter Ion Beam. By developing a tailored solution quickly, KDF demonstrated its ability to meet the needs of partners and customers based on its core competencies. The production system is scheduled for installation at Hanwha L&C in December 2002. Hanwha will use the enhanced 744NT system to manufacture and process ITO coated glass for use in the production of Organic Light Emitting Displays (OLED). OLED is a new type of flat panel display that is currently used in automotive audio and cellular telephone applications. Hanwha plastics manufactured with the new production system will be able to replace the glass used to manufacture OLEDs, providing the display industry with a more cost-efficient way of manufacturing displays for miniature and mobile applications. “We selected the KDF 700 Series production platform because this batch sputtering system can be easily upgraded to utilize our ITO coating process,” commented James A. Ionson, CEO, Plasmion Corporation. Mr. Ionson further disclosed that “Our strategic alliance with Hanwha is the first of many production partnerships we plan to form with end-users of our process technology, and we will be actively working with major equipment manufacturers such as KDF to embed our cost-effective process within their systems.” “This is a reliable and advanced solution that will meet our requirements for ITO coated glass production,” said Jin Ki Paik, vice president, business development, Hanwha. “Uniting Plasmion’s Negative Sputter Ion Beam technology with KDF’s production-proven sputter system provides us with the best of both worlds.” “This design win demonstrates how flexible and customer-focused we are. In this instance our systems will be customized to meet the customer’s specific needs and cover a wide variety of process requirements. Partnering with a leading-edge technology provider such as Plasmion Corporation gave us the opportunity to participate in this design win for Hanwha, the top petrochemical company in Korea,” said Kurt Flechsig, president of KDF. The KDF 744NT is a large area, four-target, batch sputtering system, designed for processing high-density interconnect, 200mm semiconductor wafers and flat panel displays. The Plasmion enhancement of the KDF 744NT includes an NSIB that provides excellent ITO coatings on polycarbonate substrates at very low temperatures. Plasmion’s technology creates solid ion beams during the coating process to achieve an atomically smooth surface. The 744NT is equipped with a high-vacuum loadlock configured with a substrate pre-heat that enables the tool’s high throughput. The 744NT offers a pallet area of 19 x 19 inches with a compact footprint that uses less than one-third the floorspace of competing equipment. The tool can hold four 200mm wafers or multiple smaller wafers and features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and back sides of wafers. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **About Hanwha L & C** Hanwha Group is a multi-billion dollar company involved in information services, construction, explosives, machinery, trade and telecommunications. Established in 1966, Hanwha L&C Corp., a unit of the Chemical and Explosive Division of Hanwha Group, currently is involved in plastics, chemical products, automotive parts and floor-covering materials with manufacturing plants in Jinhae and Bookang, Korea. ###### **About Plasmion** Plasmion Corporation is a market-driven technology company focused on delivering leading edge thin film application technology for the display, semiconductor, storage disk and optical communications industries and novel atmospheric pressure plasma technology for use in manufacturing plasma displays, etching/cleaning of electronic structures, surface modification and medical sterilization. Plasmion was formed in 2001 through the merger of two companies founded by scientists and inventors from Stevens Institute of Technology. Plasmion Corporation is headquartered in Hoboken, NJ, with representatives worldwide, including Europe, Japan, Korea and Taiwan. **Categories:** News **Tags:** OLED production, sputtering system​ --- ### [Raytheon Orders 943NT In-Line Sputtering System From KDF](https://www.kdf.com/raytheon-orders-943nt-in-line-sputtering-system-from-kdf/) **Published:** September 23, 2015 **Author:** Rad Horak **Content:** KDF today announced that the Electronic Systems business of Raytheon Company (NYSE: RTN) has ordered a 943NT in-line sputtering tool for use in its El Segundo, California facility. Electronic Systems, which is a world leader in the development and deployment of key defense programs, will use the 943NT in the manufacture of its advanced technology products. This order from Electronic Systems marks the first new tool that Raytheon has purchased from KDF. Raytheon has been a KDF customer since 1988, and has previously purchased remanufactured equipment from KDF and batch products from MRC, which KDF acquired from Tokyo Electron Limited (TEL) in 1998. “In order to maintain our position as a global leader in advanced defense programs, it is imperative that our processing equipment provides us with the strongest technology platform possible. We already have an established process with the installed MRC 943 tool, and this new KDF in-line sputtering system will allow us to modernize the equipment without sacrificing process, reliability or cost effectiveness,” said Howard Ito, Principal Engineer of Raytheon’s Electronic Systems business. Electronic Systems will primarily use the 943NT for thin film hybrid circuitry. This circuitry is subsequently utilized by the company in the development and production of a number of defense programs, including radars and sensors for ground-based, airborne, and space-based systems. “As Electronic Systems moves to replace its current equipment, our 943NT provided the most seamless and efficient platform for this transition. Electronic Systems is already familiar with our technology, and the 943NT will continue to enable it to produce the most advanced circuits for its defense programs,” said Kurt Flechsig, president of KDF. The 943NT is part of KDF’s 900 Series of physical vapor deposition (PVD) systems, all of which feature in-line sputter-down capabilities. Popular for their pure metal target deposition and convenient wafer-to-pallet loading abilities, the 900 Series tools can be configured with an optional high vacuum loadlock and three or four target positions. High-rate DC magnetron sputtering and single- or multiple-pass deposition features support the versatility and high-throughput of this production equipment. Cathode and substrate orientation are horizontal, allowing gentle substrate fixturing for users. ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **About Raytheon** Electronic Systems, which is Raytheon Company’s largest business, is a world leader in the development and production of advanced defense electronics, missiles, ground-based and airborne radars, naval and maritime electronics, and space systems. Electronic Systems comprises six business units: Air Combat and Strike Systems and Surveillance & Reconnaissance Systems, both headquartered in El Segundo, Calif.; Tactical Systems, headquartered in Dallas, Texas; Air/Missile Defense Systems, headquartered in Bedford, Mass.; Naval & Maritime Integrated Systems, headquartered in Portsmouth, R.I.; and, Missile Systems, headquartered in Tucson, Ariz. With headquarters in Lexington, Mass., Raytheon Company (NYSE: RTN) is a global technology leader in defense, government and commercial electronics, and business and special mission aircraft. **Categories:** News **Tags:** 943NT sputtering system, defense electronics manufacturing​ --- ### [KDF Installs Multiple In-Line Sputtering Systems in Taiwan](https://www.kdf.com/kdf-installs-multiple-in-line-sputtering-systems-in-taiwan/) **Published:** September 23, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2002 KDF today announced that it has successfully completed installation of multiple in-line sputtering systems at two Taiwanese foundries. Micro Electro Magnetical Technologies Corporation (MEMT), based in Chunan, Miaoli, Taiwan, purchased a 603NT tool for critical film applications. Suntek Compound Semiconductor Company, based in Hsinchu Shien, Taiwan, ordered a 943NTX system with a planetary pallet for GaAs wafer production. The orders mark the first business between KDF and both companies. “These two sales demonstrate the market penetration that KDF continues to gain in Taiwan. This increased interest from Taiwanese companies is based on the performance and cost-effectiveness of our tools,” said Kurt Flechsig, president of KDF. “We are pleased to welcome MEMT and Suntek as our two newest customers. KDF is committed to gaining a strong foothold in Taiwan, and we believe that these installations reflect our growth in this region.” KDF is well positioned to capitalize on the expanding telecommunications and compound semiconductor market segments in Taiwan because of the breadth of its experience in these markets in the U.S. and Europe. As Taiwan’s gallium arsenide (GaAs) market continues to grow, KDF is focused on penetrating this market in its early stages. “After evaluating the performance of other equipment, we found that the KDF tool surpassed the competition in terms of uniformity, which is critical in our discrete device production. Further, the cost of ownership advantages and customer support capabilities were key drivers in this purchasing decision,” said Allen Yang, assistant vice president of sales & marketing at MEMT. According to the [Semiconductor Industry Association (SIA)](https://www.sia-online.org/), the worldwide discrete market is forecasted to grow in 2003 to $14 billion, a 16 percent increase from 2002. The discrete semiconductor market is predicted to increase another 15 percent in 2004, to total $16 billion. The 943NTX is part of KDF’s 900 Series of PVD systems, all of which feature in-line sputter-down capabilities. The 943NTX offers the option of extended cathodes and excellent uniformity. Popular for their pure metal target deposition and convenient wafer-to-pallet loading abilities, the 900 Series systems can be configured with an optional high vacuum load-lock and three or four target positions. High-rate DC magnetron sputtering and single- or multiple-pass deposition features support the versatility and high throughput of these production systems. Cathode and substrate orientation are horizontal, allowing gentle substrate fixturing for users. The 603NT is a vertical, side-sputtering tool that is typically used for sensitive applications requiring target material that produces unusually high particulate contamination. The 600 Series are dual load lock, in-line, vertical batch sputtering systems. They are configured with an optional high vacuum load lock and three or four target positions and have a 13 x 13 inch pallet size. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **About Micro Electro Magnetical Technologies** Micro Electro Magnetical Technologies (MEMT) is a newly established power discrete wafer foundry in Taiwan, specializing in 6″ Schottky (largest size in the world), TVS, Super Fast and Thyristor wafer manufacturing and marketing. With the most advanced technology, equipment and facility, MEMT is now at the leading position providing comprehensive power discrete solutions to worldwide device designer, power device assembly houses and IDM’s. The up-to-date capacity is around 12000 pcs per month and will be extended to 24000 pcs in the near future. ###### **About SUNTEK** SUNTEK Compound Semiconductor Co. was established in August 2000. The company offers the complete spectrum of compound semiconductor foundry services and solutions for the wireless communication, broadband application, and optoelectronics markets. SUNTEK focuses on the capacity assurance, competitive service cost, rapid turn-around service and total quality management for customers using world-class fab facility as well as advanced process technologies. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** semiconductor manufacturing​, sputtering systems --- ### [Batch Processing Not Ready To Retire](https://www.kdf.com/batch-processing-not-ready-to-retire/) **Published:** September 23, 2015 **Author:** Rad Horak **Content:** ###### ORIGINAL ARTICLE DATE: APRIL 22, 2002 ###### By Kurt Flechsig **Electronic News** – A decade ago, the development of cluster tools in the IC manufacturing industry seemed to herald the end of batch processing systems. Single-wafer, multichamber tools were the wave of the future-they promised much in terms of throughput, uniformity, process control and unmanned automation. In contrast, the multiwafer, single-chamber batch tool was the thing we were moving away from, so much like VCRs and tape cassettes today. In high-tech manufacturing, we’re naturally drawn to the cutting edge, to the promise of better processes and higher return on investment. For example, many industries use tools like this [parylene coating machine from Para Tech Coating](https://www.parylene.com/Equipment-Dimer/Equipment) to help streamline processes. That’s what pushed the cluster movement more than 10 years ago, and plasma vapor deposition (PVD) processes were not immune to the trend. Chipmakers needed serious sputtering process improvements to keep up with Moore’s Law, and, to be truthful, the existing batch tools weren’t doing the job. Batch processing may be a reason as to why companies opt to invest in systems like [six sigma certifications](https://e-mri.net/), as a way to streamline automation processes, be more cost-effective and time-efficient within an organization. Since then, batch suppliers have developed a new generation of tools that meet the same processing requirements that drove IC manufacturers to the cluster tool format but with much lower cost. This is how providers such as [Octopart](https://octopart.com/) manage to get such a wide variety of stock at affordable prices for the industry to make use of. Unfortunately, there still exists a mindset in and outside of the industry that batch equals lagging-edge technology. This misperception can lead manufacturers to invest more in their sputtering processes than is necessary, depending on the application. For example, a purchasing manager for a telecommunications device customer was at a crossroads. His company’s sputtering technology had moved to cluster PVD, in line with the industry trend, but he now juggled a shrinking budget and a continuing need to produce photonic components. Batch systems could meet his performance specs in terms of film uniformity, throughput, process control and automation as well as SEMI and European CE standards governing tool uptime, reliability, and environmental health and safety, and do so on a platform that was simple to use and maintain. There were differences in two other critical areas: cost and flexibility. The manufacturer’s cluster tools required an up-front investment of about four times what a comparable batch system would cost; and because batch systems offer simpler design and operation, the cluster tool cost of ownership and tool maintenance costs were also much higher. On the flexibility front, the cluster format limited the company’s ability to move between substrate sizes, and its full automation didn’t allow for manual control of equipment when needed. Batch systems can run a wide variety of substrate sizes and materials, from fractions of an inch up to 26 inches and larger, square or round, tall or short-and substrate sizes can be changed from run-to-run, if needed. The bottom line: In this case, cluster PVD was overkill. It was like using a backhoe when a shovel would do. Three trends are shaping the answers to today’s batch-or-cluster PVD question. First, there have been major improvements in sputtering process control through better cathode designs and supporting components, such as residual gas analyzers, power supplies and software. This has resulted in batch tools that offer the process stability, control, uniformity and throughput for many advanced device applications, such as titanium oxide/silicon oxide electric thin-film mirror stacks in the optoelectronics industry. Second, customer demand for process expertise on the part of the PVD supplier has led to early customer partnerships and the development of customized software and hardware for advanced applications. Batch suppliers, just like other advanced tool suppliers, are now more than ever being asked to prove out customer processes even before the sale of the system. Third, an increasing variety of new and growing end-markets has led to demand for a flexible, cost-efficient processing platform such as the batch format. A broad customer base illustrates this trend. Potential markets span not just two or three, but 20 to 30 markets, including semiconductors, light-emitting diodes, thin-film resistors and capacitors, medical devices, ring laser gyros, flat panel displays and microelectromechanical systems. This is not to diminish the value of cluster tools. There’s no doubt that certain applications, such as high aspect ratio via filling in chip manufacturing, will continue to require the complete process isolation offered by cluster tools. But the question between cluster and batch should arise for those many applications that don’t require such a stringent environment. **Author Information:** *Kurt Flechsig is president of KDF Inc.* ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** batch processing, IC manufacturing​ --- ### [Alcatel Space Installs 943NT In-Line Sputtering System From KDF](https://www.kdf.com/alcatel-space-installs-943nt-in-line-sputtering-system-from-kdf/) **Published:** September 4, 2015 **Author:** KDF Technologies **Content:** ###### KDF RELEASE 2002 ### Sale facilitated by European representative TFEsrl KDF today announced that Alcatel Space, a world leader in space telecommunication, will install its 943NT in-line sputtering system this month. Alcatel Space, which is based in Toulouse, France, will use the KDF system in the manufacture of hybrid circuits for space applications. “After an evaluation of tools to replace our existing equipment, we found that the KDF 943NT in-line sputtering system was a perfect fit in our hybrid circuit production because it offered superior sputtering technology and the best process reliability,” said Philippe Bondeau, process engineer for Alcatel Space. “The sputter-down capability and easy substrate loading, in tandem with the powerful and flexible software, were key benefits behind our ordering this system, which is being used to produce advanced circuits for space applications.” TFEsrl, KDF’s European representative, facilitated the sale. Located in Milan, Italy, TFEsrl represents KDF product sales throughout Europe, and employs six senior field representatives with over 10 years of experience each. “Since this circuitry is being utilized for satellite applications, it is imperative that the system consistently produces uniform films ¾ the technology must be produced exactly and reliably,” said Kurt Flechsig, president of KDF. “As a previous customer of MRC, Alcatel is familiar with the production-proven sputtering technology in the 943NT system. This, coupled with our extensive customer support base, was a key driving point in the sale.” The 943NT is part of KDF’s 900 Series of PVD systems, all of which feature in-line sputter-down capabilities. Popular for their pure metal target deposition and convenient wafer-to-pallet loading abilities, the 900 Series systems can be configured with an optional high vacuum loadlock and three or four target positions. High-rate DC magnetron sputtering and single- or multiple-pass deposition features support the versatility and high-throughput of these production systems. Cathode and substrate orientation are horizontal, allowing gentle substrate fixturing for users. \# # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **About Alcatel Space** Alcatel Space ranks among the world’s leading space systems prime contractors. Leveraging its dual expertise in civil and military applications, Alcatel Space develops satellite technology solutions for telecommunications, navigation, optical and radar observation, meteorology, and scientific applications. Alcatel Space established its world leadership in satellite orders in 2000, winning the most orders for geo-stationary communications satellites, with a total of 10 satellites (27% of the market). A fully-owned subsidiary of Alcatel (100%), Alcatel Space generated 2000 revenues of 1.4 billion Euros and has 6,000 employees. ###### **About Alcatel** Alcatel (Paris: CGEP.PA and NYSE: ALA) builds next generation networks, delivering integrated end-to-end voice and data networking solutions to established and new carriers, as well as enterprises and consumers worldwide. With sales of EURO 31 billion in 2000 and 110,000 employees and, Alcatel operates in more than 130 countries. [www.alcatel.com](https://www.alcatel.com) ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** 943NT sputtering system, space telecommunications​ --- ### [Highly Uniform Dielectric Films Using A Combined Linear Scanning, Velocity Profiling and Planetary Rotating Motion](https://www.kdf.com/highly-uniform-dielectric-films-using-a-combined-linear-scanning-velocity-profiling-and-planetary-rotating-motion/) **Published:** September 23, 2015 **Author:** Rad Horak **Content:** ###### KDF RELEASE 2002 Exceptionally high uniformities and tight repeatabilities have been achieved for dielectric films on KDF 900 series sputtering tools using a proprietary ERPP™ (enhanced rotating planetary pallet) in conjunction with the tool’s standard linear scanning mode. We have developed reactive and non-reactive processes for materials such as SiO2, Si3N4, TiO2 and Al2O3, with uniformities better than +/- 1% over the pallet and repeatabilities of better than +/-0.5% from pallet to pallet. This performance enables us to provide production processes for multilayer dielectric mirrors and filters to the optoelectronics and display industry, as well as high quality silicon nitride passivation layers and antireflective coatings for compound semiconductors and solar cells. Specific reactive and non-reactive processes are discussed in depth. Additionally, a new system capability that allows the scan velocity to be programmed flexibly is discussed with respect to its potential for further uniformity improvement. *(Ref: Vacuum Technology and Coating, December 2002).* **Related Article:** [Highly uniform dielectric films using a combined linear scanning, velocity profiling and planetary rotating motion](/wp-content/uploads/2022/09/Highly-uniform-dielectric-films.pdf) By S. Gupta, A. Ruspini and M. Fregeau, KDF Electronics and Vacuum Services December 2002, Vacuum Technology & Coating article # # # ###### **About KDF** KDF Electronic & Vacuum Services, Inc., produces batch in-line sputtering tools in a wide variety of R&D and production formats for the mainstream silicon, emerging materials and flat-panel display markets. KDF systems are used in the production of semiconductors, photomasks, telecommunications networks, wireless circuits, gallium arsenide (GaAs), high density interconnect, sensors, optoelectronics, flat panel display and radio frequency power devices. KDF is located in Rockleigh, New Jersey, and has representatives in Europe, Japan, Taiwan, Singapore, Malaysia, China and Korea. ###### **Company Contacts** Kurt Flechsig President & CEO Tel: +1 (201) 784-5005 E-mail: **Categories:** News **Tags:** dielectric film uniformity, ERPP technology​ --- ### [Join Our Team!](https://www.kdf.com/join-our-team/) **Published:** December 22, 2023 **Author:** KDF Technologies **Content:** **KDF Technologies** is a leading manufacturer of PVD (physical vapor deposition) capital equipment to the microelectronics, medical, thin film circuits, and semiconductor markets. Located in **Northern NJ** we serve a variety of industries and companies from startups to Fortune 500 organizations. If this sounds exciting to you, apply to the **Control Systems Engineer or Applications Engineer** to be part of something special! > [Careers](https://www.kdf.com/company/careers/) **Categories:** careers --- ## Pages ### [Home](https://www.kdf.com/) **Published:** June 23, 2021 **Author:** Alex Miranda **Content:** KDF Technologies | Precision In-Line PVD Sputtering Systems ![KDF 974i In-Line Sputtering System](https://www.kdf.com/wp-content/uploads/2026/03/974-internal.jpg) ±1%Film Uniformity 35+Years of Expertise 600+Person-Years Engineering 100%Factory Qualified KDF Technologies – A Kurt J. Lesker Company # Precision Thin Film Begins Here World-class in-line PVD sputtering systems engineered for the most demanding substrates – medical implants, photonics, hermetic sealing, compound semiconductors, and beyond. [Request a Quote ](https://www.kdf.com/contact-us/) [Explore Systems ](https://www.kdf.com/products/in-line-products-kdf-technologies/)Scroll Trusted by [![NASA](https://www.kdf.com/wp-content/uploads/2022/08/nasa-logo-300-×-300-px.png)](https://www.kdf.com/company/kdf-clientele/) [![IBM](https://www.kdf.com/wp-content/uploads/2022/08/IBM-300-×-300-px-1.png)](https://www.kdf.com/company/kdf-clientele/) [![Intel](https://www.kdf.com/wp-content/uploads/2022/08/Intel-300-×-300-px-4.png)](https://www.kdf.com/company/kdf-clientele/) [![HP](https://www.kdf.com/wp-content/uploads/2022/08/HP-300-×-300-px-3.png)](https://www.kdf.com/company/kdf-clientele/) [![Lockheed Martin](https://www.kdf.com/wp-content/uploads/2022/10/Lockheed-300-×-300-px-5.png)](https://www.kdf.com/company/kdf-clientele/) [![Northrop Grumman](https://www.kdf.com/wp-content/uploads/2022/10/Northrop-Grumman.png)](https://www.kdf.com/company/kdf-clientele/) Industries We Serve ## If Your Process Requires Precise Thin Films, We’re Built for It KDF systems are deployed across the world’s most demanding thin-film applications, where process reliability is non-negotiable. ### Medical Devices Biocompatible metallization of implantable devices, stents, surgical instruments, and diagnostic substrates with zero contamination tolerance. Ti / TiNAu / PtDLC [Explore Application ](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-medical-device-in-line-sputter-coating-technology/)### Hermetic Sealing Feedthroughs, implantable housings, and ceramic-to-metal seals for aerospace, defense, and cardiac devices demanding absolute hermeticity. Ti / W / AuCeramicAlN [Explore Application ](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-hermetic-sealing-feedthroughs/)### Photonics & Quantum Laser diode facet coatings, optical isolators, and quantum device metallization where Angstrom-level thickness control defines device performance. SiO2 / Si3N4ITOAl2O3 [Explore Application ](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-laser-diodes-photonics-quantumtechnology/)### Integrated Passive Devices Ultra-precise resistor and capacitor thin films for IPDs, RF filters, and thin-film circuits with exceptional lot-to-lot repeatability. NiCr / TaNSiNCu / Al [Explore Application ](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-integrateddevices-components-thin-film-circuits/)### Sensors & Monitoring MEMS sensors, pressure transducers, and electrochemical devices with demanding thin-film requirements for industrial and medical monitoring. Pt / PdZnOMo / W [Explore Application ](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-sensors-and-monitoring/)### Wear Coatings Hard coatings for cutting tools, molds, and precision components. TiN, CrN, and DLC deposited in-line for production-scale hardness and adhesion. TiN / CrNDLCAlTiN [Explore Application ](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-wear-coatings/) Why KDF ## Process Depth That *Actually* Matters We don’t just sell equipment – we deliver process capability built over 35 years engineering solutions for NASA, Lockheed Martin, and the world’s most demanding fabs. ±1%Uniformity via ERPP 600+Person-Years of engineering 35+Years of process heritage 100%Factory process-qualified [Full Capability Story](https://www.kdf.com/company/benefits-of-buying-sputtering-equipment-from-kdf/) 01#### ERPP Uniformity Proprietary rotating planetary platen – sub-1% uniformity across substrate Proprietary 02#### Substrate-Safe Processing Low-temperature in-line for implants, polymers, and III-V wafers In-Line Only 03#### Precious Metal Deposition Upsilon Inset maximizes ROI on Au, Pt, Pd, and Ru targets Upsilon Inset 04#### HIPIMS Ultra-dense, pinhole-free coatings via high-power impulse magnetron sputtering Advanced 05#### Reactive PEM Control Plasma Emission Monitoring for stable stoichiometry in oxide and nitride films Reactive 06#### Run-to-Run Stability Automatic Rate Adjust closes the loop on deposition rate every run ARA 07#### In-House Process Dev KDF engineers develop your process before delivery – not after Included KDF Sputtering Systems ## The In-Line Platform Built for Production Reality Every KDF system is engineered from the ground up for continuous high-throughput production – not adapted lab equipment. Flagship ![KDF 974i Series](https://www.kdf.com/wp-content/uploads/2026/03/974-internal.jpg) KDF Flagship System ### 974i Series KDF’s most advanced in-line sputtering platform. Built for the highest-value substrates – ceramic implants, AlN, compound semiconductors – where uniformity and process cleanliness are non-negotiable. ±1% UniformityHIPIMS Ready8-Cathode ConfigPEM Control [View 974i Details ](https://www.kdf.com/products/in-line-products-kdf-technologies/974i-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) ![KDF 900i Series](https://www.kdf.com/wp-content/uploads/2024/08/954i-Interior.png) Production Series ### 900i Series High-throughput in-line platform proven across medical, IPD, and semiconductor production environments. High ThroughputMulti-Cathode [View Details ](https://www.kdf.com/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) ![KDF 844i System](https://www.kdf.com/wp-content/uploads/2026/03/844-external.jpg) Mid-Range Production ### 844i System Balanced capacity and footprint for mid-volume production with flexible cathode configurations. Flexible ConfigERPP Ready [View Details ](https://www.kdf.com/products/in-line-products-kdf-technologies/844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) ![KDF 744i System](https://www.kdf.com/wp-content/uploads/2026/03/744-external.jpg) R&D to Production ### 744i System The bridge from development to production. Qualifies your process today and scales with your volume tomorrow. R&D CapableScale-Up Path [View Details ](https://www.kdf.com/products/in-line-products-kdf-technologies/744-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) ![KDF 600i Series](https://www.kdf.com/wp-content/uploads/2026/03/643-external.jpg) Entry Production ### 600i Series Full KDF process heritage in a compact, cost-effective platform for smaller substrates and moderate throughput. CompactProduction Ready [View Details ](https://www.kdf.com/products/in-line-products-kdf-technologies/600-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) [View All Sputtering Products](https://www.kdf.com/products/in-line-products-kdf-technologies/) Process Capability ## One Platform. Every Process You Need. Deposition Modes ### How We Deposit - DC Magnetron Sputtering - RF Sputtering - HIPIMS - Reactive Sputtering - Co-Sputtering - Pulsed DC Materials ### What We Deposit - Metals: Ti, W, Mo, Ta, Al, Cu - Precious: Au, Pt, Pd, Ru, Ag - Nitrides: TiN, CrN, AlTiN, Si3N4 - Oxides: SiO2, Al2O3, ITO, ZnO - Alloys: NiCr, TaN, NiFe - DLC Coatings Substrate Geometries ### What We Coat - Wafers (Si, SiC, GaN, GaAs) - Ceramics (AlN, Al2O3) - 3D Parts & Implants - Flexible Substrates - Small-Die & Singulated - Carrier-Mounted Assemblies Process Controls ### How We Control It - ERPP Uniformity Platen - PEM Reactive Control - ARA Rate Stabilization - In-Situ Film Monitoring - Real-Time Power Control - Full Recipe Management Customer Testimonials ## What Our Clients Are Saying ” ★★★★★ We bought our first KDF 12 years ago… 12 years later we are buying our fourth KDF system. We have multiple sputter systems from 6 different manufacturers. KDF is the best vendor we have dealt with. They set the bar for customer service and quality. MJM. JonesProduction Engineering – 4x KDF Customer ” ★★★★★ I worked with KDF for 15 years. The machines are built with high quality components. KDF customer service is outstanding and they stand behind their product. If I ever had a question, they respond rapidly. HHHaytham HusseinProcess Engineer – 15-Year Partner ” ★★★★★ We are working with KDF for a few years and the support is great. The technician in Europe answers mail very fast and his knowledge is very extensive. The support for spare parts is very good too. AEAitor Arregi ElorzaMaintenance Technician – European Facility Technical Resources ## Insights From 35 Years of Thin-Film Engineering [ ![Engineering TiO2 Thin Film Properties](https://www.kdf.com/wp-content/uploads/2026/04/Tio2-main-image.jpg) April 2026 ### Engineering TiO₂ Thin-Film Properties Through Oxygen Control How KDF’s reactive DC sputtering platform enables precise tuning of TiO₂ refractive index, roughness, stress, and sheet resistance – all at constant thickness. Read White Paper ](https://www.kdf.com/tio2-reactive-sputtering-oxygen-control/) [ ![ERPP Technology](https://www.kdf.com/wp-content/uploads/2025/07/_4072-600x338.jpeg) July 12, 2025 ### ERPP Technology: Achieving ±1% Thin Film Uniformity A deep technical look at the rotating planetary platen system delivering industry-leading thickness uniformity. Read Article ](https://www.kdf.com/erpp-technology-thin-film-uniformity/) [ ![MRC Heritage](https://www.kdf.com/wp-content/uploads/2024/01/MRC_logo-600x338.png) August 7, 2025 ### MRC Heritage and Evolution Honoring a legacy of innovation and sustaining a standard of excellence across decades of thin-film history. Read Article ](https://www.kdf.com/mrc-heritage-and-evolution-honoring-a-legacy-of-innovation-and-sustaining-a-standard-of-excellence/) [View All News & Articles](https://www.kdf.com/news/)## Ready to Talk About *Your Process?* Our application engineers are standing by to discuss your substrate, your film stack, and the right KDF system for your production needs. [Request a Quote ](https://www.kdf.com/contact-us/) [Learn About PVD](https://www.kdf.com/products/what-is-pvd-and-sputtering/) [ (201) 784-5005 ](tel:+12017845005) 10 VOLVO DRIVE · ROCKLEIGH, NJ 07647 KDF EVENTS Upcoming Events [events_list limit=”3″ style=’grid’] View MORE --- ### [Contact Us Page](https://www.kdf.com/contact-us/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Contact KDF Technologies | Request a Quote | Inline Sputtering Systems KDF Technologies · Rockleigh, NJ # Let’s Talk About *Your Process.* Whether you’re evaluating a new inline sputtering system, need support for existing KDF or MRC equipment, or want to discuss your thin film requirements – our engineering team responds fast. [ 📞 Sales & General Inquiries (201) 784-5005 ](tel:+12017845005) [ 🔧 Customer Service & Support (201) 784-1400 ](tel:+12017841400) [ ✉️ Email Us sales@kdf.com ](mailto:sales@kdf.com) ★★★★★ “We bought our first KDF 12 years ago… 12 years later we are buying our fourth KDF system. We have multiple sputter systems from 6 different manufacturers. KDF is the best vendor we have dealt with.” M. Jones – Production Engineering, 4× KDF Customer Request a Quote or Information Our engineering team responds to all inquiries directly – typically within one business day. Fast Response Engineering Team Direct No Obligation ### Headquarters – North America 📍 Address [10 Volvo Drive, Rockleigh, NJ 07647](https://goo.gl/maps/z5Fh4fZRmCvKu2AW8) 📞 Sales [(201) 784-5005](tel:+12017845005) 🔧 Service & Support [(201) 784-1400](tel:+12017841400) 📠 Fax (201) 784-0202 ✉️ Email ### Europe – United Kingdom 📍 Address Austin House, Sidney Little Road Churchfields Industrial Estate St. Leonards on Sea, East Sussex TN38 9PU 📞 Phone [+44 1424 458 143](tel:+441424458143) ✉️ Email ### Asia – China 📍 Address Kurt Lesker (Shanghai) Trading Co. Building 31-32, Lane 1000 Zhangheng Road Pudong New Area, Shanghai 201203 📞 Phone [+86 21 50115900](tel:+862150115900) 🌐 Regional Support Kurt J. Lesker Company Asia Pacific Effective August 1, 2026 VaporTech PVD System Support – Now at KDF All VaporTech service, spare parts, and applications support transitions to KDF Technologies on August 1, 2026. Until then, continue contacting VaporTech directly. [Learn More →](/vaportech-support/) [VaporTech Service (Until Aug 1) ↗](mailto:servicesupport@vaportech.com) How We Can Help ## What Can We *Help You With?* ### New System Inquiry Evaluating an inline sputtering platform? Our engineers will help you select the right system and validate your process in our Rockleigh, NJ facility before you commit. ### Quote Request Ready for pricing on a new KDF system, OEM parts, sputter targets, or bonding services? Submit your requirements and we’ll respond promptly. ### Service & Repair Need field service, repair, or parts for a KDF or MRC system? 2-3 day turnaround, no expedite fees, 600+ combined man-years of equipment experience. ### Process Development Developing a new thin film process? KDF’s 2,000 sq. ft. applications lab can prove your process before you commit to capital equipment. ### OEM Parts & Upgrades Original OEM replacement parts, upgrade kits, and retrofit solutions for KDF and MRC equipment. The only authorized source for MRC legacy parts. ### VaporTech Support Operating a VaporTech PVD system? KDF becomes the authorized service and parts provider August 1, 2026. All 6 platforms covered. What Our Customers Say ## Trusted by Engineers *Who Know the Difference* ★★★★★ “We bought our first KDF 12 years ago… 12 years later we are buying our fourth KDF system. We have multiple sputter systems from 6 different manufacturers. KDF is the best vendor we have dealt with. They set the bar for customer service and quality.” MJ M. Jones Production Engineering – 4× KDF Customer ★★★★★ “I worked with KDF for 15 years. The machines are built with high quality components. KDF customer service is outstanding and they stand behind their product. If I ever had a question, they respond rapidly.” HH Haytham Hussein Process Engineer – 15-Year Partner ★★★★★ “We are working with KDF for a few years and the support is great. The technician in Europe answers mail very fast and his knowledge is very extensive. The support for spare parts is very good too.” AE Aitor Arregi Elorza Maintenance Technician – European Facility Ready to Talk? ## In Line With *Your Process.* Our sales and engineering team is ready to discuss your application and help you find the right solution. [📞 (201) 784-5005](tel:+12017845005) [Worldwide Locations](/company/worldwide-locations-kdf-electronics/) [Services & Support](/products/services-inline-sputtering-systems/) --- ### [About KDF Technologies Inline Sputtering Equipment](https://www.kdf.com/company/about-kdf-technologies-inline-sputtering-equipment/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** About KDF Technologies # Precision *Thin Film* Coatings. Built on Decades of Expertise. KDF Technologies LLC is a world leader in inline physical vapor deposition (PVD) sputtering systems – delivering the consistent, repeatable thin film coatings that semiconductor fabs, medical device manufacturers, and research institutions depend on. 35+ Years of Expertise 2,000+ Systems Installed Worldwide 50%+ Of Global Semiconductor Fabs 600+ Man-Years MRC/KDF Experience Who We Are ## A Legacy of Inline Sputtering Innovation Founded in 1986, KDF has grown into one of the most trusted names in inline PVD sputtering – supplying both new and remanufactured batch sputtering systems to customers across the globe who demand precise, repeatable thin film coatings on high-value substrates. Our systems are built for production environments where coating consistency isn’t a preference – it’s a requirement. Whether you’re depositing metal films on semiconductor wafers, applying biocompatible coatings to medical implants, or developing novel materials in a research lab, KDF delivers the process control and uptime your operations depend on. In January 2022, KDF was acquired by the Kurt J. Lesker Company (KJLC), the leading global provider of vacuum technology. This partnership strengthens our engineering resources, global service network, and long-term product roadmap – while KDF continues to operate with the specialized focus and responsiveness our customers have always known. ![KDF Technologies inline sputtering system interior](https://www.kdf.com/wp-content/uploads/2023/09/Internal2.jpg) What We Deliver ## Engineering for Coating Consistency at Scale KDF sputtering systems are designed for one purpose: delivering uniform, repeatable thin film coatings on demanding substrates – run after run, at production scale. ### Precision Thin Film Deposition KDF inline sputtering systems deliver exceptional film uniformity and purity across metals, alloys, and compound targets – engineered for tight process windows and high-yield production. ### Full Lifecycle Service & Support With over 600 man-years of combined MRC/KDF equipment experience, our team provides OEM parts, field service, training, and thin film process support – worldwide. ### Turnkey Process Solutions Our Rockleigh, NJ metrology lab enables KDF engineers to develop and validate your process before you place an order – minimizing risk and accelerating your path to production. Industries We Serve ## Trusted Across High-Precision Industries KDF thin film sputtering systems are deployed in some of the world’s most demanding coating applications – where substrate value, process purity, and coating consistency are non-negotiable. ### Semiconductor Metal deposition on silicon wafers, GaAs, and advanced substrates. Used in fabs worldwide for interconnects, barriers, and contact layers. ### Medical Devices Biocompatible thin film coatings for implants, sensors, and surgical instruments. Precision deposition where regulatory compliance is critical. ### Laser Diodes & Photonics Optical and conductive coatings for laser diodes, photonic devices, and quantum technology applications. ### Integrated Passive Devices Thin film resistors, capacitors, and circuits for telecom, RF, and high-frequency electronics manufacturing. ### Sensors & MEMS Precise metal and dielectric film deposition for pressure sensors, accelerometers, and micro-electromechanical systems. ### Research & University Labs Flexible, configurable sputtering platforms for materials science, thin film research, and process development at academic institutions. ![Kurt J. Lesker Company team](https://www.kdf.com/wp-content/uploads/2023/09/EnablingTeamsGraphic.jpg) A Kurt J. Lesker Company ## Global Backing. Specialized Focus. The Kurt J. Lesker Company (KJLC) has been a global leader in vacuum technology since 1954 – headquartered in Jefferson Hills, PA with operations worldwide. KJLC’s acquisition of KDF in 2022 brings expanded engineering resources and a global supply chain while preserving what makes KDF distinctive: deep inline sputtering expertise and responsive customer support. KJLC is a Woman-Owned Small Business (WOSB) driven by a mission of *Enabling Technology for a Better World* – a mission KDF shares through every system we ship and every process we support. [Visit lesker.com →](https://www.lesker.com/) Our History ## Built on the MRC Legacy – Advancing It Forward KDF’s inline sputtering systems trace their lineage to Materials Research Corporation (MRC), founded in 1957 and recognized as a pioneer in thin film deposition technology. Understanding that history explains why KDF systems are so deeply embedded in production environments around the world. 1957 ### Materials Research Corporation (MRC) Founded MRC established in Yonkers, NY by Dr. Sheldon Weinig, pioneering sputtering systems and high-purity materials for the semiconductor industry. MRC develops the foundational inline sputtering platforms still in use today. 1986 ### KDF Electronics Founded KDF is established as a dedicated service organization for MRC’s batch inline sputtering product line – building the deep equipment expertise that defines KDF today. 1996 ### MRC Outsources Batch Assembly to KDF MRC formally outsources batch product assembly to KDF, cementing KDF’s role as the manufacturer and steward of the inline sputtering product line. 1999 ### KDF Acquires MRC Product Lines from TEL After Tokyo Electron Limited (TEL) acquired MRC’s equipment operations, KDF acquired the full batch and etch product lines – re-engineering the systems for modern throughput and versatility requirements. 2022 ### KDF Acquired by Kurt J. Lesker Company KDF Electronics & Vacuum Services, Inc. is acquired by KJLC and rebranded as KDF Technologies, LLC – combining the inline sputtering expertise of KDF with the global resources of the world’s leading vacuum technology company. ![MRC Materials Research Corporation logo](https://www.kdf.com/wp-content/uploads/2024/01/MRC_logo-1021x1024.png)KDF Technologies is the authorized successor to MRC’s inline sputtering product lines – supplying original OEM parts, service, and support for MRC equipment worldwide. Common Questions ## KDF Technologies – FAQ For engineers, procurement teams, and researchers evaluating inline thin film deposition equipment – here are answers to the questions we hear most. Who makes inline thin film deposition sputtering systems?+KDF Technologies is one of the world’s leading manufacturers of inline thin film deposition and PVD sputtering systems. Our systems are installed in more than 2,000 locations worldwide – including over half of all global semiconductor fabrication facilities. We offer both new and remanufactured inline sputtering systems configurable for a wide range of substrates, film stacks, and throughput requirements. What happened to Materials Research Corporation (MRC) sputtering systems?+Materials Research Corporation (MRC) was founded in 1957 and became a pioneer in inline sputtering technology. In 1998, Tokyo Electron Limited (TEL) acquired MRC’s equipment operations. KDF then acquired the full MRC batch and inline sputtering product lines from TEL in 1999 – re-engineering the systems for modern throughput requirements. KDF Technologies is the authorized successor to MRC’s inline sputtering product lines and continues to manufacture, support, and supply parts for these systems worldwide. Does KDF support legacy MRC sputtering equipment?+Yes – fully. KDF is the authorized successor to MRC’s inline sputtering product lines and maintains complete parts, service, and support for MRC equipment. Our team carries over 600 man-years of combined MRC and KDF equipment experience. We supply original OEM parts, sputter targets, field service, upgrade kits, and operator training for MRC systems still in production worldwide. What industries does KDF serve?+KDF serves any manufacturer or researcher who requires consistent, repeatable thin film coatings on high-value substrates. Our primary markets include semiconductor fabrication, medical device manufacturing, laser diode and photonics production, integrated passive devices (IPDs), MEMS and sensors, industrial wear coatings, and academic and commercial R&D laboratories. Who owns KDF Technologies?+KDF Technologies is a subsidiary of the Kurt J. Lesker Company (KJLC), which acquired KDF in January 2022. KJLC is a global leader in vacuum technology founded in 1954, headquartered in Jefferson Hills, PA. KDF continues to operate as a specialized inline sputtering business – retaining its dedicated engineering team, product focus, and customer relationships while benefiting from KJLC’s global infrastructure. Work With KDF ## Ready to Discuss Your Coating Requirements? Our engineers can help you identify the right inline sputtering configuration for your substrate, film stack, and throughput needs – and validate your process in our Rockleigh facility before you commit. [Request a Quote →](/contact-us/) [View Sputtering Systems →](/products/in-line-products-kdf-technologies/) --- ### [Applications](https://www.kdf.com/applications/) **Published:** February 8, 2024 **Author:** KDF Technologies **Content:** Applications – KDF Technologies | Thin Film PVD Sputtering Applications KDF Technologies # Thin Film Applications KDF’s inline sputtering systems are in use at leading manufacturers across the world’s most demanding thin film applications – from implantable medical devices and photonic components to wear-resistant coatings. Select your application to learn more. [Hermetic Sealing](/products/in-line-products-kdf-technologies/kdf-hermetic-sealing-feedthroughs/) [Integrated Passive Devices](/products/in-line-products-kdf-technologies/kdf-integrateddevices-components-thin-film-circuits/) [Laser Diodes & Photonics](/products/in-line-products-kdf-technologies/kdf-laser-diodes-photonics-quantumtechnology/) [Medical Devices](/products/in-line-products-kdf-technologies/kdf-medical-device-in-line-sputter-coating-technology/) [Sensors & Monitoring](/products/in-line-products-kdf-technologies/kdf-sensors-and-monitoring/) [Wear Coatings](/products/in-line-products-kdf-technologies/kdf-wear-coatings/) Select Your Application ## Six Application Areas. One Platform. [ ![Hermetic Sealing](https://www.kdf.com/wp-content/uploads/2024/02/AdobeStock_292317454.jpeg) 01 ### Hermetic Sealing & Biocompatible Thin Films Precision thin film depositions for pacemakers, cochlear implants, biosensors, and implantable electronics – where biocompatibility, uniformity, and hermeticity are non-negotiable. Au Ti Pt TiN Ir View Application → ](/products/in-line-products-kdf-technologies/kdf-hermetic-sealing-feedthroughs/) [ ![Integrated Passive Devices](https://www.kdf.com/wp-content/uploads/2024/02/AdobeStock_360997061.png) 02 ### Integrated Passive Devices (IPDs) Sub-±1% uniformity thin film resistors, capacitors, and inductors for RF, microwave, and mixed-signal applications. KDF’s ERPP™ and x Series™ systems are the platform of choice for precision IPD fabrication. NiCr TaN Cu Au SiO₂ View Application → ](/products/in-line-products-kdf-technologies/kdf-integrateddevices-components-thin-film-circuits/) [ ![Laser Diodes Photonics](https://www.kdf.com/wp-content/uploads/2024/02/AdobeStock_625958171-scaled.jpeg) 03 ### Laser Diodes, Photonics & Quantum Technology Thin film depositions for optical fiber comms, LIDAR, medical imaging, and quantum computing components. KDF systems deliver the uniformity critical for wavelength-sensitive photonic device fabrication. Ge Pd Au Pt TiN View Application → ](/products/in-line-products-kdf-technologies/kdf-laser-diodes-photonics-quantumtechnology/) [ ![Medical Devices](https://www.kdf.com/wp-content/uploads/2024/01/AdobeStock_619741105-scaled.jpeg) 04 ### Medical Device Sputter Coating Biocompatible, wear-resistant, and DLC coatings for surgical instruments, implants, drug delivery systems, and optical medical devices. KDF systems are in use at leading medical device manufacturers worldwide. DLC TiN Au Ir Pt View Application → ](/products/in-line-products-kdf-technologies/kdf-medical-device-in-line-sputter-coating-technology/) [ ![Sensors and Monitoring](https://www.kdf.com/wp-content/uploads/2024/02/AdobeStock_400270859-scaled.jpeg) 05 ### Sensors & Monitoring Thin film deposition for reed switches, waveguide sensors, high-temperature strain gauges (PdCr to 1100°C), polymer thin film chemical sensors, and biosensors – from R&D quantities to full production. PdCr NiCr Au TiN Ag View Application → ](/products/in-line-products-kdf-technologies/kdf-sensors-and-monitoring/) [ ![Wear Coatings](https://www.kdf.com/wp-content/uploads/2024/02/AdobeStock_328029030-scaled.jpeg) 06 ### Wear Coatings & Surface Protection PVD wear coatings for drill bits, razor blades, automotive components, industrial tooling, and medical implants. TiN, CrN, TiAlN, DLC, and more – extending product life and reducing friction across demanding applications. TiN CrN TiAlN DLC W View Application → ](/products/in-line-products-kdf-technologies/kdf-wear-coatings/) Across All Applications ## One Platform. Every Application. Every KDF application page details the specific materials, process options, and system configurations relevant to that market. The underlying platform – KDF’s 600i, 900i, and 974i Series – provides the same core architecture across all applications, with a comprehensive menu of options that can be configured to your exact requirements. ERPP™ Sub ±1% Uniformity HIPIMS Upsilon Inset™ 60% Utilization Pulsed DC Reactive Auto Rate Adjust Plasma Emission Monitoring 5-Pallet Stacker IR Temperature Measurement 3D Parts up to 4″ Ellipsometer Integration Scan Velocity Control Get in Touch ## Don’t See Your Application? KDF’s applications, design, and vacuum engineering teams work across a much broader range of thin film processes. If your application isn’t listed, contact us – we’ve likely done it. [Contact KDF Technologies →](/contact-us/) [View All Systems](/products/in-line-products-kdf-technologies/) --- ### [Error 404](https://www.kdf.com/error-404/) **Published:** June 24, 2021 **Author:** Alex Miranda **Content:** 404 KDF Technologies – Page Not Found # We’d Love to Help You Find What You’re *Looking For* The page you’re looking for has moved, been renamed, or doesn’t exist yet. But whatever brought you here – a product, a process, or a coating question – our team can point you in the right direction. [ Let’s Talk Process → ](/contact-us/) [ Back to Homepage ](/) [Systems & Products](/products/) [Applications](/applications/) [VaporTech Support](/vaportech-support/) [About KDF](/company/about-kdf-technologies/) [Contact Us](/contact-us/) PVDCathodic Arc DLCPECVD RAAMS™Magnetron LTAVD®Low-Temp Arc TiN · CrN · ZrNWear Coatings --- ### [VaporTech Support](https://www.kdf.com/vaportech-support/) **Published:** April 2, 2026 **Author:** KDF Technologies **Content:** VaporTech PVD Service & Support | KDF Technologies VaporTech Service & Support: Now KDF Technologies # VaporTech PVD *Support* is Moving *Here.* Effective August 1, 2026, all VaporTech PVD system service, spare parts, and applications support transitions to KDF Technologies, a purpose-built organization focused on PVD and advanced deposition process equipment, backed by the engineering depth and global infrastructure of the Kurt J. Lesker Company. Transition effective August 1, 2026 [ Contact KDF Technologies ](/contact-us/) [ See Covered Systems ](#systems) ![VaporTech](https://www.kdf.com/wp-content/uploads/2026/04/Vt-logo-primary-registered.webp)### Service & Support Contacts Use VaporTech contacts now. KDF Technologies contact details will be confirmed before August 1. Service & Technical Support: Now through July 31 Spare Parts Quotes & Orders: Now through July 31 Beginning August 1, 2026 All service, spare parts, and applications support provided by KDF Technologies. Updated contact information will be shared before the transition date. Questions About the Transition [Contact KDF Technologies →](/contact-us/) Your VaporTech service leadership team will reach out directly over the coming weeks to discuss the details of this transition. What to expect ## The Transition Timeline Now Today through July 31, 2026 No changes to your current support. Continue contacting VaporTech directly for all service, parts, and applications needs. Your VaporTech service leadership will reach out to discuss the transition personally. Aug 1 August 1, 2026 KDF Technologies assumes all VaporTech service, spare parts, and applications support. KDF’s service team is fully trained on VaporTech systems and OEM-designed parts are stocked and ready. → Together. VaporTech’s deep system and process knowledge combined with KDF Technologies’ engineering depth, manufacturing capacity, and global service infrastructure, supporting your equipment through its full lifecycle. ![VaporTech facility with technicians](https://www.kdf.com/wp-content/uploads/2026/05/Vaportech_facilityoverall-techs1and3-cropped-further-to-resize.png) The team behind your systems VaporTech’s deep process and system knowledge transfers to KDF Technologies, ensuring the expertise your operation depends on doesn’t walk out the door. All systems covered ## Your *VaporTech System* Is Fully Supported KDF’s service organization is trained and certified on all VaporTech PVD system platforms, including the legacy VT-3000. OEM-designed spare parts are available for every model. V.MAX1500™ Industrial Batch Flexible industrial PVD coating system with up to 6 cathodic arc / magnetron sputtering sources. Newest VaporTech platform. VT-1000i™ Compact / 6-Rack Compact PVD & PECVD/DLC system for small-to-medium operations. Smallest footprint in the VTi Series. VT-1500i™ Mid-Size / 10-Rack High-capacity PVD with optional magnetron sputtering. Up to 3 PVD sources. Competitive price-to-capacity ratio. VT-3000i™ High Volume / 16-Rack Largest VTi system. 16 racks, parts up to 122 cm (48 in). Centrally mounted cathodic arc source for uniform coating. VT-3000 Legacy / 16-Rack Predecessor to the VT-3000i. Same chamber size and coating capabilities – 16 racks, parts up to 122 cm (48 in). Sold through 2019; updated controls and smaller footprint carried forward in the VT-3000i™. Cadence® Magnetron / RAAMS™ Compact magnetron sputtering system featuring proprietary RAAMS™ technology for functional coatings and DLC. Full-spectrum support ## Built for This. *By KDF Technologies.* KDF Technologies is a purpose-built organization focused on PVD and advanced deposition process equipment. This isn’t a hand-off to a generalist. It’s a transition to a team with the exact expertise, manufacturing depth, and infrastructure your VaporTech system deserves for the long haul. 70+ Years of PVD system heritage, rooted in Materials Research Corporation 50 Subcomponents checked on each annual maintenance visit OEM Parts designed to original VaporTech specifications 3 Global service regions: North America, Europe, Asia [ Request a Service Consultation ](/contact-us/)#### Preventative Maintenance & Repair Full preventative maintenance including water control system, turntable, vacuum-pump system, electrical system, gas delivery system, chamber cleaning, shield replacement, and operational qualification. Restores system to like-new performance. #### OEM-Designed Spare Parts Genuine parts designed to original VaporTech specifications, manufactured through KDF’s engineering and in-house manufacturing capacity. Stocked across global inventory locations in North America, Europe, and Asia for fast turnaround, factory-certified to maximize system performance and minimize downtime. #### Applications & Coating Optimization Our team of thin-film material scientists works with you to optimize coating processes for function, durability, and appearance. Covers coating feasibility, process optimization on your actual parts, and production readiness. #### Installation & Training System integration into existing manufacturing operations, installation support, and operator training on system operation, coating processes, and maintenance procedures. #### System Upgrades Factory-trained personnel available to install upgrades and repairs. Upgrades may include new arc or bias power supplies, controls, expanded process gas capability, or additional coating sources. Why KDF Technologies ## *Purpose-Built* for Deposition Equipment KDF Technologies isn’t a general service provider that’s learning PVD. It’s a dedicated organization backed by decades of production knowledge and the global infrastructure of the Kurt J. Lesker Company, and exists specifically to support PVD and advanced deposition systems. ![KDF Technologies deposition equipment](https://www.kdf.com/wp-content/uploads/2026/05/Multi-coupon-transparent-scaled-e1778245748778.png) KDF #### Dedicated Deposition Equipment Focus KDF Technologies is a purpose-built company focused on PVD and advanced deposition process equipment, including process materials, targets, and related services. Based in Rockleigh, New Jersey, KDF brings decades of production system knowledge with the engineering depth to support your systems at the component level. 70+ #### Decades of PVD System Heritage KDF Technologies carries forward the legacy of Materials Research Corporation, one of the original pioneers of commercial PVD sputtering systems. That heritage spans more than 70 years of production system knowledge, engineering drawings, and process expertise built specifically around the kind of equipment VaporTech customers run every day. ISO #### 9001:2015 Certified Quality All products and services meet ISO 9001:2015 quality standards. Every part ships with a certificate of analysis and material safety data sheet. Helium leak detection and RGA testing ensure proper vacuum quality on every system that leaves the facility. #### PVD & Thin-Film Applications Laboratory KDF maintains on-site applications labs equipped for PVD sputtering, e-beam and thermal evaporation, and advanced process development. Materials analytical equipment, including profilometers, 4-point probes, and ellipsometers, supports coating trials and customer process optimization for the same industrial and medical applications VaporTech customers rely on, including DLC and biocompatible coatings. #### Global Inventory & Service Infrastructure Global vacuum component inventory locations across North America, Europe, and Asia ensure fast parts availability. The Kurt J. Lesker Company’s global service infrastructure provides regional coverage for North America, South America & Australia, EMEIA, and Asia, with dedicated teams, phone support, and in-region engineering resources for every VaporTech customer worldwide. Common questions ## Transition *FAQ* Will service quality change after August 1? No, and in many cases it will improve. KDF Technologies’ service organization is currently undergoing comprehensive training on VaporTech PVD equipment, and the transition is structured to maintain continuity. Both VaporTech and KDF Technologies are aligned on this outcome: you can expect the same or improved levels of quality, performance, responsiveness, and lead times. KDF’s manufacturing depth and global component inventory further strengthen parts availability compared to what many customers experience today. Will parts be OEM quality? Yes. KDF Technologies will provide OEM-designed spare parts built to original VaporTech specifications. These are manufactured through KDF’s engineering and in-house manufacturing capacity, not aftermarket substitutes. All parts meet ISO 9001:2015 quality standards and ship with certificates of analysis. Will my coating recipes and processes be preserved? Yes. KDF’s applications team will work with you to ensure continuity of your existing coating processes. If you require coating optimization or adjustments, our team of thin-film material scientists is available to help, covering the same scope as VaporTech’s Coating Optimization Program (feasibility, process optimization, and production readiness). Do I need to do anything before August 1? No action is required before August 1, 2026. Continue contacting VaporTech directly at for all service, support, and spare parts needs. Your VaporTech service leadership team will reach out directly over the coming weeks to discuss the transition. You’re also welcome to contact KDF Technologies now through our contact page with any questions. What happens to my existing maintenance contract or service agreement? Existing agreements will be honored through the transition. Your VaporTech service team will contact you directly to discuss the details of your specific agreement and how it transfers. Please reach out to KDF Technologies through our contact page with any questions. Which VaporTech systems does this cover? All VaporTech PVD system platforms are covered, including the V.MAX1500™, VT-1000i™, VT-1500i™, VT-3000i™, VT-3000, and Cadence® systems. The VT-3000 is the predecessor to the VT-3000i – same chamber size and coating capabilities, sold through 2019. If you have a legacy VT-Series system not listed, contact us and we will confirm coverage for your specific model. How do I reach KDF Technologies? You can reach KDF Technologies through our [contact page](/contact-us/). Beginning August 1, 2026, dedicated VaporTech service contact information will be provided directly to all current VaporTech customers. ## Questions About the *Transition?* Our team is ready to answer any questions about service continuity, parts availability, or the transition timeline. Reach out now – no need to wait until August 1. [ Contact KDF Technologies](/contact-us/) [ VaporTech Service (Until Aug 1)](mailto:servicesupport@vaportech.com) --- ### [Revolutionizing Thin Film Deposition](https://www.kdf.com/erpp-technology-thin-film-uniformity/) **Published:** April 1, 2026 **Author:** KDF Technologies **Content:** ERPP Technology: Achieving ±1% Thin Film Uniformity | KDF Technologies KDF Technologies · Technical Paper # ERPP Technology: *±1% Thin Film* Uniformity How KDF’s Enhanced Rotating Planetary Pallet delivers industry-leading metallic film uniformity and repeatability for semiconductor, photonics, and acoustic filter applications. By Firas Mahyob · July 12, 2025 Technical Paper Thin Film Deposition Executive Summary ## Setting a New Standard for Deposition Excellence In the race to meet ever-tightening demands of microelectronics and optical device manufacturing, precision and repeatability are no longer luxuries – they’re requirements. KDF Technologies’ **Enhanced Rotating Planetary Pallet (ERPP)** is a breakthrough in sputtering system design that delivers metallic film uniformity better than **±1%** and repeatability exceeding **±0.5%**. By combining advanced planetary motion with linear scanning, the ERPP architecture redefines what’s possible in thin film deposition. Whether you’re engineering multilayer conductive barriers for integrated circuits or optimizing titanium tungsten coatings for acoustic filters, this next-generation platform ensures unmatched consistency, surface quality, and process control. ±1% Film Uniformity Across Pallet ±0.5% Run-to-Run Repeatability 4× Wafers Per Planetary Pallet Technology Overview ## How the ERPP Achieves Superior Uniformity Metallic coatings deposited using the KDF ERPP exhibit exceptionally high film uniformity and tight process repeatability. This performance is driven by the synergistic combination of **planetary revolution** and the system’s standard **linear scanning mode**. KDF Technologies has developed both reactive and non-reactive sputtering processes for metallic, semi-metallic, semiconductor, and dielectric materials. These processes consistently achieve film uniformity better than **±1% across the pallet**, with repeatability exceeding ±0.5% from pallet to pallet – enabling high-performance processing of multilayer conductive barriers and contact materials essential for integrated circuits. ![KDF 943i Sputtering System with ERPP technique and linear scanning](https://www.kdf.com/wp-content/uploads/2025/07/Figure-1-the-kdf-943i-sputtering-system-incorporates-the-erpp-technique-alongside-standard-linear-scanning-enhancing-deposition-uniformity-and-process-flexibility-300x220.jpg) Fig. 1 – KDF 943i with ERPP and standard linear scanning ![KDF ERPP Enhanced Rotating Planetary Pallet schematic](https://www.kdf.com/wp-content/uploads/2025/07/Figure-2-kdfs-erpp-enhanced-rotating-planetary-pallet-300x214.jpg) Fig. 2 – KDF ERPP 6″ wafer configuration The KDF 900 series sputtering tools employ a combination of linear scanning and sophisticated rotating motion. The ERPP ensures that all areas of the substrate are exposed to sputtered material from various angles – averaging out the angular distribution of sputtered atoms while linear motion compensates for non-uniform target erosion and plasma density variations. Together, both mechanisms maximize exposure to sputtered flux from all directions, eliminating spatial non-uniformities in the sputtering plume. Pallet uniformity and run-to-run repeatability on the order of **±1%** was demonstrated across tungsten (W) and titanium tungsten (TiW) deposition processes – enabling precise, repeatable processing of complex multilayer metallic coatings for optical devices and semiconductor components. System Architecture ## The Planetary Motion Design At the heart of the ERPP is an elegant mechanical architecture. On top of the pallet sits a rotating platform – the **“sun”** – which rotates continuously over a broad range of speeds. Mounted to this platform are four wafer holders, each accommodating a **4-inch-diameter wafer** – referred to as **“planets.”** Each planet rotates at a fixed gear ratio relative to the sun, generating a full planetary motion of the wafers within the deposition plane. This motion is superimposed onto the standard linear translation of the pallet underneath the target. By integrating both rotational and translational movement, the planetary architecture: - **Averages out spatial variations** in deposition rate across the cathode - **Reduces edge-to-center thickness variation** significantly - **Improves step coverage** on 3D features by varying the incident deposition angle - **Enhances surface morphology** through programmable rotation speed control - **Maintains compatibility** with standard KDF linear translation systems Process Comparison ## Standard Deposition vs. ERPP Enhancement ### Standard Deposition Process On standard KDF sputtering tools, metallic films such as tungsten (W) and titanium tungsten (TiW) are deposited onto a **12″ × 12″ pallet deposition zone**, which scans across a **15″ × 5″ rectangular magnetron cathode**. Deposition is performed via DC magnetron sputtering – either reactively using oxygen or nitrogen with elemental targets, or non-reactively from compound targets. The cathode is engineered to optimize uniformity for metallic films, achieving an average thickness variation of approximately **±2%** across four 4″ wafers mounted on a planetary rotating pallet. ### ERPP Enhanced Process In advanced microelectronic applications, tungsten films are critical layers within frequency-selective components such as **Surface Acoustic Wave (SAW)** and **Bulk Acoustic Wave (BAW)** filters. For Solidly Mounted Resonator (SMR) configurations in BAW filters, multilayer silicon-based stacks require exceptional film uniformity and run-to-run thickness repeatability on the order of **±1%**. Since resonant frequency is inversely proportional to the thickness of constituent layers – including tungsten – precise thickness control is essential for accurate frequency tuning. KDF 900 series systems equipped with three- or four-target configurations, precisely controlled scan speeds, and multistep recipe capabilities are purpose-built for these demanding applications. ![Sheet resistance vs ERPP setpoint values showing microstructural improvements](https://www.kdf.com/wp-content/uploads/2025/07/Figure-3-a-decrease-in-sheet-resistance-with-increasing-set-point-values-suggests-potential-microstructural-improvements-such-as-enhanced-film-density-or-grain-structure-266x300.jpg) Fig. 3 – Sheet resistance reduction with increasing ERPP setpoint values ![Pallet uniformity improvement with ERPP setpoint values](https://www.kdf.com/wp-content/uploads/2025/07/Figure-4-pallet-uniformity-improved-with-increasing-set-point-values-indicating-enhanced-deposition-consistency-across-the-wafers-surface-255x300.jpg) Fig. 4 – Pallet uniformity improvement with increasing ERPP setpoint values Experimental Results ## Measured Performance Data Tungsten (W) and titanium tungsten (TiW) films were deposited non-reactively using elemental W and TiW targets. The results confirm the ERPP’s capability for high-precision thin film deposition across all key metrics: ### Sheet Resistance Figure 3 illustrates a reduction in sheet resistance with increasing setpoint values under constant linear scanning conditions. Wafer rotation during sputtering was found to **significantly enhance thin-film uniformity** – the rotational motion averages out spatial non-uniformities inherent in the sputtering process, improving thickness uniformity and stabilizing critical film properties such as sheet resistance. The decrease in sheet resistance with increasing setpoint values suggests potential microstructural improvements, including **enhanced film density and grain structure**. ### Uniformity Performance Figure 4 presents uniformity results for W and TiW films deposited with the ERPP-enabled KDF 900 system. The planetary scanning motion consistently achieved: - **Within-wafer uniformity better than ±1%** across all tested processes - **Pallet-wide uniformity better than ±2%** – a significant improvement over standard ±2% baseline - Consistent performance confirmed across multiple deposition runs ![Surface roughness improvement with ERPP setpoint values](https://www.kdf.com/wp-content/uploads/2025/07/Figure-5-surface-roughness-decreased-with-increasing-set-point-values-indicating-enhanced-surface-quality-while-maintaining-consistent-thickness-258x300.jpg) Fig. 5 – Surface roughness reduction with increasing ERPP setpoint values ### Surface Roughness Figure 5 demonstrates significant improvements in surface roughness. While wafer rotation contributes to enhanced thickness uniformity, its influence on surface roughness is multifaceted. Depending on process parameters – rotation speed, deposition pressure, and target power – surface roughness may either increase or decrease. Careful optimization of sputtering conditions is therefore essential to achieve the desired film characteristics for each specific application. ![ERPP uniformity chart TiW tungsten deposition results](https://www.kdf.com/wp-content/uploads/2025/07/Uniformity-chart-erpp-300x131.jpg) Table 1 – ERPP planetary scanning performance summary for TiW depositions using standard 15″ cathode Conclusions ## Discussion & Future Applications The ERPP represents a significant advancement in metallic film deposition technology. This technique has **reduced metallic film non-uniformities from typical values of ±2% to less than ±1%** across the pallet for non-reactive deposition processes – a measurable, repeatable improvement that directly supports next-generation device manufacturing requirements. The planetary deposition technique has demonstrated potential applications across a wide range of thin film materials. KDF is currently investigating its advantages for **optical films** and **features with high aspect ratios**. Additionally, the ERPP may be integrated with a **Plasma Emission Monitoring (PEM) system** and **DC Pulsing** for further process control capability. For production engineers working in semiconductor, photonics, BAW/SAW filter manufacturing, or advanced materials research, the ERPP-equipped KDF 900 series represents the current state of the art in batch inline sputtering uniformity. Related Systems [900i Series Sputtering System](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) [974i Series Sputtering System](/products/in-line-products-kdf-technologies/974i-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) [KDF Sputtering Technology](/products/in-line-products-kdf-technologies/kdf-sputtering-solutions/) [All Sputtering Systems](/products/in-line-products-kdf-technologies/) Applications [Integrated Passive Devices](/products/in-line-products-kdf-technologies/kdf-integrateddevices-components-thin-film-circuits/) [Photonics & Quantum](/products/in-line-products-kdf-technologies/kdf-laser-diodes-photonics-quantumtechnology/) [Medical Devices](/products/in-line-products-kdf-technologies/kdf-medical-device-in-line-sputter-coating-technology/) [Sensors & Monitoring](/products/in-line-products-kdf-technologies/kdf-sensors-and-monitoring/) Discuss This Technology Ready to evaluate ERPP for your process? Our engineers can walk you through the system configuration and expected performance for your specific application. [Request a Consultation →](/contact-us/) [View 900i Series →](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) More Articles [MRC Heritage & Evolution](/mrc-heritage-and-evolution-honoring-a-legacy-of-innovation-and-sustaining-a-standard-of-excellence/) [Reactive Sputtering with PEM](/advancements-in-reactive-sputtering-with-kdfs-sputter-sources-and-pem/) [All News & Insights](/news/) Take the Next Step ## Ready to Achieve *±1% Uniformity* in Your Process? KDF’s ERPP-equipped 900 series systems are available for evaluation. Contact our engineering team to discuss your thin film deposition requirements. [Request a Quote →](/contact-us/) [View 900i Series →](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) --- ### [744i Vertical Batch-Sputtering System](https://www.kdf.com/products/in-line-products-kdf-technologies/744-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** R&D to Production Series # *744i* Series Large Area Vertical Batch Sputtering System A large area, four-target RF/DC batch sputtering system designed for 200mm semiconductor wafers, OLED, and flat panel displays – with a compact footprint using less than one-third the floor space of competing equipment. [Request a Quote →](/contact-us/) [Download Datasheet →](https://www.kdf.com/wp-content/uploads/2022/09/744i-Series-HR-1.pdf) Pallet Size 19″ × 19″ Target Positions 4 200mm Wafer Capacity Up to 4 Glass Size Up to Gen 2 ![KDF 744i Series Sputtering System](https://www.kdf.com/wp-content/uploads/2026/03/744-1.jpg) [600i Series](/products/in-line-products-kdf-technologies/600-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [744i Series](/products/in-line-products-kdf-technologies/744-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [844i Series](/products/in-line-products-kdf-technologies/844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [900i Series](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [974i Series](/products/in-line-products-kdf-technologies/974i-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [Ci Cluster Tool](/products/in-line-products-kdf-technologies/ci-cluster-tool/) System Overview ## Large Area. Compact Footprint. The 744i is KDF’s large area R&D-to-production platform – a four-target batch sputtering system built for high-density interconnect, 200mm semiconductor wafers, OLED, and flat panel displays up to Gen 2 glass. It delivers throughput four times greater than the 600i Series for 200mm wafer metallurgy, in less than one-third the floor space of competing equipment. ![KDF 744i Series - Detail View](https://www.kdf.com/wp-content/uploads/2026/03/744-2-scaled.jpg) 744i Series – System Detail The 744i features two processing pallets for instantaneous wafer size changes and front/backside processing in a single tool. A high-vacuum loadlock with substrate pre-heat supports efficient degassing and high throughput. The pallet assist tool (PAT) enables safe handling of payloads up to 60 lbs. All 744i systems support scan velocity profiling and are compatible with the full range of KDF engineered cathodes. Remote PC accessibility via Ethernet is standard for software upgrades and diagnostics. Key Features ### Standard System Capabilities - Vertical side sputtering – compact footprint, <⅓ floor space of competing tools - 19″ × 19″ pallet size – two processing pallets standard - Four-target main chamber configuration - High-vacuum loadlock with quartz heater lamps for substrate degassing - Processes up to four 200mm wafers simultaneously - 4× throughput improvement over 600i Series for 200mm wafer metallurgy - Accommodates glass up to Gen 2 - Pallet assist tool (PAT) for payloads up to 60 lbs - Scan velocity profiling for enhanced deposition uniformity - Instantaneous wafer size change – front and backside processing - Optional robot for particulate-free cassette-to-cassette handling - Optional integrated RGA for process and fault monitoring - Optional rotating substrate pallet for optical market applications - Pulsed DC up to 20 kW via Advanced Energy Pinnacle Plus - Complies with Semiconductor S2-0706; CE option available ![KDF 744i - Chamber View](https://www.kdf.com/wp-content/uploads/2026/03/744-3-scaled.jpg) 744i Series – Chamber Interior ![KDF 744i - System View](https://www.kdf.com/wp-content/uploads/2026/03/744-1-1-scaled.jpg) 744i Series – Production Configuration Cathode Technology ## KDF Cathode Options The 744i accepts the full range of KDF-engineered cathodes – all designed in-house by KDF’s cathode engineering team. Each cathode is optimized for specific materials and process requirements. Inset Cathode™ 24.5″ Length · Metal & Precious Metals Measures 24.5 inches in length, accommodating most metal and all precious metal types. Provides higher cathode-to-pallet aspect ratio and improved uniformity across the full pallet area. Magterial Cathode™ Planar Type · Ferrous Metals A planar-type cathode ideal for magnetron sputtering of ferrous metals such as nickel and iron – delivering high deposition rates and high uniformity for demanding metallization applications. Mark II™ Dielectric & Reactive · ITO / SiO₂ Optimized for sputtering dielectric materials such as SiO₂ and reactive depositions including indium-tin oxide (ITO). Features improved magnet design for better uniformity and longer cathode life. LMM™ Cathode RF Capable · Full Face Erosion KDF’s patented Linear Moving Magnetron cathode – RF capable with full-face target erosion. Delivers bulletproof high-rate reactive processes with superior run-to-run repeatability and low particle generation. Custom Designs In-House Engineering KDF’s in-house engineering staff models and designs all cathodes to customer and field-proven specifications. Custom cathode configurations are available for unique process requirements. Gas Delivery Options Reactive Process Enhancement Optional gas delivery systems enable enhanced reactive sputtering processes across all cathode types – fully integrated with KDF’s downstream pressure control and MFC-based gas management architecture. Technical Specifications ## Vacuum & Facility Requirements Vacuum Performance Chamber Ultimate≤1 × 10⁻⁷ torr Chamber Leak Rate20 min to 1 × 10⁻⁴ torr HV Dome Ultimate≤1 × 10⁻⁷ torr HV Dome Leak Rate15 min to 1 × 10⁻⁴ torr Pump Down from Atm.≤110 min to 1 × 10⁻⁶ torr Overnight Pump Down2 × 10⁻⁷ torr Facility Requirements Power208 VAC, 3-phase, 225A Cooling Water8 GPM, 70 PSI min Water Temp Range10°C – 24°C Compressed Air85 – 100 PSIG Process Gas25 PSIG, 99.999% purity Pure GasDry N₂ Process Capability Pallet Size19″ × 19″ (482mm × 482mm) 200mm WafersUp to 4 Glass SizeUp to Gen 2 Target Positions4 DC Power Supply20 kW (Adv. Energy) RF Power Supply3 kW (optional) System Detail ## Hardware, Controls & Software ### System Hardware - 20 kW low stored energy DC power supplies (Advanced Energy) – optional Pinnacle Plus pulsed DC up to 20 kW - Integrated throttling SS VAT valve for upstream or downstream pressure control - MKS multi-component “Smart” 390 and 925 gauges for integrated vacuum measurement - Process gas control: up to 4 MFCs, feedback-controlled capacitance manometer, master/slave gas select, gas ratio control - Stepper motor pallet carrier drive with optical encoder – programmable scan velocity profiling - Low-pressure hydraulics for safety and smooth operation - Automated motor-driven load lock door - Loadlock linear sensor – computer-controlled positioning for accuracy and fail-safe - Optional 3 kW RF solid-state power supply (Advanced Energy) - Complies with NFPA 79; CE option available ### Computer & Control System - Windows 10 real-time GUI with 24″ LCD touchscreen on umbilical mobile HI cart - Context-sensitive recipe manager running from Microsoft SQL database - Real-time data display and logging – compatible with Excel, Lotus, and Windows applications - Report generation, remote interface, and printing capability - Optional SECS/GEM connectivity via OPC server interface - Distributed Rockwell Control System – DeviceNet and EtherNet/IP fieldbus - Full maintenance test suite with diagnostic and manual process control - Service-friendly fully enclosed electronic cabinet - Remote PC accessibility via Ethernet for software upgrades and file repair Applications ## Target Markets Compound Semiconductors Flat Panel Displays OLED Technology Optical Communications Medical Devices High-Density Interconnect Emerging Materials R&D & Process Development Next Steps ## Configure Your 744i System Our process engineers can help you select the right cathode configuration and options for your 744i. Download the full datasheet or contact us to start the conversation. [Let’s Talk Process →](/contact-us/) [Download 744i Datasheet →](https://www.kdf.com/wp-content/uploads/2022/09/744i-Series-HR-1.pdf) [📞 (201) 784-5005](tel:+12017845005) [✉ ](mailto:sales@kdf.com) --- ### [Sputtering targets](https://www.kdf.com/products/process-materials/sputtering-targets/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Original OEM Parts · KDF Technologies # High Purity *Sputtering* Targets KDF offers a large selection of high purity metals, alloys, non-metallic materials, and cermets for virtually every sputtering and evaporation application in the industry – including our proprietary Upsilon Inset™ targets designed for up to 60% utilization of precious metals. [Request Targets & Pricing →](/contact-us/) [All OEM Parts](/products/original-oem-parts/) At a Glance 60% Upsilon™ Target Utilization 7+ Target Geometries Available OEM Shipped with Full QC Documentation KDF Proprietary Technology ## Upsilon Inset™ Targets – *Up to 60% Utilization* KDF’s proprietary **Upsilon Inset™ cathode** uses a novel Υ-shaped (upsilon) target geometry that is specifically engineered for high thermal conductivity, high-value materials – delivering up to **60% target utilization** compared to the 20-30% typical of standard planar targets. For precious metals like Gold (Au), Platinum (Pt), Palladium (Pd), and Silver (Ag) – where material cost is a significant production expense – the Upsilon Inset™ target can reduce material cost per wafer by more than half compared to conventional designs. Upsilon Inset™ targets are **sole KDF intellectual property** – a patented geometry available only from KDF Technologies. They cannot be replicated by aftermarket target suppliers. 60% Target Utilization 2× vs. Standard Planar Utilization - –**Au, Pt, Pd, Ag** – precious metal targets optimized for the Upsilon Inset™ cathode - -Engineered for **high thermal conductivity** – essential for precious metal sputtering stability - -Dramatically **reduces cost per wafer** for medical, photonic, and semiconductor applications - -Available exclusively from KDF – **patented IP**, not available from any other supplier [Request Upsilon Inset™ Target Pricing →](/contact-us/) ![KDF Upsilon Inset™ sputtering target geometry](https://www.kdf.com/wp-content/uploads/2024/01/upsilon-cathode-target.jpg) Υ Upsilon Shape Upsilon Inset™ Target – KDF Proprietary Geometry Precious Metals Au Pt Pd Ag Ir Rh Ru Metals & Alloys Ti TiW Cr Ta W Mo Al Cu Ni NiCr Zr Compounds & Cermets TaN TiN SiO₂ Al₂O₃ ITO ZnO TiO₂ MoSi₂ Product Overview ## Targets for Every Sputtering Application KDF’s facility is configured to manufacture production quantities across a broad range of materials, while remaining capable of small research quantities at competitive prices. This manufacturing flexibility demonstrates KDF’s commitment to meeting the full spectrum of customer needs – from high-volume OEM production to R&D process development. Each target is chemically cleaned, individually marked, and carefully packaged under vacuum or inert gas as required by the specific material. Handle only with rubber gloves to preserve target purity. Available Geometries ## Target Geometries #### Planar Standard flat geometry for most DC and RF sputtering configurations #### Circular Round targets for circular magnetron cathode configurations #### Rectangular Elongated targets for inline batch sputtering systems including all KDF platforms #### Upsilon™ KDF’s patented Υ-shape for Inset™ cathodes – up to 60% utilization of precious metals #### Conical For specific cathode geometries requiring angled deposition surfaces #### Custom Ring, delta, and fully custom geometries available for non-standard cathode designs Manufacturing ## Material Processing Techniques KDF incorporates advanced material processing techniques that ensure every target meets the highest standards of purity, density, and dimensional accuracy. ### Vacuum Induction Melting High-purity melting in vacuum to eliminate contamination from atmospheric gases and achieve precise alloy compositions. ### Vacuum / Inert Hot Pressing Consolidation of powder materials under heat and pressure in controlled atmosphere for high-density compound targets. ### Hot / Cold Isostatic Pressing Uniform pressure application from all directions for maximum density and microstructural homogeneity in complex targets. ### Electron Beam Melting Ultra-high purity processing for refractory metals and reactive materials where conventional melting is not viable. ### Computer Controlled Machining CNC machining to tight dimensional tolerances for all target geometries – ensuring precise fit in KDF and MRC cathode assemblies. Quality Assurance ## Every Target Ships with Full Documentation Every KDF sputtering target ships with complete quality documentation – giving you full traceability and confidence in material purity and manufacturing consistency from order to deposition. ### Included with Every Target - –**Certificate of Conformance** - –**Material Purity Certificate** - –**MSDS** (Material Safety Data Sheet) when required - -Packaged under **vacuum or inert gas** as required by the material Production Capability ## Production & Research Quantities KDF’s manufacturing facility is configured for both high-volume production and small research quantities – at competitive pricing for both. Whether you’re qualifying a new process or running a mature production line, KDF can supply targets at the quantity and lead time your operation requires. Targets are dimensioned and qualified for all KDF and MRC cathode configurations. When ordering, provide your cathode model and system series for dimensional confirmation. Also available from KDF’s Process Materials division – sputtering targets for non-KDF system configurations and research applications worldwide. [View Process Materials Targets →](/products/process-materials/sputtering-targets/) Get in Touch ## Need Sputtering Targets for Your KDF or MRC System? Contact our team with your cathode model, material, and quantity. We’ll confirm geometry, availability, and pricing – including Upsilon Inset™ targets for precious metal applications. [Request Targets & Pricing →](/contact-us/) [All OEM Parts](/products/original-oem-parts/) --- ### [Sputtering Targets](https://www.kdf.com/products/original-oem-parts/sputtering-targets/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** ## Sputtering Targets ### PRODUCT ## KDF offers a large selection of high purity metals, alloys, non-metallic and cermets for virtually every sputtering and evaporation application in the industry. KDF’s facility is configured to manufacture production quantities of these materials, but it is also capable of small quantities for research applications at competitive prices. This manufacturing flexibility demonstrates KDF’s commitment to actively anticipating and meeting the needs of its customers. High purity sputtering targets are available in a variety of geometries, including planar, circular, conical, rectangular, ring, delta and custom configurations. #### KDF incorporates material processing techniques that include: - Vacuum induction melting - Vacuum/ inert hot pressing - Hot/cold isostatic pressing - Electron beam melting - Computer controlled machining #### All KDF manufactured targets are shipped with: - Certificate of Conformance - Material Purity Certificate - MSDS (Material Safety Data Sheet) when Required Each target is chemically cleaned, marked and carefully packaged under vacuum or inert gas as required by the individual target. To preserve the purity of these target, handle only with rubber gloves. ## Have questions?[ Contact KDF](/contact-us/ ) about KDF Sputtering Targets --- ### [KDF Sensors and Monitoring - In Line Sputter Coating Technology](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-sensors-and-monitoring/) **Published:** February 7, 2024 **Author:** KDF Technologies **Content:** Applications · KDF Technologies # Sensors & *Monitoring* Thin Film Technology A sensor is a device that produces an output signal for the purpose of sensing a physical phenomenon. Many of today’s most advanced sensors – from reed switches and waveguide sensors to high-temperature strain gauges – are fabricated with sputtered thin films deposited by KDF Technologies systems. Sensors Thin Film Deposition Magnetron Sputtering Overview ## Thin Film Deposition for Sensor Manufacturing KDF Technologies’ thin film deposition technology plays a crucial role in the production of various sensors and monitoring devices. A sensor is a device, module, machine, or subsystem that detects events or changes in its environment and sends the information to other electronics – and many of today’s sensors rely on sputtered thin films for their core functionality. KDF’s sputtering systems are in use at leading sensor manufacturers depositing films including **Au, TiW, Ir, Ag, Zr, Ta, TaN, Ti, and TiN**. With established technologies such as HIPIMS and Pulsed DC reactive sputtering, KDF is ideally positioned to personalize a system for your unique sensor application. KDF Technologies has been a significant player in supplying thin film sputtering systems to the sensor market – from reed switches and optical waveguide sensors to high-temperature strain gauges and polymer thin film chemical sensors. KDF’s team of dedicated applications, design, and vacuum experts backs every system configuration. ![KDF inline sputtering system for sensor manufacturing](https://www.kdf.com/wp-content/uploads/2024/01/O9A0117-683x1024.jpg) Depositable Materials Au TiW Ir Ag Zr Ta TaN Ti TiN PdCr NiCr Pt Sensor Types ## Thin Film Sensor Technologies & Applications KDF’s sputtering systems support a broad range of sensor fabrication applications – each requiring precise control over film composition, uniformity, and process repeatability. ### Switches Reed Switch The reed switch is an electromechanical switch commonly used in proximity sensors. It operates based on an applied magnetic field – two ferromagnetic blades separated by only a few microns pull together when a magnet approaches, closing the normally open (NO) contacts and allowing electricity to flow. KDF Technologies has been a significant player in supplying thin film sputtering systems to the Reed Switch market for decades. ### Integrated Waveguide Sensors Sol-Gel Thin Films These sensors combine optical and chemical sensing, offering advantages including portability, reduced costs, and in-situ measurements. Sol-gel chemistry and top-down processing of sol-gel thin film layers are used to design waveguide-based optical sensors. Porous sol-gel materials enhance sensitivity and selectivity as claddings and as waveguides with improved light-analyte interaction. ### Refractive Index & Spectroscopic Sensors On-chip optical chemical sensors rely on evanescent field-analyte interaction. In waveguide-based devices, guided light interacts with the surrounding environment through the evanescent field – resulting in phase or intensity changes used for refractive index measurements and spectroscopic analysis including IR absorption and Raman spectroscopy. ### Polymer Thin Film Sensors Polyaniline (PANI) Polyaniline thin films are used in chemical sensors due to their high surface area and fast response time. PANI thin films can be precisely applied onto substrates, making them well suited for sensing stages in chemical sensor applications where rapid analyte detection is critical. ### High-Temperature Strain Sensors PdCr Thin Film Gauges Thin film gauges based on materials like PdCr operate at elevated temperatures up to 1100°C. These sensors outperform commercially available technologies – surviving fatigue tests and cyclic strain up to 700 Hz at high temperatures, making them essential for aerospace, turbine, and industrial monitoring applications. ### Biosensors & Implantable Sensors Implantable sensors that monitor various physiological parameters require both biocompatible thin film coatings and hermetic sealing to ensure accurate readings and device longevity over their full operational life inside the body. ![KDF 954 sputtering system](https://www.kdf.com/wp-content/uploads/2024/02/954-Cutout-1024x683.png) ![KDF thin film process](https://www.kdf.com/wp-content/uploads/2024/02/image-5.png) ![KDF inline sputtering system](https://www.kdf.com/wp-content/uploads/2024/02/O9A0111-1024x683.jpg) Key Capabilities ## System Features for Sensor & Monitoring Applications KDF’s inline sputtering platforms are configured with a comprehensive set of process options for the precision and throughput demands of sensor thin film manufacturing. ### 3-Dimensional & Large Parts Parts up to 4″ in thickness can be loaded into tall horizontal 900 series systems. Pallets hold total loaded weights of up to 150 lbs (system specific) – accommodating complex sensor housing geometries and large-format substrates. ### Pallet Stacker – 900 Series Increases load lock cassette capacity to 5 pallets, enabling extended unsupervised operation. Each pallet can run the same recipe or its own unique deposition recipe – ideal for high-volume sensor manufacturing. ### Upsilon Inset™ Cathode – Precious Metal Sputtering Specifically designed for high thermal conductivity, high-value materials including Au, Pt, Pd, and Ag. Novel Upsilon-shape targets enable up to 60% target utilization – critical for sensor contact and electrode depositions. ### HIPIMS High Power Impulse Magnetron Sputtering produces highly dense, smooth films with enhanced conformality – essential for high aspect ratio sensor features and achieving the film densities required for high-temperature strain gauge performance. ### Water Pump & Process Stability High-performance water pumps substantially improve throughput and process stability – particularly important for reactive deposition processes used in oxide and nitride sensor films. ### Water Cooling Chamber, internal shielding, and cathodes can all be water cooled – critical for temperature-sensitive sensor substrates including polymer films, MEMS devices, and precision optical sensor components. ### Auto Rate Adjust (ARA) Automatically adjusts scan speed or deposition power to compensate for target wear – maintaining a stable, repeatable process throughout the target’s full life, ensuring consistent sensor film properties batch to batch. ### Scan Velocity Control Create custom pallet velocity profiles through the deposition zone – enabling precise film thickness control across complex sensor pallet configurations and mixed substrate types. ### IR Pallet Temperature Measurement Integrated pyrometer for instant pallet and part temperature feedback. Temperature readings can be integrated into recipes for controlled heating and cooling steps – essential for thermally sensitive sensor substrates. Featured Systems ## 943ix & 954ix – x Series™ The 943ix and 954ix are KDF’s flagship x Series™ systems for sensor and monitoring applications. Their 17-inch cathode design delivers improved uniformity across the full pallet – a critical requirement for sensor films where thickness variation directly impacts device sensitivity, calibration accuracy, and batch-to-batch reproducibility. x Series™ cathodes are available in Planar™, Inset™, and RF/DC LMM™ form – covering the full range of metallic and reactive depositions required for sensor contacts, resistive films, optical coatings, and high-temperature sensing layers. - 17″ cathode for superior pallet-wide film uniformity - Planar™, Inset™, and LMM™ cathode configurations - Compatible with HIPIMS, Pallet Stacker, ARA, Water Cooling, and IR temperature measurement - Proven at leading sensor and monitoring device manufacturers - Full MRC batch system lineage and worldwide parts support [View 900i Series →](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) [Request a Consultation](/contact-us/) ![KDF 943ix sputtering system for sensor manufacturing](https://www.kdf.com/wp-content/uploads/2024/02/O9A0111-1024x683.jpg) Get in Touch ## Ready to Discuss Your Sensor Thin Film Application? KDF’s applications, design, and vacuum engineering teams are ready to configure the right sputtering solution for your sensor manufacturing process – from reed switches and waveguide sensors to high-temperature strain gauges. [Contact KDF Technologies →](/contact-us/) [View All Systems](/products/in-line-products-kdf-technologies/) --- ### [KDF Medical Device - In Line Sputter Coating Technology](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-medical-device-in-line-sputter-coating-technology/) **Published:** January 20, 2024 **Author:** KDF Technologies **Content:** Applications · KDF Technologies # Medical Device *In-Line Sputter* Coating Technology Corrosion, wear, and body rejection are common problems for many medical devices. KDF Technologies’ thin film deposition systems are in use at leading medical device companies worldwide – delivering the biocompatibility, durability, and precision that patient safety demands. Medical Devices Biocompatible Coatings DLC & PVD Overview ## Thin Film Deposition for Medical Device Manufacturing KDF Technologies’ thin film deposition technology plays a crucial role in the production of various medical devices and products. From implants and surgical instruments to drug delivery systems and optical devices, KDF’s inline sputtering systems deliver the coating quality, repeatability, and process control that the medical industry requires. Magnetron sputtering is well suited to providing these films. Sputtering systems from KDF Technologies are in use at leading medical device companies depositing films such as **Au, TiW, Ir, Ag, Zr, Ta, TaN, Ti, and TiN**. With established technologies such as HIPIMS and Pulsed DC reactive sputtering, KDF is in an ideal position to personalize a tool for your unique medical device application. KDF’s team of dedicated applications, design, and vacuum experts backs every system – ensuring that each medical device manufacturer benefits from the most advanced and suitable thin film deposition process for their specific requirements. ![KDF medical device inline sputter coating system](https://www.kdf.com/wp-content/uploads/2024/01/O9A0113-683x1024.jpg) Depositable Materials Au TiW Ir Ag Zr Ta TaN Ti TiN Pt Pd DLC Application Areas ## Where KDF Thin Film Technology Is Applied KDF’s sputtering systems support a broad range of medical device coating applications – each demanding precise control over film composition, thickness, and uniformity. ### Implants Diamond-Like Carbon (DLC) Coatings Protective coatings that enhance biocompatibility, wear resistance, and osseointegration – the fusion of the implant with surrounding bone and tissue. Biocompatible Hard Coatings Protect both the implant and surrounding human tissue from corrosion, wear, and immune response over extended implant lifetimes. ### Surgical Instruments Thin film coatings applied to surgical tools improve durability, scratch resistance, and surface comfort. Reduced friction and improved surface properties enhance usability and precision during medical procedures. ### Drug Delivery Systems Thin film coatings modify surface properties of drug delivery devices – ensuring biocompatibility and minimizing friction to maximize patient comfort and safety throughout the device’s operational life. ### Optical Devices Optical Filters Thin film coatings selectively transmit or block specific wavelengths of light for medical imaging and diagnostic applications. Precision Optics Enhanced performance of optical components in medical devices including microscopes, endoscopes, and OCT imaging systems. ### Microscopy & Microanalysis Sample Slides Thin film coatings improve the surface properties of slides used in microscopy and microanalysis, enabling precise observation and analysis of biological and tissue samples. ### Medical Implants – Joint & Dental Thin film deposition ensures implants are biocompatible, wear-resistant, and integrate well with the body – contributing to the long-term success of joint replacements, dental implants, and spinal devices. ![KDF 954 sputtering system](https://www.kdf.com/wp-content/uploads/2024/02/954-Cutout-1024x683.png) ![KDF thin film process detail](https://www.kdf.com/wp-content/uploads/2024/02/image-5.png) ![KDF medical device coating process](https://www.kdf.com/wp-content/uploads/2024/02/20231117_152310517_iOS-1-1024x768.jpg) Key Capabilities ## System Features for Medical Device Applications KDF’s inline sputtering platforms are configured with a full suite of process options designed for the demanding requirements of medical device thin film manufacturing. ### Upsilon Inset™ Cathode – Precious Metal Sputtering Specifically designed for high thermal conductivity, high-value materials including Au, Pt, Pd, and Ag. Novel Upsilon-shape targets enable up to 60% target utilization – maximizing ROI on precious metal depositions. ### 3-Dimensional & Large Parts Parts up to 4″ in thickness can be loaded into tall horizontal 900 series systems. Pallets hold total loaded weights of up to 150 lbs (system specific) – ideal for complex orthopedic implant geometries. ### HIPIMS High Power Impulse Magnetron Sputtering produces highly dense, smooth, and hard films with enhanced conformality – essential for DLC coatings and high aspect ratio features on surgical and implant surfaces. ### Water Pump & Process Stability High-performance water pumps increase water vapor pumping speeds to substantially improve system throughput and process stability across all medical device deposition processes. ### Water Cooling Chamber, internal shielding, and cathodes can all be water cooled – critical for temperature-sensitive medical device substrates and precious metal deposition processes where heat management is essential. ### Auto Rate Adjust (ARA) Automatically adjusts scan speed or deposition power to compensate for target wear – maintaining a stable, validated process throughout the target’s full life, as required in regulated medical device manufacturing. ### Scan Velocity Control Create custom pallet velocity profiles through the deposition zone, enabling precise control of film thickness and uniformity across complex medical device pallet configurations. ### IR Pallet Temperature Measurement Integrated pyrometer for instant pallet and part temperature feedback. Temperature readings can be integrated into recipes for controlled thermal steps – critical for substrates sensitive to process heat. ### Pulsed DC Reactive Sputtering Enables stable reactive deposition of oxide and nitride films including TiN and TaN – essential for biocompatible barrier layers, dielectric coatings, and corrosion-resistant surfaces on medical implants. Featured Systems ## 943ix & 954ix – x Series™ The 943ix and 954ix are KDF’s flagship x Series™ systems for medical device applications. Their 17-inch cathode design provides improved uniformity across the full pallet – a critical requirement for validated medical device manufacturing processes where batch-to-batch consistency is non-negotiable. x Series™ cathodes are available in Planar™, Inset™, and RF/DC LMM™ form – giving process engineers the flexibility to configure the exact deposition architecture required, from precious metal contacts to DLC protective coatings. - 17″ cathode for superior pallet-wide uniformity - Planar™, Inset™, and LMM™ cathode configurations - Compatible with HIPIMS, Upsilon Inset™, ARA, IR temp measurement, and water cooling - Proven at leading implantable and surgical device manufacturers - Full MRC batch system lineage and worldwide parts support [View 900i Series →](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) [Request a Consultation](/contact-us/) ![KDF 943ix sputtering system for medical devices](https://www.kdf.com/wp-content/uploads/2024/01/O9A0114-1024x683.jpg) Get in Touch ## Ready to Discuss Your Medical Device Coating Application? KDF’s applications, design, and vacuum engineering teams are ready to help configure the right sputtering solution for your medical device manufacturing process. [Contact KDF Technologies →](/contact-us/) [View All Systems](/products/in-line-products-kdf-technologies/) --- ### [KDF Laser Diodes, Photonics and Quantum Technology](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-laser-diodes-photonics-quantumtechnology/) **Published:** February 20, 2024 **Author:** KDF Technologies **Content:** Applications · KDF Technologies # Laser Diodes, *Photonics* & Quantum Technology Laser diodes, photonics, and quantum technology represent pivotal elements in modern technological advancement – influencing telecommunications, material processing, medical imaging, LIDAR, and quantum computing. KDF’s sputtering systems are critical to their fabrication. Photonics Laser Diodes Quantum Technology Overview ## Thin Film Deposition for Photonic & Quantum Devices Laser diodes operate as semiconductor devices that generate coherent light through lasing conditions at the diode’s junction. Structurally akin to PiN diodes, they predominantly utilize **direct bandgap III-V materials** such as Gallium Arsenide (GaAs) and Indium Phosphide (InP), known for their efficient light-emitting properties. The fabrication of these sophisticated devices includes critical steps involving the deposition of thin films. Materials such as **Ge, Pd, Ti, Au, and Pt** are essential for the construction and functionality of laser diodes. KDF Technologies plays a significant role in this process – the precision and versatility of KDF’s sputtering systems allow for the fine-tuning of optical and electrical properties, ensuring optimal performance across a wide range of applications. KDF Technologies’ collaboration with the fields of laser diodes, photonics, and quantum technology underscores the importance of advanced manufacturing techniques in the development of devices integral to the forefront of technological innovation. KDF’s team of applications, design, and vacuum experts ensures every tool is configured for your exact process. ![KDF photonics laser diode thin film deposition](https://www.kdf.com/wp-content/uploads/2024/03/NewIMG_9313-647x1024.jpg) Key Materials Ge Pd Ti Au Pt TiW Ir Ag Zr Ta TaN TiN Covered Applications ## Devices & Systems Powered by Photonic Thin Films These devices embody the integration of laser diodes, photonics, and quantum technology – each benefiting from advanced thin film deposition processes provided by KDF. ### Optical Fiber Communication Laser diodes serve as light sources for transmitting data over optical fibers, enabling high-speed internet and telecommunications infrastructure worldwide. ### Medical Imaging Equipment Laser diodes are used in imaging techniques including optical coherence tomography (OCT), providing detailed tissue images for diagnostic purposes. ### Surgical Lasers Precision cutting and cauterization in minimally invasive surgeries, enhancing patient recovery times and reducing procedural risks. ### LIDAR Systems Light Detection and Ranging employs laser diodes to measure distances, speeds, and chemical compositions – crucial for autonomous vehicles and atmospheric research. ### Optical Storage Devices In CDs, DVDs, and Blu-ray, laser diodes read and write data, allowing for the storage and retrieval of large amounts of information in compact formats. ### Quantum Computing Components Laser diodes play a role in manipulating quantum bits (qubits) and facilitating quantum communication – at the cutting edge of next-generation computing. ![KDF photonics thin film process](https://www.kdf.com/wp-content/uploads/2024/03/2New20231219_193340410_iOS-1024x324.jpg) ![KDF sputtering process detail](https://www.kdf.com/wp-content/uploads/2024/02/image-5.png) Kurt J. Lesker Company ## Additional Related Tools For photonics applications requiring versatile sputtering, electron beam, and thermal evaporation on smaller substrate formats, the Kurt J. Lesker Company’s PRO Line systems complement KDF’s inline batch platforms. ![PRO Line PVD 75](https://www.lesker.com/newweb/images/image-viewer-galleries/pvd-75/Photo-SY-K-ProLinePVD75-ClosedFrameStandard-001_std.jpg)### PRO Line PVD 75 Versatile sputtering, electron beam, and thermal evaporation deposition platform – ideal for R&D and small-batch photonic device fabrication. [Learn More →](https://www.lesker.com/process-equipment-division/thin-film-systems/pro-line-pvd-75-deposition-platform.cfm) ![PRO Line PVD 200](https://www.lesker.com/newweb/images/image-viewer-galleries/pvd-200/Photo-SY-K-PVD200-003_std.jpg)### PRO Line PVD 200 Versatile sputtering, electron beam, and thermal evaporation deposition platform – scaled for production photonics and quantum device manufacturing. [Learn More →](https://www.lesker.com/process-equipment-division/thin-film-systems/pro-line-pvd-200-deposition-platform.cfm) Key Capabilities ## System Features for Photonics & Quantum Device Manufacturing KDF’s inline sputtering platforms offer a comprehensive set of process options engineered for the precision and repeatability demanded by photonic and quantum device fabrication. ### Pallet Stacker – 900 Series Increases load lock cassette capacity to 5 pallets, enabling extended unsupervised operation. Each pallet can run the same recipe or its own unique deposition recipe. ### Upsilon Inset™ Cathode – Precious Metal Sputtering Designed for high-value materials including Au, Pt, Pd, and Ag. Novel Upsilon-shape targets enable up to 60% target utilization – critical for cost-sensitive precious metal depositions in photonic contacts. ### Ellipsometer & Optical Measurement Integration In-situ optical monitoring for real-time film thickness, refractive index (n), and extinction coefficient (k) – essential for optical coating process control in photonic device manufacturing. ### Enhanced Rotating Planetary Pallet (ERPP) KDF’s proprietary ERPP™ achieves sub ±1% film uniformity with tight run-to-run repeatability – critical for multilayer optical coatings and laser mirror stacks. ### HIPIMS High Power Impulse Magnetron Sputtering produces highly dense, smooth films with enhanced conformality – enabling superior step coverage on laser diode facet and waveguide structures. ### Auto Rate Adjust (ARA) Automatically compensates for target wear by adjusting scan speed or power, maintaining a stable, repeatable deposition rate throughout the full target life. ### Scan Velocity Control Create custom pallet velocity profiles through the deposition zone, enabling precise layer thickness control for demanding multilayer photonic stacks. ### IR Pallet Temperature Measurement Integrated pyrometer for instant pallet and part temperature feedback. Temperature readings can be integrated into recipes for controlled thermal steps between depositions. ### Water Pump & Process Stability High-performance water pumps substantially improve throughput and process stability – particularly important for the reactive deposition of oxide and nitride optical films. Featured Systems ## 943ix & 954ix – x Series™ The 943ix and 954ix are KDF’s flagship x Series™ systems for photonics applications. Their 17-inch cathode design delivers improved uniformity across the full pallet – a decisive advantage when depositing optical thin films where thickness variation directly impacts wavelength performance. x Series™ cathodes are available in Planar™, Inset™, and RF/DC LMM™ form – covering the full spectrum of metallic and reactive oxide depositions required for laser diode contacts, AR coatings, waveguide layers, and quantum device structures. - 17″ cathode for superior pallet-wide uniformity - Planar™, Inset™, and LMM™ cathode configurations - Compatible with ERPP, HIPIMS, Ellipsometer, Pallet Stacker, and ARA options - Proven at leading photonics and quantum technology manufacturers - Full MRC batch system lineage and parts compatibility [View 900i Series →](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) [Request a Consultation](/contact-us/) ![KDF 943ix sputtering system for photonics](https://www.kdf.com/wp-content/uploads/2024/02/O9A0111-1024x683.jpg) Get in Touch ## Ready to Discuss Your Photonics or Quantum Application? KDF’s applications, design, and vacuum engineering teams are ready to configure the right sputtering solution for your laser diode, photonic, or quantum device manufacturing process. [Contact KDF Technologies →](/contact-us/) [View All Systems](/products/in-line-products-kdf-technologies/) --- ### [KDF Integrated Passive Devices, Components and Thin Film Circuits](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-integrateddevices-components-thin-film-circuits/) **Published:** February 20, 2024 **Author:** KDF Technologies **Content:** Applications · KDF Technologies # Integrated Passive Devices & *Thin Film Circuits* IPDs, components, and thin film circuits – resistors, capacitors, inductors, antennas, and resonators – represent a significant and expanding segment of the electronics market. KDF’s sputtering systems deliver the precision and repeatability these applications demand. Thin Film Circuits RF & Wireless Magnetron Sputtering Overview ## Thin Film Technology for Miniaturized Electronics Integrated Passive Devices and components, including thin film circuits like resistors, capacitors, inductors, antennas, and resonators, are fabricated using integrated circuit processing techniques similar to those employed in semiconductor manufacturing – though not exclusively on silicon substrates. The growing importance of these devices is largely attributed to the ongoing trend towards **miniaturization in wireless technology**. The principal advantage of using thin film technology for the construction of these devices lies in its ability to achieve **extremely close component matching, high area density, and consistent, repeatable performance**. This is particularly beneficial in applications where space is at a premium and reliability is critical. To manufacture these thin film devices and components, companies turn to KDF Technologies’ sputtering systems – capable of depositing a wide variety of materials including **Au, Cr, Ti, Cu, Ta, TaN, and NiCr** – essential for the production of high-quality IPDs and thin film circuits across a range of wireless applications. ±1% Film Uniformity with ERPP 60% Target Utilization – Upsilon Inset™ 5× Pallet Stacker Capacity (900 Series) ![KDF inline sputtering system for IPD and thin film circuits](https://www.kdf.com/wp-content/uploads/2024/01/O9A0117-683x1024.jpg) Depositable Materials Au TiW Cr Ti Cu Ta TaN NiCr Ir Ag Zr TiN Pt Pd Covered Components ## Thin Film Devices & Circuit Elements These devices are integral to the advancement and miniaturization of modern electronic and wireless devices, offering high performance in small, efficient packages. ### Thin Film Resistors High precision and stability, commonly used in RF applications for excellent performance over a wide range of frequencies. ### Thin Film Capacitors Known for compact size and reliability, used in applications requiring high precision and stability with minimal parasitics. ### Thin Film Inductors Utilized in high-frequency circuits for quality performance, occupying less space while providing necessary inductance values. ### RF Filters Integrated passive devices that select or block specific frequency ranges, critical in wireless communication systems for signal clarity. ### Baluns Convert between balanced and unbalanced signals – essential in RF and antenna applications for impedance matching and signal integrity. ### Antennas Thin film technology enables production of miniaturized antennas for wireless devices, supporting the trend towards smaller, more efficient communication hardware. ### Resonators Used to generate or select specific frequencies, essential in clocks and oscillators for BAW, SAW, and FBAR filter applications. ### Integrated Passive Networks Complex networks of resistors, capacitors, and inductors integrated into a single package, performing multiple functions in a compact space. ![KDF 954 sputtering system](https://www.kdf.com/wp-content/uploads/2024/02/954-Cutout-1024x683.png) ![KDF thin film process detail](https://www.kdf.com/wp-content/uploads/2024/02/image-5-300x200.png) ![KDF inline sputtering system](https://www.kdf.com/wp-content/uploads/2024/02/O9A0111-1024x683.jpg) Key Capabilities ## System Features for IPD & Thin Film Circuit Manufacturing KDF’s inline sputtering platforms include a full range of process and hardware options engineered for the precision, repeatability, and throughput demands of IPD and thin film circuit production. ### Pallet Stacker – 900 Series Increases load lock cassette capacity to 5 pallets, extending run time between load/unload cycles. Each pallet can run the same recipe or its own unique deposition recipe – ideal for unsupervised operation. ### Upsilon Inset™ Cathode – Precious Metal Sputtering Specifically designed for high thermal conductivity, high-value materials including Au, Pt, Pd, and Ag. Novel Upsilon-shape targets enable up to 60% target utilization. ### Enhanced Rotating Planetary Pallet (ERPP) KDF’s proprietary ERPP™ achieves exceptionally high uniformity in the sub ±1% range with tight run-to-run repeatability. Available on 900 series systems. ### HIPIMS High Power Impulse Magnetron Sputtering produces highly dense, smooth, and hard films with enhanced conformality for high aspect ratio features in thin film circuit patterning. ### Ellipsometer & Optical Measurement Integration In-situ optical monitoring for real-time checking of film thickness, refractive index (n), and extinction coefficient (k) – critical for optical and RF passive device fabrication. ### Auto Rate Adjust (ARA) Automatically adjusts scan speed or deposition power to compensate for target wear, maintaining a stable and repeatable process throughout the target’s full life. ### Scan Velocity Control Create custom velocity profiles for the pallet as it passes through the deposition zone, enabling precise control of film thickness and uniformity across complex pallet layouts. ### IR Pallet Temperature Measurement Integrated pyrometer provides instant feedback on pallet and part temperature, with readings integrated into recipes for controlled heating and cooling steps between depositions. ### Water Pump & Process Stability High-performance water pumps increase water vapor pumping speeds to substantially improve system throughput and process stability – critical for reactive deposition of TaN and TiN. Featured Systems ## 943ix & 954ix – x Series™ The 943ix and 954ix are two of KDF’s flagship x Series™ products. They feature the latest KDF cathode designs, lengthened to 17 inches, offering improved uniformity over the entire pallet – a critical advantage for IPD and thin film circuit manufacturing where component matching tolerances are tight. x Series™ cathodes are available in Planar™, Inset™, and RF/DC LMM™ cathode form, covering the full range of metallic and reactive deposition processes required for passive device fabrication. - 17″ cathode for improved pallet-wide uniformity - Planar™, Inset™, and LMM™ cathode configurations - Compatible with ERPP, HIPIMS, Pallet Stacker, ARA, and ellipsometer options - Proven at leading IPD and RF component manufacturers - Full MRC batch system lineage and parts compatibility [View 900i Series →](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) [Request a Consultation](/contact-us/) ![KDF 943ix sputtering system for IPD manufacturing](https://www.kdf.com/wp-content/uploads/2024/02/O9A0111-1024x683.jpg) Get in Touch ## Ready to Discuss Your IPD or Thin Film Circuit Application? KDF’s applications, design, and vacuum engineering teams are ready to help configure the right sputtering solution for your component manufacturing process. [Contact KDF Technologies →](/contact-us/) [View All Systems](/products/in-line-products-kdf-technologies/) --- ### [Ci Cluster Tool](https://www.kdf.com/products/in-line-products-kdf-technologies/ci-cluster-tool/) **Published:** November 10, 2022 **Author:** Vishal Agrawal **Content:** Cluster Intelligence Platform # *Ci* Cluster Tool Modular Multi-Chamber PVD Cluster System After years of development and testing, KDF’s Ci platform brings cluster intelligence to compound semiconductor, MEMS, MOEMS, sensors, and advanced packaging production – in a cost-effective, configurable package built on 35+ years of KDF manufacturing expertise. [Request a Quote →](/contact-us/) [Download Datasheet →](https://www.kdf.com/wp-content/uploads/2022/11/Ci-Cluster-Tool.pdf) Configurations 4-Sided · 8-Sided Max Substrate Up to 200mm Handler Brooks Marathon Series Wafer Sizes 4″ to 8″ ![KDF Ci Cluster Tool](https://www.kdf.com/wp-content/uploads/2022/11/image-001-3.jpg) [600i Series](/products/in-line-products-kdf-technologies/600-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [744i Series](/products/in-line-products-kdf-technologies/744-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [844i Series](/products/in-line-products-kdf-technologies/844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [900i Series](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [974i Series](/products/in-line-products-kdf-technologies/974i-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [Ci Cluster Tool](/products/in-line-products-kdf-technologies/ci-cluster-tool/) System Overview ## Modular by Design. Intelligent by Nature. The Ci is KDF’s cluster tool platform – a fundamentally different architecture from the in-line batch systems. Instead of a single chamber with multiple targets, the Ci uses a central Brooks Marathon Series vacuum handler to move wafers between dedicated process modules: sputter, etch, degas, and load/unload. Both the four-sided and eight-sided configurations are populated based on the process requirements. Custom wafer carriers are supported, or the system can be configured for 4″ to 8″ wafers as ordered. The Ci is designed to outperform competing tools without the high cost of other OEMs. The Ci S Sputter Module features KDF’s unique rotating circular magnetron cathode – a 12-inch design providing high sputter rates, excellent target utilization, and superior uniformity. An optional stepper-driven rotating anode platen with PBN/PG backside heater achieves substrate temperatures up to 1000°C. Platform Capabilities ### Standard System Features - Four-sided and eight-sided handler configurations - Brooks Marathon Series central vacuum handler - Substrate sizes from 4″ to 8″ wafers – custom carriers available - Up to 200mm substrate capability - Modular process chambers – mix and match to application - Ci S Sputter Module – 12″ rotating circular magnetron, RF or DC - Ci S Tri-Sput Module – three 3″ sputter guns, dedicated RF per gun - Ci D Degas Module – PBN/PG backside heater up to 1000°C - Ci E Etch Module – KDF exclusive BMC etch cathode - Single wafer entry load lock (R&D) or single/dual Brooks VCE (production) - Rockwell PLC system with integrated brick PC across all modules - Ethernet IP air manifold – all modules - Full host of interlocks for system and personnel safety - CTI cryo pump vacuum architecture throughout 4 #### Four-Sided Configuration Compact footprint with four process module positions around the central handler. Ideal for targeted process flows – sputter + degas + etch + load/unload – where floor space is constrained or process steps are well-defined. 8 #### Eight-Sided Configuration Full eight-position configuration for complex multi-step process flows. Supports multiple sputter modules, combined sputter + etch + degas sequences, and dual load/unload VCEs for maximum throughput in production environments. Process Modules ## Ci Module Library Each Ci module is a self-contained process chamber – independently pumped, controlled, and interlocked – that connects to the central handler. The system is populated with modules as dictated by the process. Ci S Module ### Sputter Module Features KDF’s unique 12″ rotating circular magnetron cathode assembly – providing high sputter rates, excellent target utilization, and superior uniformity in RF or DC operation. An optional stepper-driven rotating anode platen with PBN/PG backside heater reaches substrate temperatures up to 1000°C. - 12″ Rotating Circular Magnetron Cathode – RF or DC operation - SS chamber with quick-change shields - MKS Pendulum throttling gate valve – up/downstream gas capable - AE 10 kW DC supply standard - Automatic shutter for pre-sputter and target clean modes - MKS single gas MFC 200 sccm - CTI 8F cryo pump – ACR, auto pump, auto vent - Backside lift pin pedestal for wafer entry and extraction - Plasma viewport assembly - 24 VDC water valving with safety leak detectors Options - MKS second and third gas channels - AE Pinnacle Plus DC power supply - AE Dressler 3 kW RF option (replaces DC supply) - Heated platen anode up to 1000°C - Rotating anode 0-60 rpm - CTI Onboard cryo pumps - RF bias operation - Al shield kits for TiW deposition Ci S Module – Variant ### Tri-Sput Module Three 3-inch sputter guns, each with a dedicated 600W RF power supply – enabling simultaneous or sequential deposition from three independent target materials in a single chamber pass. Ideal for alloy depositions, barrier/seed stacks, and multi-layer processes requiring precise individual power control. - Three 3″ sputter guns – dedicated RF 600W supply per gun - SS chamber with quick-change shields - MKS Pendulum throttling gate valve – up/downstream gas capable - Automatic shutter for pre-sputter and target clean modes - MKS single gas MFC 200 sccm - CTI 8F cryo pump – ACR, auto pump, auto vent - Backside lift pin pedestal for wafer entry and extraction - Plasma viewport assembly - 24 VDC water valving with safety leak detectors Options - MKS second and third gas channels - Heated platen anode up to 1000°C - Rotating anode 0-60 rpm - CTI Onboard cryo pumps - RF bias operation - Al shield kits for TiW deposition Ci D Module ### Degas Module A compact aluminum chamber with PBN/PG backside heater capable of reaching substrate temperatures up to 1000°C – enabling thorough outgassing prior to deposition for the highest film purity and adhesion. Heater control via PWM phase control with PLC-performed PID. - Compact aluminum chamber design - Manual lift top plate with gas-assist cylinders - PBN/PG backside heater element – up to 1000°C - Heater control: PWM phase control, PLC PID - CTI 8F cryo pump - SS gate valve, SS rough/regen valves, Nupro vent valves - MKS 999 RS485 combo gauge - Ethernet IP air manifold - Backside edge lift pin pedestal for wafer entry and extraction Ci E Module ### Etch Module Features KDF’s exclusive BMC (Band Magnetron Cathode) etch design – delivering high-rate, low-damage ion bombardment of the substrate. Osaka mag-lev turbo pump provides ultra-clean process environment with dedicated dry pump backup. - KDF exclusive BMC etch cathode – high rate, low damage - SS chamber with water-cooled top plate and counter magnet assembly - Osaka mag-lev turbo pump with dedicated dry pump backup - CTI inline water pump (pre-turbo) - MKS three-channel gas MFC system - MKS Pendulum throttling gate valve - Advanced Energy 3 kW RF power supply - Automatic top plate hoist - Backside edge lift pin pedestal for wafer entry and extraction - 24 VDC water valving with safety leak detectors Options - Heated platen anode up to 1000°C - Rotating anode 0-60 rpm Applications ## Target Markets Compound Semiconductors MEMS & MOEMS Defense & Sensors Advanced Packaging Optical Communications Medical Devices Nanotechnology DWDM Components Configure Your Ci System ## Build Your Cluster Tool The Ci is configured to your process – module selection, handler size, and substrate format are all specified to your application. Talk to a KDF process engineer or download the datasheet to start the conversation. [Let’s Talk Process →](/contact-us/) [Download Ci Datasheet →](https://www.kdf.com/wp-content/uploads/2022/11/Ci-Cluster-Tool.pdf) [📞 (201) 784-5005](tel:+12017845005) [✉ sales@kdf.com](mailto:sales@kdf.com) --- ### [Hermetic Sealing & Biocompatible Thin Films](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-hermetic-sealing-feedthroughs/) **Published:** February 20, 2024 **Author:** KDF Technologies **Content:** Applications · KDF Technologies # Hermetic Sealing & *Biocompatible* Thin Films Hermetic sealing plays a pivotal role in the longevity and functionality of implantable medical devices. KDF’s inline sputtering systems deliver the precision, uniformity, and biocompatibility required for pacemakers, cochlear implants, biosensors, and more. Medical Devices PVD Sputtering Biocompatible Films Overview ## The Role of Thin Films in Hermetic Sealing These devices require seals that not only prevent the ingress of bodily fluids, gases, and particles but also ensure compatibility with human tissue over extended periods. An effective hermetic seal is crucial for protecting the device’s sensitive internal components from corrosion and degradation, which could otherwise compromise its performance and reliability when implanted in the human body. Advanced thin film technologies enable the creation of barriers that are impermeable to contaminants while being biocompatible and non-reactive with bodily tissues. These films, often deposited using Physical Vapor Deposition (PVD) techniques, can include materials like **parylene, silicon nitride, or alumina** – known for their excellent barrier properties and compatibility with human tissue. KDF Technologies’ expertise in sputtering and thin film deposition is critical for manufacturing implantable medical devices with hermetic seals. The precision and control offered by KDF’s sputtering tools allow for the deposition of **uniform, defect-free layers** that are essential for achieving the desired hermeticity and biocompatibility. Sputtering systems from KDF Technologies are in use at leading medical device companies depositing films such as **Au, TiW, Ir, Ag, Zr, Ta, TaN, Ti, and TiN**. With established technologies such as HIPIMS and Pulsed DC reactive sputtering, KDF is in an ideal position to personalize a tool for your unique medical device application. ![KDF medical device inline sputter coating technology](https://www.kdf.com/wp-content/uploads/2024/01/O9A0113-683x1024.jpg) Covered Applications ## Implantable Devices That Benefit from Hermetic Sealing Biocompatible thin films ensure reliability and safety for implantation across a wide range of active and passive medical devices. ### Pacemakers Devices that regulate the heart’s rhythm rely on hermetic seals to protect their electronic components from bodily fluids, ensuring long-term functionality. ### Cochlear Implants Implants that restore hearing for individuals with profound hearing loss must be completely sealed against bodily fluids to protect sensitive internal electronics. ### Implantable Cardioverter-Defibrillators (ICDs) Devices that monitor heart rhythms and deliver electric shocks to correct irregular heartbeats require robust hermetic seals to function reliably within the body. ### Neurostimulators Used for treating neurological disorders like Parkinson’s disease and chronic pain, these devices need effective hermetic sealing to protect their electronic circuits. ### Biosensors Implantable sensors that monitor physiological parameters must have hermetic seals to ensure accurate readings over their full operational life. ### Feedthroughs & Interconnects Electrical feedthroughs require hermetic thin film coatings to seal lead/housing interfaces against body fluid ingress while maintaining electrical conductivity. ![KDF 954 sputtering system](https://www.kdf.com/wp-content/uploads/2024/02/954-Cutout-1024x683.png) ![KDF thin film medical device coating](https://www.kdf.com/wp-content/uploads/2024/02/image-5.png) ![KDF inline sputtering system interior](https://www.kdf.com/wp-content/uploads/2024/01/O9A0114-1024x683.jpg) Key Capabilities ## System Features for Medical Device Applications KDF’s inline sputtering platforms include a full range of process and hardware options purpose-built for the demands of hermetic sealing and biocompatible thin film deposition. ### 3-Dimensional & Large Parts Parts up to 4″ in thickness can be loaded into tall horizontal 900 series systems. Pallets hold total loaded weights of up to 150 lbs (system specific). ### Upsilon Inset™ Cathode – Precious Metal Sputtering Specifically designed for high thermal conductivity, high-value materials such as Gold (Au), Platinum (Pt), Palladium (Pd), and Silver (Ag). ### HIPIMS High Power Impulse Magnetron Sputtering produces highly dense, smooth, and hard films with enhanced conformality for high aspect ratio applications. ### Enhanced Rotating Planetary Pallet (ERPP) KDF’s proprietary ERPP™ achieves exceptionally high uniformity in the sub ±1% range, with tight run-to-run repeatability. Available on 900 series systems. ### Plasma Emission Monitoring (PEM) Advanced reactive feedback control for improvements to deposition rates, coating properties, and process stability. Maintains the process in high-rate metallic mode. ### Auto Rate Adjust (ARA) Automatically adjusts scan speed or deposition power to account for target wear, maintaining a stable and repeatable process throughout the target’s life. ### Scan Velocity Control Allows the operator to create custom velocity profiles for the pallet as it passes through the deposition zone, enhancing film uniformity and deposition rates. ### IR Pallet Temperature Measurement Integrated pyrometer provides instant feedback on pallet and part temperature, with readings integrated into recipes for controlled heating and cooling steps. ### Water Pump & Cooling High-performance water pumps increase water vapor pumping speeds to substantially improve system throughput and process stability. Full water cooling available on chamber, shielding, and cathodes. Featured Systems ## 943ix & 954ix – x Series™ The 943ix and 954ix are two of KDF’s flagship x Series™ products. They feature the latest KDF cathode designs, lengthened to 17 inches, offering improved uniformity over the entire pallet. x Series™ cathodes are available in Planar™, Inset™, and RF/DC LMM™ cathode form – giving process engineers the flexibility to dial in the exact deposition characteristics required for hermetic sealing applications. - 17″ cathode length for improved pallet-wide uniformity - Planar™, Inset™, and LMM™ cathode options - Compatible with ERPP, HIPIMS, PEM, and ARA options - Proven at leading implantable device manufacturers - Full MRC batch system lineage and parts compatibility [View 900i Series →](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) [Request a Consultation](/contact-us/) ![KDF 943ix sputtering system](https://www.kdf.com/wp-content/uploads/2024/01/O9A0114-1024x683.jpg) Get in Touch ## Ready to Discuss Your Hermetic Sealing Application? KDF’s applications, design, and vacuum engineering teams are ready to help you configure the right sputtering solution for your implantable device manufacturing process. [Contact KDF Technologies →](/contact-us/) [View All Systems](/products/in-line-products-kdf-technologies/) --- ### [KDF Sputtering Solutions](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-sputtering-solutions/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** KDF Technologies – Process Capability # KDF *Sputtering* Technology From hard coatings and decorative films to state-of-the-art microchip metallization and medical device applications – KDF sputtering technology is engineered for the full spectrum of thin film production. [Talk to a Process Engineer →](/contact-us/) [View All Systems →](/products/in-line-products-kdf-technologies/) KDF’s in-line sputtering platforms are designed to support every major sputtering mode – DC magnetron, RF, pulsed DC, reactive, and HiPIMS – with proprietary cathode technology, precision gas management, and in-situ process monitoring that set the standard for batch production at scale. Core Capability ## Reactive Sputtering KDF Technologies has extensive experience designing reactive sputtering batch coating production systems. Several optional features set KDF apart in reactive process control – from gas delivery architecture to power supply selection. ⬡ #### Optimally Designed Gas Rings KDF’s gas rings inject reactive gas directly into the sputter plasma at the target – particularly effective for nitrogen, an intermediately chemically active gas. The ring geometry utilizes plasma energy to make the reaction more favorable and consistent across the substrate area. ◈ #### Pressure Control Package All KDF systems include downstream pressure control paired with highly accurate Mass Flow Controllers (MFCs). This maintains a constant rate of reactive gas injection throughout the process – the most reliable pressure control technique for reactive sputtering environments. ⚡ #### Prompt Gas Injection Reactive gas MFCs are located as close as possible to the gas injection port on the chamber, enabling rapid flow rate changes with minimal lag – critical for tight process window control and run-to-run repeatability. ▣ #### Advanced Power Supplies KDF utilizes pulsed DC supplies with a wide range of pulse frequency and reverse time for conductive target reactive sputtering – outpacing arcing for a more stable, high deposition rate process. KDF also specializes in reactive RF sputtering with in-house made, system-tuned matching networks. In-Situ Process Control ## Plasma Emission Monitoring (PEM) KDF continues to innovate in reactive sputtering with specially designed, patented sputter sources and integrated Plasma Emission Monitoring – giving process engineers real-time visibility and feedback control over deposition chemistry. Patented Design ### Sputter Sources for Reactive Processing KDF’s LMM sputter source is purpose-designed for reactive sputtering. It reduces the build-up of reacted species on the target surface, decreasing the potential for arcing and process instability – ensuring higher uptime and more predictable film chemistry run over run. In-Situ Control ### PEM Integration & Software Control KDF integrates PEM with precisely placed optical sensors and intuitive software controls. PEM tracks the relative emission intensity of ionized species in the sputtering plasma and controls reactive gas flow to maintain an emission intensity setpoint – correlating directly to deposition rate and reactive gas concentration in the deposited films. Proprietary Technology ## KDF Technology Pillars Proprietary ### Linearly Moving Magnetron (LMM™) The LMM is a KDF proprietary design that solves the challenge of full-face target erosion. An oscillating magnet behind the target sweeps the plasma across the full target surface, achieving uniform full-face erosion and high target utilization. By design, the LMM delivers superior process stability and repeatability from run to run – and across the full target lifetime – translating directly to higher productivity and lower cost of ownership. Proprietary ### Enhanced Rotating Planetary Pallet (ERPP™) The ERPP is a KDF design that achieves exceptionally high within-wafer and wafer-to-wafer uniformity – sub-1% – with tight repeatability. Referenced in Vacuum Technology and Coating (December 2002), the ERPP is available across all sputtering modes and can be deployed for DC Magnetron, RF, Pulsed DC, Reactive, and HiPIMS sputtering processes. [Read the related publication →](https://www.kdf.com/wp-content/uploads/2022/09/Highly-uniform-dielectric-films.pdf) Configuration ### Down & Side Sputtering Geometries KDF offers both down-sputtering and side-sputtering configurations across multiple system sizes – with deposition areas ranging from 12″ × 12″ to 26″ × 30″. Both geometries support all major sputtering modes and are optimized for different substrate types, throughput requirements, and cleanroom footprint constraints. Materials ### Metal & Dielectric Sputtering KDF platforms support both metal and dielectric sputtering across a wide range of substrate types and sizes – including Transparent Conductive Oxides (TCOs) such as ITO and ZnO. This flexibility makes KDF systems well-suited for photovoltaics, flat panel displays, optical coatings, and advanced semiconductor metallization. Process Option ### High-Vacuum Loadlock & Pre-Heat All KDF systems can be equipped with a high-vacuum load lock and substrate pre-heat option, allowing substrates to be pre-treated prior to entering the deposition chamber. This reduces outgassing, shortens pump-down cycles, and improves adhesion and film quality – particularly important for hermetic and medical device applications. Process Flexibility ## Supported Sputtering Modes KDF in-line systems support the full range of modern PVD sputtering modes – enabling process development teams to transition from R&D to production on a single platform family without sacrificing flexibility or throughput. #### DC Magnetron The workhorse of production sputtering. High deposition rates for conductive metals and alloys with excellent run-to-run uniformity via LMM technology. #### RF Sputtering Enables deposition of dielectric and insulating materials. KDF’s in-house matching networks are tuned to each system for stable, repeatable RF processes. #### Pulsed DC Suppresses arcing during reactive processes. Wide adjustment range for pulse frequency and reverse time enables high-rate deposition with dielectric targets. #### Reactive Sputtering Full reactive sputtering capability with optimized gas ring delivery, MFC-based pressure control, and optional PEM closed-loop feedback. #### HiPIMS High Power Impulse Magnetron Sputtering for extremely dense, smooth thin films with superior adhesion – available across the KDF platform family. #### Multi-Mode Capability ERPP planetary pallet available across all modes. Single-pass and multiple-pass deposition supported. R&D and production cluster tool configurations available. #### All Modes Available Across KDF Platforms DC Magnetron RF Sputtering Pulsed DC Reactive Sputtering HiPIMS Technical Highlight ## Dielectric Deposition at High-Metallic Rates High-rate processes for dielectric film deposition have been developed using pulsed DC reactive sputtering on KDF scanning batch tools – delivering dramatically faster throughput compared to conventional RF magnetron methods. ~1µm SiO₂ in 15 Minutes Pulsed DC reactive sputtering from a conductively doped silicon target on a KDF batch tool. ~5 hrs Conventional RF Method Equivalent SiO₂ thickness via RF magnetron sputtering from a quartz target – 20× slower throughput. Reference: Photonics Spectra, pp. 30-31, November 2002. Ready to go deeper? ## Let’s Talk Process Our process engineers can help you identify the right sputtering mode, cathode configuration, and system platform for your specific application and substrate requirements. [Contact a Process Engineer →](/contact-us/) [View All Systems →](/products/in-line-products-kdf-technologies/) [📞 (201) 784-5005](tel:+12017845005) [✉ sales@kdf.com](mailto:sales@kdf.com) --- ### [KDF Wear Coatings - In Line Sputter Coating Technology](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-wear-coatings/) **Published:** February 20, 2024 **Author:** KDF Technologies **Content:** Applications · KDF Technologies # Wear *Coatings* & Surface Protection Thin film wear coatings are integral to enhancing the durability and functionality of products ranging from industrial cutting tools and automotive components to razor blades and medical devices. KDF’s inline sputtering systems deliver the precision and throughput that wear coating production demands. Wear Coatings DLC PVD Sputtering Overview ## Thin Film Wear Coating Technology Thin film wear coatings serve to protect against abrasion, corrosion, and oxidation – extending the lifespan and maintaining the performance of the underlying substrate. Utilized across a broad spectrum of industries including automotive, personal care, medical, and industrial manufacturing, wear coatings find applications on components such as gears, cutting tools, pistons, and personal grooming products. The process of applying these coatings involves Physical Vapor Deposition (PVD) techniques, with sputtering being a prominent method due to its ability to achieve uniform, high-quality coatings. KDF Technologies is at the forefront of providing sputtering tools critical for the deposition of wear coatings – depositing materials including **TiN, CrN, TiAlN, AlTiN, W, WC, Al₂O₃, ZrO₂, Ta, and DLC**. These materials are chosen for their ability to **reduce friction, resist wear,** and in some cases add decorative colors to coated objects. KDF’s sputtering tools make them a staple in production lines across industries – ensuring products meet the highest standards of durability and performance. ![KDF inline sputtering system for wear coating production](https://www.kdf.com/wp-content/uploads/2024/01/O9A0113-683x1024.jpg) Coating Materials TiN CrN TiAlN AlTiN DLC W WC Al₂O₃ ZrO₂ Ta TaN Ti Key Products ## Products That Benefit from Thin Film Wear Coatings These products highlight the importance of thin film wear coatings in various applications – significantly contributing to the durability and efficiency of high-wear components across industries. ### Drill Bits Used in machining, mining, and construction, drill bits coated with TiN or TiAlN exhibit increased hardness, reduced friction, and resistance to wear and heat – leading to longer service life and improved drilling efficiency. ### Razor Blades Diamond-like carbon (DLC) coatings on razor blades enhance sharpness and wear resistance, providing a smoother shave and extending blade usability significantly compared to uncoated substrates. ### Cutting Tools End mills, inserts, and taps coated with TiN, TiAlN, or AlTiN deliver improved hardness, reduced wear, and extended lifespan – increasing manufacturing efficiency and reducing the frequency of tooling replacement. ### Automotive Components Gears, pistons, and engine valves benefit from CrN and DLC coatings – improving resistance to abrasion and corrosion, reducing friction, and enhancing fuel efficiency and overall vehicle performance. ### Medical Implants Orthopedic and dental implants require wear-resistant, biocompatible coatings. DLC and TiN coatings protect implant surfaces from wear while maintaining compatibility with surrounding bone and tissue. ### Industrial & Decorative Applications Wear coatings such as TiN (gold appearance), CrN (silver), and ZrO₂ (white) are used for decorative hardware, watch components, and consumer products – combining aesthetics with functional surface protection. ![KDF 954 sputtering system](https://www.kdf.com/wp-content/uploads/2024/02/954-Cutout-1024x683.png) ![KDF thin film process](https://www.kdf.com/wp-content/uploads/2024/02/image-5.png) ![KDF inline sputtering system](https://www.kdf.com/wp-content/uploads/2024/02/O9A0111-1024x683.jpg) Also From KDF Technologies ## VaporTech PVD Systems – Now Supported by KDF KDF Technologies is the authorized service, spare parts, and applications support provider for all VaporTech PVD systems, effective August 1, 2026. VaporTech’s industrial batch PVD platforms – including the V.MAX1500™ and VTi Series – are widely used for wear coating and DLC applications including cutting tools, automotive components, decorative hardware, and medical implants. If you operate a VaporTech system, KDF’s service organization is fully trained on all five VaporTech platforms and OEM-designed spare parts are stocked and ready across North America, Europe, and Asia. Effective August 1, 2026 ### VaporTech Service & Parts All VaporTech PVD system service, spare parts, and applications support – now provided by KDF Technologies. Systems covered: V.MAX1500™, VT-1000i™, VT-1500i™, VT-3000i™, and Cadence®. [Learn About the Transition →](/vaportech-support/) [Contact KDF Technologies](/contact-us/) Key Capabilities ## System Features for Wear Coating Applications KDF’s inline sputtering platforms include process options specifically suited for the high-throughput, high-consistency demands of industrial wear coating production. ### 3-Dimensional & Large Parts Parts up to 4″ in thickness can be loaded into tall horizontal 900 series systems. Pallets hold total loaded weights of up to 150 lbs – accommodating complex cutting tool and automotive component geometries. ### HIPIMS High Power Impulse Magnetron Sputtering produces highly dense, smooth, and hard films with enhanced conformality – essential for DLC coatings on razor blades, cutting tools, and high aspect ratio wear surfaces. ### Plasma Emission Monitoring (PEM) Advanced reactive feedback control for deposition rates, coating properties, and process stability. Optically monitors plasma emission from the cathode and adjusts reactive gas flow to maintain high-rate metallic mode – critical for nitride wear coating processes like TiN, CrN, and TiAlN. ### Auto Rate Adjust (ARA) Automatically adjusts scan speed or deposition power to compensate for target wear – maintaining consistent film thickness and properties throughout the target’s full life in high-volume wear coating production. ### Water Cooling Chamber, internal shielding, and cathodes can all be water cooled – essential for sustained high-power deposition runs common in industrial wear coating production environments. ### Water Pump & Process Stability High-performance water pumps substantially improve throughput and process stability – particularly important for reactive nitride and oxide wear coating deposition processes. ### Scan Velocity Control Create custom pallet velocity profiles through the deposition zone – enabling precise thickness gradients and process control across mixed tooling geometries on a single pallet. ### IR Pallet Temperature Measurement Integrated pyrometer for instant pallet and part temperature feedback – critical for DLC deposition processes where substrate temperature directly impacts coating adhesion and sp³ carbon content. ### Pulsed DC Reactive Sputtering Enables stable reactive deposition of nitride and oxide wear coating materials – preventing arc events and maintaining consistent stoichiometry for high-quality TiN, TiAlN, CrN, and Al₂O₃ coatings. Featured Systems ## 943ix & 954ix – x Series™ The 943ix and 954ix are KDF’s flagship x Series™ systems for wear coating applications. Their 17-inch cathode design delivers improved uniformity across the full pallet – a decisive advantage for industrial wear coating production where coating thickness consistency directly impacts tool life and performance repeatability. x Series™ cathodes are available in Planar™, Inset™, and RF/DC LMM™ form – covering the complete range of metallic, nitride, carbide, and DLC deposition processes required for high-performance wear coating manufacturing. - 17″ cathode for superior pallet-wide uniformity - Planar™, Inset™, and LMM™ cathode configurations - Compatible with HIPIMS, PEM, ARA, Water Cooling, and Pulsed DC - Proven at leading cutting tool, automotive, and personal care manufacturers - Full MRC batch system lineage and worldwide parts support [View 900i Series →](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) [Request a Consultation](/contact-us/) ![KDF 943ix sputtering system for wear coating production](https://www.kdf.com/wp-content/uploads/2024/02/O9A0111-1024x683.jpg) Get in Touch ## Ready to Discuss Your Wear Coating Application? KDF’s applications, design, and vacuum engineering teams are ready to configure the right sputtering solution for your wear coating production process – from DLC and TiN to complex nitride and carbide multilayer systems. [Contact KDF Technologies →](/contact-us/) [View All Systems](/products/in-line-products-kdf-technologies/) --- ### [MRC Heritage and Evolution](https://www.kdf.com/mrc-heritage-and-evolution/) **Published:** April 9, 2026 **Author:** KDF Technologies **Content:** KDF Technologies · Heritage & Innovation # MRC Heritage & *Evolution* Honoring a Legacy of Innovation and Sustaining a Standard of Excellence August 7, 2025 News ![Materials Research Corporation MRC Logo](https://www.kdf.com/wp-content/uploads/2024/01/MRC_logo-1021x1024.png) The Foundation ## Materials Research Corporation **Materials Research Corporation (MRC)** was founded in 1957 and quickly became a global leader in **vacuum processing** and **thin film deposition technologies**. By the 1970s, MRC had introduced the 903 and 943 series sputtering systems – robust, configurable platforms widely adopted across semiconductor, optics, and materials science industries. These systems were renowned for their **reliability**, **modularity**, and **high-volume production capabilities**. MRC’s sputtering systems helped shape the early landscape of **physical vapor deposition (PVD)**, with the 903/943 series supporting a wide range of materials and substrate configurations. By the mid-1980s, over a thousand units had been shipped worldwide, and MRC had emerged as the top supplier of sputtering systems. Continuity Through KDF ## Preserving the MRC Legacy In 1998, [KDF Technologies](https://www.kdf.com/) acquired MRC’s batch and etch product lines from Tokyo Electron Limited (TEL) – marking a pivotal moment in the preservation of MRC’s sputtering system legacy. Since then, KDF has continuously manufactured and supported the 903 and 943 platforms, maintaining uninterrupted production and advancing their capabilities. The original design principles remain intact, complemented by ongoing enhancements to **control systems, real-time film thickness and uniformity diagnostics**, **safety mechanisms**, and **process flexibility**. This technical stewardship has been upheld by engineering teams with deep expertise in both MRC and KDF systems, ensuring continuity of quality and performance across generations. [MRC Upgrade Kits →](https://www.kdf.com/products/original-oem-parts/kdf-upgrade-kits-mrc-upgrade-kits/mrc-upgrade-kits/) Modern Capabilities ## Technical Evolution KDF’s current systems uphold the foundational architecture of MRC’s originals while incorporating a range of modern advancements designed to meet the demands of contemporary applications: - **Dual-level load-lock chambers** – enabling high-throughput processing with improved operational efficiency - **RF/DC magnetron sputtering** – enhanced with programmable scan velocity profiling for greater control and repeatability - **Substrate heating & RF etch functionalities** – improved versatility and precision across a wide array of material substrates - **Dynamic pressure control** – contributing to tighter process windows and more consistent film properties - **PLC and PC-based control systems** – intuitive graphical interfaces and streamlined process management These enhancements ensure that KDF systems remain fully compatible with legacy MRC platforms while delivering the performance required by today’s **semiconductor**, **photonics**, and **advanced materials** industries. [KDF Sputtering Solutions →](https://www.kdf.com/products/in-line-products-kdf-technologies/kdf-sputtering-solutions/) Ongoing Support ## Lifetime Commitment to Legacy Systems Across laboratories, universities, and manufacturing facilities worldwide, thousands of MRC systems remain in operation – a testament to the durability and engineering excellence of the original platforms. KDF remains committed to supporting these legacy systems with a comprehensive approach that honors their design integrity and operational relevance. KDF’s support for legacy MRC systems is backed by engineers with 600+ combined person-years of MRC and KDF equipment experience – the deepest bench of inline sputtering knowledge in the industry. - **Replacement parts** fabricated to match historical specifications, ensuring seamless compatibility and performance - **Factory-trained field engineers** with deep knowledge of both MRC and KDF architectures - **In-house process development** backed by advanced metrology and lab capabilities - **Technical documentation** including original manuals and schematics, carefully preserved for ongoing reference [Original Batch OEM Parts →](https://www.kdf.com/products/services-inline-sputtering-systems/original-oem-parts/) [MRC Style Backing Plates →](https://www.kdf.com/products/original-oem-parts/backing-plates/) A Continuing Legacy ## Continuing a Tradition of Excellence KDF remains steadfast in its commitment to preserving the engineering legacy of MRC while advancing the technology to meet modern standards. From honoring original designs to integrating next-generation capabilities, our work ensures that these foundational systems continue to serve the scientific and industrial communities with reliability, precision, and adaptability. This enduring commitment ensures that MRC systems continue to function at their highest potential – bridging past innovation with present-day reliability. Work With KDF ## Have an MRC System That Needs Support? Our engineers know these systems inside and out. Whether you need parts, service, upgrades, or process development – we’re the authorized source. [Contact Us →](/contact-us/) [View OEM Parts →](/products/services-inline-sputtering-systems/original-oem-parts/) --- ### [News](https://www.kdf.com/news/) **Published:** September 29, 2022 **Author:** Vishal Agrawal **Content:** KDF Technologies # News & *Insights* The latest innovations, product launches, and technical breakthroughs from KDF Technologies – the leader in inline batch sputtering systems. Featured Stories [ White Paper Engineering TiO₂ Thin-Film Properties Through Oxygen Control](/tio2-reactive-sputtering-oxygen-control/)How KDF’s reactive DC sputtering platform enables precise tuning of TiO₂ optical, mechanical, and electrical properties – refractive index from 2.1 to 2.8, roughness from 250 Å to 50 Å, all at constant thickness. [April 2026 Read White Paper → ](/tio2-reactive-sputtering-oxygen-control/) [ Technical Paper ERPP Technology: Achieving ±1% Thin Film Uniformity](/erpp-technology-thin-film-uniformity/)A breakthrough in sputtering system design delivering metallic film uniformity better than ±1% and repeatability exceeding ±0.5% – combining advanced planetary motion with linear scanning. [July 2025 Read Article → ](/erpp-technology-thin-film-uniformity/) [ Heritage MRC Heritage & Evolution: Honoring a Legacy of Innovation](/mrc-heritage-and-evolution-honoring-a-legacy-of-innovation-and-sustaining-a-standard-of-excellence/)How KDF Technologies acquired and preserved MRC’s legendary 903/943 sputtering platforms – and continues advancing them for today’s semiconductor and photonics industries. [August 2025 Read Article → ](/mrc-heritage-and-evolution-honoring-a-legacy-of-innovation-and-sustaining-a-standard-of-excellence/) Latest News Recent Articles & Updates [ White Paper Reactive Sputtering Engineering TiO₂ Thin-Film Properties Through Oxygen Control](/tio2-reactive-sputtering-oxygen-control/)Precise tuning of TiO₂ optical, mechanical, and electrical properties via O₂/(Ar+O₂) ratio – refractive index, roughness, stress, and sheet resistance all controllable at constant thickness. [April 2026 ](/tio2-reactive-sputtering-oxygen-control/) [ KDF Technologies Company News Built for Production. Trusted for Repeatability. Backed by Kurt J. Lesker Company.](/built-for-production-trusted-for-repeatability-backed-by-kurt-j-lesker-company/)Repeatable results, rugged equipment, and tools that scale with your line – KDF Technologies, part of the Kurt J. Lesker Company family. [2025 ](/built-for-production-trusted-for-repeatability-backed-by-kurt-j-lesker-company/) [ KDF Technologies Technical Precision without Poisoning: Plasma Emission Monitoring in Reactive Sputtering](/precision-without-poisoning-plasma-emission-monitoring-in-reactive-sputtering-with-kdf-technologies/)Advanced process control for functional oxides, nitrides and compounds via plasma emission monitoring technology. [2025 ](/precision-without-poisoning-plasma-emission-monitoring-in-reactive-sputtering-with-kdf-technologies/) [ KDF Technologies Innovation Advancements in Reactive Sputtering with KDF’s Sputter Sources and PEM](/advancements-in-reactive-sputtering-with-kdfs-sputter-sources-and-pem/)KDF continues to innovate in reactive sputtering with specially designed and patented sputter sources integrated with Plasma Emission Monitoring. [2025 ](/advancements-in-reactive-sputtering-with-kdfs-sputter-sources-and-pem/) [ KDF Technologies Technical Enhancing Reactive Sputtering with KDF’s Unique Features](/enhancing-reactive-sputtering-with-kdfs-unique-features/)Optimally designed gas rings, specialized cathode configurations, and other features that set KDF apart in reactive sputtering applications. [2024 ](/enhancing-reactive-sputtering-with-kdfs-unique-features/) [ KDF Technologies Customer News KDF Technologies Hosts Boston Scientific](/kdf-technologies-hosts-boston-scientific/)KDF recently hosted Boston Scientific for acceptance testing of their new 954i sputter system, joining their existing fleet of KDF tools. [2024 ](/kdf-technologies-hosts-boston-scientific/) [ KDF Technologies Product Update KDF 5 Pallet Stacker Option for the 900i Series Batch Sputtering Systems](/kdf-5-pallet-stacker-option-for-the-kdf-900i-series-batch-sputtering-systems/)New option allows 5 pallets to be loaded into the system load lock simultaneously, increasing throughput and reducing operator intervention. [2023 ](/kdf-5-pallet-stacker-option-for-the-kdf-900i-series-batch-sputtering-systems/) [ KDF Technologies Product Update KDF Enhanced Planetary Pallet for 900i Series Batch Sputtering Systems](/kdf-enhanced-planetary-pallet-for-900i-series-batch-sputtering-systems/)The new internally motor-driven planetary pallet accommodates wafer sizes from 2 to 5 inches with improved uniformity performance. [2023 ](/kdf-enhanced-planetary-pallet-for-900i-series-batch-sputtering-systems/) [ KDF Technologies Product Update KDF 844i Batch Sputtering System Enhancements](/kdf-844i-batch-sputtering-system-enhancements/)The 844i has been re-engineered to process heavier payloads up to 140 lbs with new upgrades across the platform. [2022 ](/kdf-844i-batch-sputtering-system-enhancements/) [ KDF Technologies Innovation LMM™ – Linear Moving Magnet Cathode](/lmm-linear-moving-magnet-cathode/)A patented full face erosion rectangular cathode design available for all KDF systems, delivering superior target utilization. [2021 ](/lmm-linear-moving-magnet-cathode/) [ KDF Technologies Applications Solutions in Action](/solutions-in-action/)How KDF’s precision sputtering systems are enabling the next generation of reliable consumer and industrial electronic devices. [2020 ](/solutions-in-action/) Press Releases Archive [ 2012 KDF Tools Selected for High Efficiency PV Solar Cell Manufacture in USA and China → ](/kdf-tools-selected-for-installation-in-the-usa-and-china-for-use-in-manufacture-of-high-efficiency-pv-solar-cells/) [ 2010 KDF Tools Selected for Pacemaker Component Manufacture in USA and Mexico → ](/kdf-tools-selected-for-installation-in-the-usa-and-mexico-for-use-in-manufacture-of-pacemaker-components/) [ 2019 KDF Announces the Release of its New Improved Pallet Assist Tool (PAT) → ](/kdf-announces-the-release-of-its-new-pallet-assist-tool-pat/) [ 2009 KDF Announces the Release of the G-12 Full-Face Erosion Cathode → ](/kdf-announces-the-release-of-the-g-12-full-face-erosion-cathode/) [ 2008 KDF Releases Newest Version of the Field Proven LMM™ Cathodes → ](/kdf-releases-its-newest-version-of-the-field-proven-lmm-cathodes/) [ 2008 KDF Releases and Installs the New 844i Systems → ](/kdf-releases-and-installs-the-new-844i-systems/) [ 2007 KDF Announces the New i Series System Controls Platform → ](/kdf-announces-the-new-i-series-system-controls-platform/) [ 2006 KDF Broadens Customer Relationships with Leading Medical Equipment OEMs → ](/kdf-broadens-customer-relationships-with-leading-medical-equipment-oems/) [ 2006 Equipping a $165M Digital X-Ray Production Facility → ](/equipping-a-multi-million-dollar-digital-x-ray-production-facility/) [ 2006 KDF’s First Sale of Cluster Intelligence Tool Extends Ovonyx’s Non-Volatile Memory Capabilities → ](/kdfs-first-sale-of-new-cluster-intelligence-tool-extends-ovonyxs-non-volatile-memory-technology-capabilities/) [ 2005 KDF Expands Presence in China with Sale to Beijing Microelectronics Institute → ](/kdf-expands-presence-in-china-with-sale-of-900-series-in-line-sputtering-tool-to-beijing-microelectronics-institute/) [ 2005 Fupo Electronics Purchases KDF 844NT for High-Volume Wafer Bumping Manufacturing → ](/fupo-electronics-purchases-kdfs-844nt-batch-sputtering-system-for-high-volume-wafer-bumping-manufacturing/) [ 2005 KDF 744NT Batch Sputtering System Installed for Research at Arizona State University → ](/kdf-744nt-batch-sputtering-system-installed-for-research-at-arizona-state-university/) [ 2005 Leading Health Equipment OEM Purchases Two KDF 744NT Systems for Digital X-Ray Production → ](/leading-health-equipment-oem-purchases-two-kdf-744nt-batch-sputtering-systems-for-digital-x-ray-technology-production/) [ 2004 TFR Technologies Selects KDF 954NTX with ERPP Option for Uniform, Repeatable Thin Film Deposition → ](/tfr-technologies-selects-kdf-954ntx-with-erpp-option-for-uniform-repeatable-thin-film-deposition/) [ Legacy Obsolete Operating Systems – Upgrade Path Information → ](/obsolete-operating-system/) [ Legacy End of Life – MRC Batch Product Line Support Information → ](/end-of-life/) [ 2013 Pirates Abound: The Problem with IP for OEMs – Vacuum & Coating Technology Magazine → ](/kdf-news-article-as-seen-in-the-april-2013-issue-of-vacuum-coating-technology-magazine/) Stay Connected ## Want to Know When *New Articles* Drop? Contact our team directly or reach out to discuss how KDF’s latest innovations can support your thin film process requirements. [Contact KDF →](/contact-us/) [View Our Systems →](/products/in-line-products-kdf-technologies/) --- ### [Blog](https://www.kdf.com/blog/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** ## Blog ### BLOG ## Resources & Insights --- ### [Engineering TiO₂ Thin-Film Properties Through Oxygen Control](https://www.kdf.com/tio2-reactive-sputtering-oxygen-control/) **Published:** April 1, 2026 **Author:** KDF Technologies **Content:** KDF Technologies · White Paper # Engineering TiO₂ Thin-Film Properties Through *Oxygen Control* How KDF’s reactive DC sputtering platform – with its proprietary Gas Ring and dual upstream/downstream gas control – enables precise, repeatable tuning of TiO₂ optical, mechanical, and electrical properties across the full reactive gas range. By Firas Mahyob · KDF Technologies White Paper Reactive Sputtering TiO₂ Company Background ## KDF Technologies: A Legacy of Leadership in Reactive Sputtering For more than four decades, KDF Technologies has been recognized as one of the most reliable and innovative manufacturers of batch sputtering systems for semiconductor, photonic, and advanced-materials applications. From early-generation planar tools to today’s fully engineered production platforms, KDF has consistently delivered equipment that combines mechanical robustness, process stability, and unmatched repeatability. This long-standing reputation is rooted in a simple principle: **every KDF tool is designed to give users complete control over the thin-film growth environment.** ![KDF 943i reactive sputtering system for TiO2 thin film deposition](https://www.kdf.com/wp-content/uploads/2025/07/943ix-pic1.jpg) KDF Batch Sputtering System – engineered for reactive gas control Among KDF’s many capabilities, **reactive sputtering** stands out as one of the company’s most significant achievements. While other platforms treat reactive gas delivery as an optional add-on, KDF engineered its systems from the ground up to master the complexities of reactive sputtering for oxides, nitrides, and compound materials. KDF tools have been successfully deployed to deposit **TiO₂, Ta₂O₅, TaN, TiN, Cr₂O₃, NbO, NbO₂, Nb₂O₅**, and numerous other functional materials – each with precise control over stoichiometry, microstructure, and film properties. Reactive sputtering is inherently challenging. Introducing oxygen or nitrogen into a plasma changes target surface chemistry, alters plasma impedance, and can shift the process between metallic and poisoned modes. KDF tools were engineered specifically to operate in these conditions with **high stability, low drift, and exceptional repeatability.** Core Technology ## Gas Ring Innovation & True Reactive Gas Control A defining feature of KDF’s reactive sputtering architecture is the **KDF Gas Ring** – a proprietary engineering solution that fundamentally improves how reactive gases are delivered to the target. Traditional sputtering systems rely on manifold-based gas injection, which distributes oxygen or nitrogen unevenly across the chamber, leading to unstable plasma behavior and inconsistent stoichiometry. #### Gas Ring Advantages - **Localized, controlled reactivity** at the intended target - **Reduced cross-target poisoning** in multi-cathode systems - **Stable transitions** between metallic and poisoned modes - **Improved uniformity** in deposition rate and film composition - **Higher repeatability** across long production cycles #### Dual Gas Control Modes - **Upstream control** – regulates gas flow before the chamber with throttle-valve adjustments - **Downstream control** – regulates chamber pressure directly without throttle modulation - Fine-tune O₂/(Ar+O₂) ratio with exceptional precision - Consistent film growth across a wide range of materials Few sputtering platforms offer this dual-mode capability. Together, the Gas Ring and dual gas-control architecture give KDF customers a level of process control that is rare in the industry – forming the foundation for all results demonstrated in this white paper. Material Overview ## TiO₂ as a Model System Titanium dioxide (TiO₂) is one of the most widely used functional materials in modern technology – and one of the most demanding to deposit consistently. Its unique combination of optical, electrical, and chemical properties makes it essential across a broad range of applications: - Semiconductor devices and dielectric layers - Photonic and optical coatings - Anti-reflective and high-index optical stacks - Photocatalysis and environmental applications - Solar cells and energy-harvesting systems - Gas sensors and electro-optic devices - NIR temperature-barrier coatings for medical devices TiO₂ is an ideal demonstration material because its properties are **highly sensitive** to the oxygen environment during deposition. Insignificant changes in the O₂/(Ar+O₂) ratio can shift the film between distinct phases: Sub-stoichiometric TiOₓ → Amorphous TiO₂ → Anatase TiO₂ → Rutile TiO₂ Each phase exhibits distinct refractive index, density, stress, roughness, and electrical conductivity In the KDF application laboratory, TiO₂ films were deposited while varying the O₂/(Ar+O₂) ratio across a wide range – **9%, 30%, 40%, 55%, 84%, 89%, and 92%** – while holding all other parameters constant. This controlled design isolates the effect of reactive gas flow on film properties. 100 Å Minimum Controllable Thickness 2.1-2.8 Refractive Index Range 250→50 Å Surface Roughness Reduction 7 Ratios O₂/(Ar+O₂) Test Points Experimental Results ## Optical Properties: Precision Refractive Index Tuning Optical properties are among the most sensitive indicators of film quality in TiO₂. In the KDF experiments, films were deposited at identical thickness (450 Å) across all oxygen ratios, with the results showing a clear trend: **as oxygen fraction increases, refractive index rises** – reflecting a transition from oxygen-deficient TiOₓ to dense, near-stoichiometric TiO₂. ### Refractive Index at 941 nm (NIR) The choice of 941 nm is deliberate. This wavelength lies deep in the near-infrared region where TiO₂ exhibits minimal electronic absorption and its refractive index becomes highly sensitive to changes in stoichiometry and film density – providing a clean, dispersion-dominated index value that reflects intrinsic structural quality rather than absorption artifacts. The **900-1000 nm window** is also widely used in medical, sensing, and photonic systems including NIR imaging, pulse oximetry, photothermal diagnostics, and thermal-management coatings. By characterizing TiO₂ at 941 nm, these results directly evaluate its suitability as a **temperature-barrier and optical-control layer** in medical devices. O₂/(Ar+O₂) Ratio Refractive Index (n @ 941nm) Film Character Primary Applications 9% ~2.28 Sub-stoichiometric TiOₓ Transparent conductive layers, charge dissipation 30% ~2.35 Oxygen-deficient TiO₂ Sensor contacts, electrodes 40% ~2.45 Transitional Mixed optical/electrical applications 55% ~2.55 Near-stoichiometric Antireflection coatings, visible optical stacks 84% ~2.68 Dense amorphous TiO₂ High-index dielectric layers, waveguides 89% ~2.75 Approaching anatase Photonic crystals, AR/VR optics 92% ~2.83 Dense anatase-like Dielectric mirrors, high-confinement waveguides ![TiO2 refractive index and dispersion curves vs oxygen ratio KDF reactive sputtering](https://www.kdf.com/wp-content/uploads/2026/04/Tio2-figure-2.jpg) Fig. 2 – Refractive index at 941 nm for TiO₂ films at varying O₂/(Ar+O₂) ratios (450 Å constant thickness) ![TiO2 dispersion curves across UV-VIS-NIR spectrum KDF reactive sputtering](https://www.kdf.com/wp-content/uploads/2026/04/Tio2-figure-3.jpg) Fig. 3 – Dispersion curves (367-941 nm) for TiO₂ films at varying O₂/(Ar+O₂) ratios ![TiO2 optical properties summary KDF reactive sputtering](https://www.kdf.com/wp-content/uploads/2026/04/Tio2-figure-4.jpg) Fig. 4 – Optical properties summary for TiO₂ films across the full O₂/(Ar+O₂) range ### Dispersion Behavior Across UV-VIS-NIR Dispersion curves collected from 367 nm to 941 nm reveal how TiO₂ interacts with light across the full spectrum. Films deposited at different oxygen ratios show **clear separation** even at identical thickness – a direct indicator of KDF’s microstructural control. This tunability enables: - **High-index contrast** – for dielectric mirrors, waveguides, photonic integrated circuits, and AR/VR optical combiners - **Low optical loss** – essential for NIR medical sensors, biosensing platforms, and implantable photonic components - **Precise phase control** – for metasurfaces, interferometric modulators, and temperature-barrier coatings in NIR medical devices - **Broadband or narrowband design** – from solar energy coatings to spectrally selective laser line mirrors - **Engineered dispersion** – for ultrafast optics, nonlinear photonics, and chromatic aberration-corrected metasurfaces Experimental Results ## Surface Roughness: Morphology Control Through Oxygen Engineering Surface roughness is a critical parameter for TiO₂ films used in optics, semiconductors, and MEMS devices. In the KDF study, roughness was measured for films deposited at constant thickness (450 Å) across all oxygen ratios, revealing a clear trend: **increasing oxygen leads to smoother films.** #### Low O₂ (~9%) → High Roughness (~250 Å) Film grows in a porous, defect-rich structure due to oxygen deficiency and rapid metallic-mode deposition. Beneficial for light-scattering surfaces, diffuse reflectors, and adhesion-enhanced underlayers in multilayer stacks. #### High O₂ (~92%) → Low Roughness (~50 Å) Film transitions to stoichiometric TiO₂ with denser, more uniform network and fewer voids. Required for precision optical coatings, semiconductor interfaces, high-density capacitors, and barrier layers. ![TiO2 surface roughness vs oxygen ratio KDF reactive sputtering results](https://www.kdf.com/wp-content/uploads/2026/04/Tio2-figure-5.jpg) Fig. 5 – Surface roughness as a function of O₂/(Ar+O₂) ratio for TiO₂ films at 450 Å KDF’s Gas Ring and dual upstream/downstream control enable a stable reactive environment across the entire oxygen range – allowing users to tune roughness from 250 Å to 50 Å **simply by adjusting the oxygen fraction**, without changing power, pressure, pallet speed, or thickness. Experimental Results ## Mechanical & Electrical Properties ### Film Stress: Engineering from Compressive to Tensile Film stress plays a significant role in wafer bow, adhesion, cracking, and long-term device reliability. KDF TiO₂ results reveal a smooth transition from **compressive stress at low oxygen** to **tensile stress at high oxygen**: - **Low O₂ (metallic mode)** – higher deposition energy and rapid growth lead to compressive stress. Useful for crack-resistant coatings and films that must withstand thermal cycling. - **Moderate O₂ (transition region)** – densification and limited adatom mobility produce maximum compressive stress. - **High O₂ (poisoned mode)** – lower deposition energy and slower growth allow stress relaxation, shifting the film into mild tensile stress. Preferred for MEMS structures and flexible substrates. ### Sheet Resistance: Stoichiometry-Driven Electrical Control TiO₂’s electrical behavior is governed primarily by oxygen vacancies, which function as donor defects. As oxygen fraction increases, these vacancies are “healed,” producing a more insulating film with higher sheet resistance: #### Low Sheet Resistance (Low O₂) Sub-stoichiometric TiOₓ with high oxygen vacancy concentration increases free-electron density. Suitable for transparent conductive layers, electrodes, sensor contacts, and charge dissipation coatings. #### High Sheet Resistance (High O₂) Near-stoichiometric TiO₂ produces more insulating film. Ideal for dielectric layers, insulating barriers, capacitor dielectrics, and optical stacks requiring electrical isolation. ![TiO2 film stress vs oxygen ratio KDF reactive sputtering](https://www.kdf.com/wp-content/uploads/2026/04/Tio2-figure-6.jpg) Fig. 6 – Film stress as a function of O₂/(Ar+O₂) ratio for TiO₂ films ![TiO2 sheet resistance vs oxygen ratio KDF reactive sputtering](https://www.kdf.com/wp-content/uploads/2026/04/Tio2-figure-7.jpg) Fig. 7 – Sheet resistance as a function of O₂/(Ar+O₂) ratio for TiO₂ films ![TiO2 electrical properties summary KDF reactive sputtering](https://www.kdf.com/wp-content/uploads/2026/04/Tio2-figure-8.jpg) Fig. 8 – Electrical properties summary across the full O₂/(Ar+O₂) range ![TiO2 thin film properties comparison table KDF reactive sputtering](https://www.kdf.com/wp-content/uploads/2026/04/Tio2-figure-9.jpg) Fig. 9 – Summary of TiO₂ thin film properties vs O₂/(Ar+O₂) ratio Summary ## Discussion & Conclusions The results presented in this white paper demonstrate the exceptional capability of KDF reactive sputtering tools to control the physical, optical, mechanical, and electrical properties of TiO₂ thin films. By adjusting only the O₂/(Ar+O₂) ratio – while keeping thickness, pressure, power, and pallet speed constant – KDF systems produce films with dramatically different characteristics. More O₂ → High n · Low Roughness · Low Stress · High Sheet Resistance Less O₂ → Low n · High Roughness · High Stress · Low Sheet Resistance All properties tunable at constant thickness via O₂/(Ar+O₂) ratio adjustment alone This level of control is made possible by four core engineering innovations: - **The KDF Gas Ring** – delivers reactive gas uniformly, minimizes cross-target poisoning - **Dual upstream and downstream gas-control modes** – stable operation across the full reactive regime - **Highly repeatable batch sputtering architecture** – optimized over decades of development - **Stable plasma behavior** – even at high oxygen fractions where competing systems fail **KDF Technologies provides one of the most capable and stable reactive sputtering platforms in the industry.** These results confirm that KDF tools give customers the ability to engineer thin-film properties with precision, repeatability, and confidence – whether for production, research, or advanced device development. ### References 1. M. Mazur, “Analysis of the properties of functional titanium dioxide thin films deposited by pulsed DC magnetron sputtering with various O₂:Ar ratios,” *Optical Materials*, vol. 69, pp. 96-104, 2017. 2. K. A. Jagadish and D. Kekuda, “Exploration of physical properties of DC magnetron sputtered titania thin films,” *Journal of Materials Science: Materials in Electronics*, vol. 35, pp. 2000-2015, 2024. 3. M. R. Hantehzadeh et al., “Physical properties of titanium oxide thin films prepared by DC magnetron sputtering,” *Journal of Fusion Energy*, vol. 32, pp. 622-626, 2013. 4. F. A. Tantray et al., “Effect of oxygen partial pressure on ion beam sputtered TiO₂ thin films,” *Journal of Physics: Conference Series*, vol. 755, 2016. 5. R. G. Korpi et al., “Influence of oxygen partial pressure on RF-sputtered anatase TiO₂ thin films,” *Results in Physics*, vol. 7, pp. 3349-3352, 2017. 6. T. Ogawa et al., “Enhanced photocatalytic activity of TiO₂ thin film by reactive RF sputtering under oxygen-rich conditions,” *Photochem*, vol. 2, pp. 138-149, 2022. 7. H. C. Vasconcelos et al., “Surface Roughness and Fractal Analysis of TiO₂ Thin Films by DC Sputtering,” *Eng. Proc.*, vol. 105, no. 1, 2025. 8. A. Arbabi et al., “Dielectric metasurfaces for complete control of phase and polarization,” *Nature Nanotechnology*, vol. 10, pp. 937-943, 2015. 9. H. A. Macleod, *Thin Film Optical Filters*, 4th ed. CRC Press, 2010. 10. M. Zare et al., “Electrical and Optical Behavior of TiO₂ Thin Films with Varying Oxygen Content,” *J. Phys. Chem. C*, vol. 120, pp. 9017-9027, 2016. Related Systems [900i Series Sputtering System](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) [844i Sputtering System](/products/in-line-products-kdf-technologies/844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) [KDF Sputtering Technology](/products/in-line-products-kdf-technologies/kdf-sputtering-solutions/) [PVD & Sputtering Overview](/products/what-is-pvd-and-sputtering/) Applications [Medical Devices](/products/in-line-products-kdf-technologies/kdf-medical-device-in-line-sputter-coating-technology/) [Photonics & Quantum](/products/in-line-products-kdf-technologies/kdf-laser-diodes-photonics-quantumtechnology/) [Sensors & Monitoring](/products/in-line-products-kdf-technologies/kdf-sensors-and-monitoring/) [Integrated Devices](/products/in-line-products-kdf-technologies/kdf-integrateddevices-components-thin-film-circuits/) Discuss This Technology Need TiO₂ or other reactive oxide films for your application? Our engineers can evaluate your process requirements and recommend the right KDF system configuration. [Request a Consultation →](/contact-us/) [View All Systems →](/products/in-line-products-kdf-technologies/) More Articles [ERPP: ±1% Thin Film Uniformity](/erpp-thin-film-uniformity/) [MRC Heritage & Evolution](/mrc-heritage-and-evolution-honoring-a-legacy-of-innovation-and-sustaining-a-standard-of-excellence/) [Plasma Emission Monitoring](/precision-without-poisoning-plasma-emission-monitoring-in-reactive-sputtering-with-kdf-technologies/) [All News & Insights](/news/) Take the Next Step ## Ready to Engineer *Precise Thin Films* for Your Application? KDF’s reactive sputtering platforms give you complete control over TiO₂ and other functional oxide, nitride, and compound films. Contact our team to discuss your process requirements. [Contact KDF →](/contact-us/) [View Our Systems →](/products/in-line-products-kdf-technologies/) --- ### [Metallic And Silver Filled Epoxy Bonding](https://www.kdf.com/products/process-materials/metallic-and-silver-filled-epoxy-bonding/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Process Materials · KDF Technologies # Metallic & Silver-Filled Epoxy Bonding KDF incorporates proprietary metallic and silver-filled epoxy bonding techniques to guarantee the highest thermal conductivity, electrical properties, and adhesive characteristics – with a pre-bond sputtered barrier layer for maximum adhesion and diffusion resistance. [Request a Quote →](/contact-us/) [Backing Plates](/products/original-oem-parts/backing-plates/) KDF Bonding Capabilities -Metallic Epoxy Bonding -Silver-Filled Epoxy Bonding -Indium & Indium Alloy Bonding -Picture Frame Bonding (SiO₂, Pyrex, ITO) -Sputtered barrier layer pre-treatment -Void-free & defect-free – full inspection Overview ## Proprietary Bonding for Maximum Performance KDF incorporates proprietary **metallic and silver-filled epoxy bonding techniques** to guarantee that the highest thermal conductivity, electrical properties, and adhesive characteristics are achieved in every target-to-backing-plate assembly. Prior to bonding, targets are **sputtered with a protective barrier layer** to prevent material diffusion and to increase target surface adhesion – ensuring a bond that maintains integrity through the thermal cycling and power demands of production sputtering. KDF enjoys a highly regarded reputation for **void-free and defect-free bonding**. Each assembly is individually inspected and properly packaged to ensure all customer requirements are satisfied before shipment. KDF also offers **indium and indium alloy bonding** for high-power applications, as well as picture frame bonding for fragile materials like SiO₂, Pyrex, and ITO where conventional bonding methods would compromise target integrity. Why It Matters ## Why Bonding Quality Matters A poor bond between target and backing plate is one of the most common causes of process instability, premature target failure, and unplanned system downtime in production sputtering. Voids in the bond line reduce thermal conductivity, causing hot spots that can crack or delaminate the target during deposition. ⟶ Thermal Management Silver-filled and metallic epoxies provide high thermal conductivity – efficiently transferring heat from the target to the water-cooled backing plate during high-power sputtering. ⟶ Electrical Conductivity Metallic fillers maintain electrical continuity between target and cathode – critical for stable DC and RF sputtering plasma and consistent power delivery to the target. ⟶ CTE Mismatch Tolerance Epoxy bonding accommodates highly dissimilar coefficients of thermal expansion between target and backing plate materials – preventing delamination through repeated thermal cycles. ⟶ Barrier Layer Pre-Treatment KDF’s pre-bond sputtered barrier layer prevents material diffusion across the bond interface and dramatically increases surface adhesion – extending bond life in demanding production environments. Bonding Methods ## All Bonding Methods Available ### Silver-Filled Epoxy KDF’s primary bonding method for most target-to-backing-plate assemblies. Silver-filled epoxy provides excellent thermal and electrical conductivity combined with strong adhesive properties and CTE tolerance. Best for: Most metallic and compound targets with moderate to high power requirements. ### Indium & Indium Alloy Develops the highest-strength bond with superior thermal transfer – the preferred method for high-power sputtering and thermally demanding processes. Indium alloys extend the operating temperature range. Best for: High-power applications, precious metals, and thermally challenging target materials. ### Metallic Epoxy Metallic filler epoxies provide both good conductivity and the ability to bond materials with highly dissimilar coefficients of thermal expansion – where pure indium bonding would be mechanically unsuitable. Best for: Dissimilar CTE pairings, compound targets, and applications requiring reworkable bonds. ### Picture Frame Bonding Specialized technique for brittle and fragile target materials. The picture frame bond distributes stress around the perimeter of the target rather than across the full face – preventing cracking of brittle dielectric and oxide targets. Best for: SiO₂, Pyrex, ITO, Al₂O₃, and other brittle ceramic or oxide targets. Process ## KDF’s Bonding Process 01 ### Surface Prep Target and backing plate surfaces are precision cleaned and prepared 02 ### Barrier Layer Protective layer sputtered onto target to prevent diffusion and enhance adhesion 03 ### Bonding Epoxy or indium bond applied using KDF’s proprietary controlled process 04 ### Inspection Full visual and dimensional inspection – every assembly verified void-free and defect-free 05 ### Packaging Properly packaged to preserve assembly integrity and purity during shipping and storage Process Materials ## Also Available from KDF [ Process Materials Sputtering Targets View → ](/products/process-materials/sputtering-targets/) [ Process Materials Backing Plates View → ](/products/process-materials/backing-plates/) [ OEM Parts OEM Sputtering Targets View → ](/products/original-oem-parts/sputtering-targets/) [ OEM Parts MRC Style Backing Plates View → ](/products/original-oem-parts/backing-plates/) Get in Touch ## Need Bonding for Your Sputtering Targets? Contact KDF with your target material, geometry, and backing plate specification. We’ll recommend the right bonding method and provide a fast quote. [Request a Quote →](/contact-us/) [Process Materials](/products/process-materials/) --- ### [Process Materials](https://www.kdf.com/products/process-materials/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** KDF Technologies · A Kurt J. Lesker Company # Process *Materials* for PVD & Thin Film Deposition KDF develops thin film material processes and product enhancements to increase yields, improve surface conditions, and maximize target utilization – all while lowering your material cost of ownership. From high-purity sputtering targets to precision bonding services, everything your process needs in one place. [Request Materials & Pricing →](/contact-us/) [View Sputtering Targets](/products/process-materials/sputtering-targets/) Process Materials at a Glance 60% Upsilon Inset™ Target Utilization 3 Material Categories: Targets, Plates, Bonding OEM Shipped with Full QC Documentation KJLC Backed by Kurt J. Lesker Company Global Materials What We Offer ## Three Material *Categories* KDF offers a complete suite of process materials for PVD sputtering applications – targets, backing plates, and bonding services, all manufactured to specification and shipped with full quality documentation. 01 ### Sputtering Targets High purity metals, alloys, non-metallic materials, and cermets in a wide range of geometries – including KDF’s proprietary Upsilon Inset™ targets for up to 60% utilization of precious metals like Au, Pt, Pd, and Ag. Planar, circular, rectangular, Upsilon™, conical, ring, delta, and custom geometries. Production and R&D quantities. Full QC documentation with every order. [View Sputtering Targets →](/products/process-materials/sputtering-targets/) 02 ### Backing Plates KDF holds all manufacturing rights to MRC style backing plates and stocks them for immediate delivery. Custom manufactured backing plates available for unique system requirements. Manufactured on NC equipment to original specifications – dimensional tolerances and absolute reproducibility guaranteed. Available in stainless steel, copper, and a wide variety of materials for unique applications. Compatible with all KDF and MRC cathode configurations. [View Backing Plates →](/products/process-materials/backing-plates/) 03 ### Bonding Services KDF incorporates proprietary metallic and silver-filled epoxy bonding techniques to guarantee the highest thermal conductivity, electrical properties, and adhesive characteristics – with a pre-bond sputtered barrier layer for maximum adhesion and diffusion resistance. Indium, epoxy, and picture frame bonding (SiO₂, Pyrex, ITO). KDF is renowned for void-free, defect-free bonding with individual inspection on every assembly. [View Bonding Services →](/products/process-materials/metallic-and-silver-filled-epoxy-bonding/) Full Material Coverage ## Materials for Every *PVD Application* Precious Metals AuPtPd AgIrRhRu Metals & Alloys TiTiWCr TaWMo AlCuNi NiCrZrGe Compounds, Oxides & TCOs TiNTaNSiO₂ Al₂O₃ITOZnO TiO₂MoSi₂DLC ZrO₂TiAlN KDF Proprietary Technology ## Upsilon Inset™ Targets – *Up to 60% Utilization* KDF’s patented **Upsilon Inset™ cathode** uses a novel Υ-shaped (upsilon) target geometry engineered specifically for high thermal conductivity, high-value materials. It delivers up to **60% target utilization** – more than twice the 20-30% typical of standard planar targets. For precious metals like Gold (Au), Platinum (Pt), Palladium (Pd), and Silver (Ag) – where material cost is a significant production expense – the Upsilon Inset™ target can reduce material cost per wafer by more than half. This is a patented KDF design, available exclusively from KDF Technologies. **Upsilon Inset™ targets are sole KDF intellectual property** – a patented geometry not available from any other supplier, including aftermarket target manufacturers. - **Au, Pt, Pd, Ag** – precious metal targets optimized for the Upsilon Inset™ cathode - Engineered for **high thermal conductivity** – essential for precious metal sputtering stability - Dramatically **reduces cost per wafer** for medical, photonic, and semiconductor applications - Available exclusively from KDF – **patented IP**, not replicable by any other supplier [View All Sputtering Targets →](/products/process-materials/sputtering-targets/) [Request Upsilon Pricing](/contact-us/) Υ Upsilon Inset™ Target – KDF Proprietary Geometry 60% Target Utilization 2× vs. Standard Planar Au Pt · Pd · Ag OEM Patented – KDF Only Engineering Depth ## R&D, Process Development & *Characterization* KDF has a group of skilled engineers and scientists with vast knowledge of the physical vapor deposition (PVD) process and the tools used in today’s marketplace. KDF has the talents and tools to deposit and characterize – with high precision – various films ranging in thickness from a few angstroms to hundreds of microns. The R&D team at KDF carries diversified experience in all areas of thin film engineering, device fabrication, process development and characterization, and process integration. This depth is what allows KDF to offer process development services alongside materials supply – not just materials, but the expertise to make them work. [Thin Film Coating Services →](/products/services-inline-sputtering-systems/thin-film-services-kdf-electronics/) Capabilities ## What KDF’s Materials Team Delivers #### Target Stocking Programs KDF can develop and implement a target stocking program using JIT techniques – minimizing inventory investment while maximizing production capability and eliminating downtime from stock-outs. #### Production & R&D Quantities KDF’s facility is configured for both high-volume production and small research quantities at competitive pricing – from full production runs to single-target R&D orders. #### Full QC Documentation Every target ships with Certificate of Conformance, material purity certificate, and MSDS where required. Packaged under vacuum or inert gas as required by the material. #### Material Processing Techniques Vacuum induction melting, hot/cold isostatic pressing, vacuum hot pressing, electron beam melting, and CNC machining – ensuring density, purity, and dimensional accuracy. A Kurt J. Lesker Company ## Need a Broader Range of *Deposition Materials?* KDF Technologies is a Kurt J. Lesker Company – giving KDF customers access to one of the world’s most extensive catalogs of deposition materials and evaporation sources. The KJLC Materials Division serves research institutions, universities, and production facilities worldwide with thousands of materials in every form factor imaginable. Whether you need materials for a system KDF doesn’t serve, evaporation sources for e-beam or thermal processes, or specialty compounds not stocked by KDF directly – the Kurt J. Lesker Company’s Materials Division is the natural extension of your KDF materials supply relationship. KJLC also offers a **Precious Metals Reclaim Service** – recovering value from spent sputtering targets, shields, and deposition chamber components containing Au, Pt, Pd, Ag, Ir, Rh, and Ru. [Browse KJLC Materials Division →](https://www.lesker.com/materials/) [Precious Metals Reclaim ↗](https://www.lesker.com/newweb/deposition_materials/depositionmaterials_reclaim_2.cfm?pgid=0) Kurt J. Lesker Company Materials That Enable Technology Sputtering Targets – 3,000+ materials [Visit →](https://www.lesker.com/materials-division.cfm?section=sputtering-targets) Evaporation Materials – pellets, rods, wire, foil [Visit →](https://www.lesker.com/materials-division.cfm?section=evaporation-materials) Evaporation Sources & Crucibles [Visit →](https://www.lesker.com/evaporation-sources.cfm) Target Bonding & Backing Plates [Visit →](https://www.lesker.com/materials-division.cfm?section=target-bonding) Precious Metals Reclaim Service [Visit →](https://www.lesker.com/newweb/deposition_materials/depositionmaterials_reclaim_2.cfm?pgid=0) TORUS® Magnetron Sputtering Cathodes [Visit →](https://www.lesker.com/thinfilmdepositionsystemcomponents.cfm?section=torusmagnetronsputteringcathodes) Applications ## Materials for Every *KDF Application* KDF process materials support thin film production across the full range of KDF’s application markets – from photonics and medical devices to wear coatings and sensors. [ Hermetic Sealing View → ](/products/in-line-products-kdf-technologies/kdf-hermetic-sealing-feedthroughs/) [ Integrated Passive Devices View → ](/products/in-line-products-kdf-technologies/kdf-integrateddevices-components-thin-film-circuits/) [ Laser Diodes & Photonics View → ](/products/in-line-products-kdf-technologies/kdf-laser-diodes-photonics-quantumtechnology/) [ Medical Devices View → ](/products/in-line-products-kdf-technologies/kdf-medical-device-in-line-sputter-coating-technology/) [ Sensors & Monitoring View → ](/products/in-line-products-kdf-technologies/kdf-sensors-and-monitoring/) [ Wear Coatings & DLC View → ](/products/in-line-products-kdf-technologies/kdf-wear-coatings/) Get in Touch ## Need Process Materials for Your KDF System? Contact KDF with your material, geometry, and quantity requirements. We’ll confirm availability, compatibility, and pricing – including Upsilon Inset™ targets for precious metal applications and bonding services for your assemblies. [Request Materials & Pricing →](/contact-us/) [Browse KJLC Materials ↗](https://www.lesker.com/materials/) --- ### [Retrofit Kits](https://www.kdf.com/products/original-oem-parts/retrofit-kits/) **Published:** November 10, 2022 **Author:** Vishal Agrawal **Content:** ## Retrofit Kits ## KDF – the “original” OEM KDF offers a wide variety of retrofit kits that will extend the life of your existing manufacturing capabilities. KDF can help you with every aspect of your manufacturing process by supplying upgrades and retrofit kits Some of these include the following: - Network replacement kit - Gas measurement upgrade - DC power conversion upgrade - Low pressure hydraulic upgrade - Rough line upgradet - Vacuum controller upgrade - Scan controller retrofit - Cathode retrofits Network Replacement Kit advantage is to increase the reliability of your system. KDF’s efficient design and use of water cooled hi-power vacuum relays permits excellent RF/DC power transfers. KDF’s new exclusive high reliability tuning network design provides network to computer interface with direct control switching. Toggle switches allow RF/DC switchable operation. Gas Measurement Upgrade advantage is to increase repeatability of the system. The BMV-100 is replaced due to the fact that it requires frequent calibration in order to read the correct type of gas. If not calibrated it can send readouts off by more than 50%, also mixed gas will not be read accurately without the preset of emissions. PV-10 can also be replaced to improve pressure control. DC Power Conversion Upgrade advantage is to increase the repeatability, serviceability and uptime of the system. By replacing the existing obsolete Vectrol power supply with a rack mount power supply, repeatability is increased due to better closed loop control. Serviceability of the power supply is increased due to the front panel controls. Uptime is increased due to arc suppression circuitry and improved self protection. ## In line with your process KDF carries a full line of parts for your KDF or MRC system. All our parts are manufactured from the original MRC documentation located and maintained at KDF. With our large inventory we are able to deliver the exact and correctly engineered replacement parts for all MRC and KDF equipment typically within days of your order. We maintain working stock room with thousands of parts valued over 2 million dollars. KDF and its engineering department are always investigating ways to update and improve older designs for better system reliability, as well as finding replacement parts for obsolete components. Do not be fooled by third party pirated parts, stay with KDF and get the correct part the first time. KDF supplies replacement parts, retrofit kits, backing plates, target materials and bonding services for MRC and KDF sputtering and etch systems. ![Retrofit Kits](https://www.kdf.com/wp-content/uploads/2022/11/image-001-1.jpg "image-001") #### KDF In-Line System Upgrade Kits System Enhancements Low Pressure Hydraulic Upgrade advantage is to improve uptime and increase reliability. By replacing your existing hydraulic power pack with this improved low-pressure power pack you can help to prevent costly load-lock seal plate crashes. (600/900) Rough Line Upgrade advantage is to improve serviceability and replace old leaking valves. By replacing your existing rough lines that contain obsolete Airco valves with KDF stainless steel rough lines that contain easily removable valves for easy maintenance you are making your system more serviceable and extending the life of your system. (600/900) Pressure Controller Upgrade advantage is to increase the reliability and serviceability of your system. This upgrade involves replacement of your existing controller. The new controller features digital readout and easier selected set points, which will provide more accurate pressure control and improved reliability. Also the rugged design provides for more rapid pump-down response and stable operation. (800/900M) Scan Motor Retrofit advantage is to retain the repeatability of your system. This upgrade involves replacing the obsolete scan drive motor assembly with a more readily available reliable motor. (600/900) Versa Vac Controller is a weak link in the system that suffers frequent failures. This obsolete product can be replaced by acurrent supportable model vacuum gauge controller. (600/900) All KDF kits can be customer installed or you can have KDF Service Department install them for you KDF offers a wide variety of cathode retrofits that will enable you to utilize your system for different processes: #### Inset Cathode™ - Chi for soft metals - Mu for brittle metals - Upsilon for precious metals #### Magterial Cathode™ - For magnetic alloys and ferrous materials #### Mark II™ Cathode - For dielectric materials #### LMM™ Cathode (ix systems only) - Contact sales department for specifications, benefits and applications. ![Retrofit Kits](https://www.kdf.com/wp-content/uploads/2022/11/image-002-1.jpg "image-002") [DOWNLOAD PDF](/wp-content/uploads/2022/11/Retrofit-Kits.pdf) ## Have questions?[ Contact KDF](/contact-us/ ) about the Retrofit kits --- ### [PLC Retrofit Kit](https://www.kdf.com/products/original-oem-parts/plc-retrofit-kit/) **Published:** November 10, 2022 **Author:** Vishal Agrawal **Content:** ## PLC-Retrofit ## PLC Retrofit Kit KDF now offers PLC upgrade kits for existing T, GT and NT systems equipped with Brooks/Techware controllers. This upgrade follows KDF’s OEM policy of ‘No Tool Left Behind’ and replaces the no longer available Brooks/Techware controller with our new KDF i controller. The new i controller utilizes Rockwell Automation Programmable Controller coupled with an industrial rugged mini PC running Windows 10 for application graphics. The new i controller utilizes Ethernet Field Bus technology for simplification and speed. Discrete I/O is handled through a combination of digital input/output and analog modules. Most system option functions are pre-hard wired for future expandability. The digital output modules have electronic circuit fuse protection. The i controller package also includes serial device servers which couple the serial communication devices to the PLC via Ethernet IP protocol. For NT, GT and T systems the new system interface includes an 22″ touch screen LCD monitor and rack-mounted keyboard with integrated touch pad. An UPS is also supplied to insure an orderly shut down of the system computer in case of an unexpected power outage. Pneumatic operation is controlled through a new DIN rail mounted Ethernet operated air package. Air package is comprised of multiple solenoids in various configurations with room for optional expandability at future date. All pneumatic sensor switches communicate directly with the pneumatic package and PLC feedback via Ethernet for simplification of cable routing. Once upgraded to the new i controller your system will have the capability for realtime software downloads and diagnostic help via WebEx or GoToAssist over the Internet. ## In line with your process KDF carries a full line of parts for your KDF or MRC system. All our parts are manufactured from the original MRC documentation located and maintained at KDF. With our large inventory we are able to deliver the exact and correctly engineered replacement parts for all MRC and KDF equipment typically within days of your order. We maintain working stock room with thousands of parts valued over 2 million dollars. KDF and its engineering department are always investigating ways to update and improve older designs for better system reliability, as well as finding replacement parts for obsolete components. Do not be fooled by third party pirated parts, stay with KDF and get the correct part the first time. KDF supplies replacement parts, retrofit kits, backing plates, target materials and bonding services for MRC and KDF sputtering and etch systems ![PLC Retrofit kit](https://www.kdf.com/wp-content/uploads/2022/11/image-000-1-scaled.jpg "image-000") #### KDF External Support Program The KDF WebEx or GoToAssist based support program includes: - Realtime access to KDF software enhancements - Realtime access to KDF software upgrades - KDF handles all remote software connection charges associated with this program. All you need is an internet connection on site - KDF system monitoring (as requested) for diagnosis of potential problems and threats before they become a system issue - KDF online live diagnostic help (as requested) to resolve system problems The KDF i controller has the same footprint as the Brooks/Techware controller and interconnect panel. Replacement components are installed into your existing tower frame. Installation time on a typical NT or GT system is 3 days on-site thus minimizing system downtime. Upgrade of T systems might take slightly longer time and it is based on the original system configuration. #### Additional upgrade features - GP “smart” 390 and MKS 925 serial communication vacuum gauges - Ethernet I/P protocol pneumati air package with all new air lines - VAT throttling gate valve/controller allowing for upstream and downstream pressure contro - Load-lock cylinder with linear transducer for increased accuracy The new KDF i controller installations are shown below. ![Old NT Techware controller tower](https://www.kdf.com/wp-content/uploads/2022/11/image-003-scaled.jpg "image-003") Old NT Techware controller tower ![New KDF i controller tower](https://www.kdf.com/wp-content/uploads/2022/11/image-005.jpg "image-005") New KDF i controller tower ![Old GT controller tower](https://www.kdf.com/wp-content/uploads/2022/11/image-002-2-scaled.jpg "image-002") Old NT Techware controller tower ![New KDF i controller towe](https://www.kdf.com/wp-content/uploads/2022/11/image-004-scaled.jpg "image-004") New KDF i controller towe [DOWNLOAD PDF](/wp-content/uploads/2022/11/PLC-Retrofit-HR.pdf) ## Have questions?[ Contact KDF](/contact-us/ ) PLC Retrofit Kit --- ### [Backing plates](https://www.kdf.com/products/original-oem-parts/backing-plates/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** ## MRC Style Backing Plates ### PRODUCT ## KDF hold all rights manufacturing rights to MRC style backing plates, and stocks all MRC backing plates for immediate delivery requirements. Custom manufactured backing plates can be manufactured to meet individual customer requirements and system specifications. KDF is constantly making improvements and design changes to enhance and improve the performance of these products. #### Backing Plates In all cases, the backing plates are manufactured on numerically controlled (NC) equipment to the original specifications guaranteeing the required dimensional tolerances and absolute reproducibility. KDF is the original OEM for its “X-series”™,744 and 844 backing plates. ## In line with your process KDF carries a full line of parts for your KDF or MRC system. All our parts are manufactured from the original MRC documentation located and maintained at KDF. With our large inventory we are able to deliver the exact and correctly engineered replacement parts for all MRC and KDF equipment typically within days of your order. We maintain a working stock room with thousands of parts valued at over 2 million dollars. KDF and its engineering department are always investigating ways to update and improve older designs for increased system reliability, as well as finding replacement parts for obsolete components. Do not be fooled by third party pirated parts, stay with KDF and get the correct part the first time. KDF supplies replacement parts, retrofit kits, backing plates, target materials and bonding services for MRC and KDF sputtering and etch systems. ![Sputtering Targets](https://www.kdf.com/wp-content/uploads/2022/11/image-000.jpg "image-000") ## Sputtering Targets KDF offers a large selection of high purity metals, alloys, non-metallic and cermets for virtually every sputtering application in the industry. KDF’s facility is configured to manufacture production quantities of these materials, but it is also capable of small quantities for research applications at competitive prices. This manufacturing flexibility demonstrates KDF’s commitment to actively anticipating and meeting the needs of its customers. High purity sputtering targets are available in a variety of geometries, including planar, circular, conical, rectangular, ring, delta and custom configurations. KDF incorporates material processing techniques that include: - Vacuum induction melting - Vacuum / inert hot pressing - Hot / cold isostatic pressing - Electron beam melting - Computer controlled machining KDF supplies Chi, Mu, Muset (one piece) and Upsilon Inset Cathode™ target materials in a wide variety of types. In addition KDF supplies conversion kits that enable you to convert your existing Inset Cathode™ configuration from one style to another. ## Evaporation Materials High purity evaporation materials are available in the following forms: - Pellet - Rod - Tablet - Slug - Granular - Cone - Powder - Wire - Foil ## Sputtering Cathodes KDF holds it core competance to be in cathode development and has designed and enhanced an array of cathode styles to meet a multitude of process needs. Cathode styles include KDF’s exclusive Inset cathode™ with its newly enhanced cooling specifically designed for today’s hi rate processes. The Magterial™ for sputtering ferrous materials at high rates and uniformities. The patented LMM™ linear moving magnetron for full-face erosion and low particulate applications. The patent pending G12™ rotating magnetron cathode for full-face erosion and high uniformity. KDF’s 17″ x Series offers enhanced pallet uniformity over the std 15″ length, and offers the full family of cathodes in 24 and 30 designs as well. ## Backing Plates KDF holds all manufacturing rights to MRC style backing plates, and stocks all MRC backing plates for immediate delivery. Custom backing plates can be manufactured to meet individual customer requirements and system specifications. KDF is constantly making improvements and design changes to enhance and improve the performance of these products. KDF is the original OEM for its i Series, ix Series, NTX, 744 and 844 backing plates. ## Bonding KDF utilizes a variety of sputtering techniques to bond targets to various backing plates. Indium and indium alloys are used to develop a high strength bond and insure the thermal transfer and conduction needed for today’s high powered sputtering systems. ![image](/wp-content/uploads/2022/11/image-001-2.jpg) Epoxy bonding along with indium and indium alloys allows KDF the ability to bond targets with highly dissimilar coefficients of thermal expansion. KDF enjoys a highly regarded reputation for void free and defect free bonding. Picture frame bonding for SiO2 , Pyrex and ITO is also available. Each backing plate, target and assembly is inspected and properly packaged to assure that customer requirements are satisfied. ## Stocking KDF can help you to develop and implement a target stocking program that will enable you to keep your production needs running in a smooth and orderly fashion, utilizing JIT techniques to minimize your inventory investment while maximizing your production capabilities. [DOWNLOAD PDF](/wp-content/uploads/2022/11/Target-Backing-Plates.pdf) ## Need a quote?[ Contact KDF](/contact-us/ ) about Backing Plates --- ### [Sputtering Cathodes](https://www.kdf.com/products/original-oem-parts/sputtering-cathodes/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** ## Sputtering Cathodes ### PRODUCT ## KDF Cathode Technology KDF has an active ongoing cathode development program encompassing theoretical simulation, mechanical design, empirical measurements and process testing on actual tools. All existing cathodes have been theoretically modeled using a sophisticated simulation package, as well as magnetically mapped and process-tested. New cathode designs will be available shortly which improve uniformity and target utilization. #### LMM™ – Linear Moving Magnet Cathode: The linear moving magnet sputter cathode, LMM™ a recently patented full face erosion rectangular design is available for all KDF systems. The advanced design of the LMM™ allows for both RF + DC operation. The LMM™ offers high material utilization with minimized re-deposition resulting in reduced particulates. The LMM™ enhanced design advances the capability to work in DC pulse reactive sputter mode with all materials. A Magterial™ version of the LMM™ is available providing the ultimate in utilization and lifetime when sputtering magnetic materials such as Nickel. #### Mark II™: Formerly a MRC cathode, KDF has since tuned and perfected this magnetron cathode which is ideally used for dielectric materials such as SiO2, or for reactive depositions of materials such as indium-tin oxide. #### Mark III™: KDF’s second-generation cathode has an improved magnet design for better uniformity and longer lifetime compared to the Mark II. #### X Series™: Now KDF’s most popular systems 600 and 900 series systems can have this new series of KDF cathodes, which have been lengthened from 15 inches to 17 inches, offering, improved uniformity over the entire pallet. The X Series cathodes are available in Planar, Inset™ and Magterial™ cathode form. #### Inset Cathode™: Since KDF’s purchase of MRC’s batch business in 1998 KDF has made many improvements to the original Inset design for high uniformity and high utilization of material. KDF has also created new Inset Cathodes™ that have increased sizes for the standard batch tools. The KDF 744 and 844 tools have Inset Cathodes™ up to 30.5 inches in length. The clamped material design can accommodate most metal and all precious metal types. #### Focest Cathode™: This was originally developed for Al deep trench fill. It offers great uniformity, rate and material utilization as well. This cathode has special applications in the 600/900 system family. #### Magterial Cathode™: This planar-type cathode allows magnetron sputtering of ferrous metals such as nickel and iron at high rates and high uniformities. The cathode field strength is high enough to allow use of quarter- inch thick bonded magnetic targets, thus providing a relatively long target life for these materials. KDF is the only Inline system manufacturer that designs their own cathodes for our complete product line, from the standard 5 by 15 to our enhanced 5 by 17 cathodes all the way to our 844 cathodes which are 5 b7 30 inch. #### Magterial Cathode™: This planar-type cathode allows magnetron sputtering of ferrous metals such as nickel and iron at high rates and high uniformities. The cathode field strength is high enough to allow use of quarter- inch thick bonded magnetic targets, thus providing a relatively long target life for these materials. KDF is the only Inline system manufacturer that designs their own cathodes for our complete product line, from the standard 5 by 15 to our enhanced 5 by 17 cathodes all the way to our 844 cathodes which are 5 b7 30 inch. ## KDF does not depend on third party copy cat designs we produce some of the best cathodes in the world and we have the results to prove it. Process dependability comes from strong designs. The cathode is the critical part of your sputtering tool and therefore choosing the right one is also critical . KDF has a host of cathodes that are application dependant so that every specific requirement of an application can be met. ## Have questions?[ Contact KDF](/contact-us/ ) about Sputtering Cathodes --- ### [KDF In-Line Spare Parts Kit](https://www.kdf.com/products/original-oem-parts/kdf-in-line-spare-parts-kits/) **Published:** September 29, 2022 **Author:** Vishal Agrawal **Content:** ## KDF In-Line Spare Parts Kit ### KDF IN-LINE SPARE PARTS KITS KDF has developed recommended spare part kits: These kits enable your maintenance department to minimize downtime for preventive maintenance and enable production to suffer a minimum of downtime due to not having the right part at the right time. These kits are machine generic and can be modified to reflect your individual need, and carry with them a significant discount if purchased as a kit versus individual parts. Kits for KDF/MRC 600 and 900 as well as kits for KDF 700 and 800 systems include: - Spare shield set - Spare PC Boards - Spare Chambers parts - Spare Vacuum parts - Spare heats parts - Hardware kits - Custom Pallets - Spare Scan parts - Comprehensive Recommended Spares In addition to the various kits KDF also offers a wide variety (several hundred) of pallets, with materials ranging from Stainless Steel, Aluminum, Copper and Titanium. for use in MRC/KDF systems. KDF also offers a “swap” generator program which will enable you to continue running while your generator is out for repair. We can ship you a replacement generator same day as requested for you to use until yours is repaired. ## In line with your process KDF carries a full line of parts for your KDF or MRC system. All our parts are manufactured from the original MRC documentation located and maintained at KDF. With our large inventory we are able to deliver the exact and correctly engineered replacement parts for all MRC and KDF equipment typically within days of your order. We maintain working stock room with thousands of parts valued over 2 million dollars. KDF and its engineering department are always investigating ways to update and improve older designs for better system reliability, as well as finding replacement parts for obsolete components. Do not be fooled by third party pirated parts, stay with KDF and get the correct part the first time. KDF supplies replacement parts, retrofit kits, backing plates, target materials and bonding services for MRC and KDF sputtering and etch systems. ![spare part](https://www.kdf.com/wp-content/uploads/2022/11/image-001.jpg "image-001")## KDF – the “original” OEM #### There are three major categories for parts: - Consumables - Replacement parts - Electrical assemblies #### KDF has parts available for these models: - 822, 8620, 8667, 8671, 8800 - BMC-600 - Aries - KDF 600 Series - KDF 700 Series - KDF 800 Series - KDF 900 Series #### Consumables: Shields, o-rings, bearings, heat lamps, magnets (for all cathode types), ion tubes, and TC’s, KDF proprietary lubricant and drive chains. #### Replacement Parts: Inset Cathode™, Upsilon, Mu, Chi and Focest Cathode™. Also Planar, Mark II™, Magterial™, QSet cathodes\*. All bellows, gearlock seals, feed throughs (ferro fluidic), pallet carriers, shutter carriers and plates. RF networks, solenoids, relays, cryo pumps, compressors, grippers, gate valves, hydraulic pumps, manifold valves and cylinders, air packages, etch hoist and etch platform assemblies, stainless steel roughing lines view ports, Pyrex collars. \* All cathodes are the sole property of KDF. KDF owns all rights and intellectual property associated with these cathodes #### Electrical Assemblies: Printed circuit boards, RF generators, flow control valves, gas flow controllers, power supplies, (RF and DC), computer boards and I/O cards, analog racks and pressure gauges. #### KDF In-Line Spare Parts Kits KDF has developed recommended spare part kits. These kits enable your maintenance department to minimize downtime for preventive maintenance and enable production to suffer minimum of downtime due to not having the right part at the right time. These kits are machine generic and can be modified to reflect your individual needs, and carry with them significant discount if purchased as a kit versus individual parts. #### Kits for KDF/MRC 600 and 900 as well as for KDF 700 and 800 systems include: - Spare shield set - Spare PC boards. - Spare O-ring kit - Spare chambers parts - Spare vacuum parts - Spare heats parts - Hardware kits - Spare scan parts - Comprehensive recommended spares KDF also offers a variety of conversion kits allowing you to convert your Inset™ cathode from existing configuration (Chi, Mu, Upsilon) to any other configuration (Chi, Mu, Upsilon) that will suit your needs. ![spar parts](https://www.kdf.com/wp-content/uploads/2022/11/image-002.jpg "image-002")In addition to the various kits KDF also offers a wide variety (several hundred) of pallets, with materials ranging from Stainless Steel, Aluminum, Copper, and Titanium, for use in KDF/MRC systems. KDF engineering department is available to help your company with its special pallet requirements as well. These custom pallets are designed to accommodate any / all substrate sizes and shapes. KDF also offers a “swap” generator program which will enable you to continue running while your generator is out for repair. We can ship you a replacement generator same day as requested for you to use until yours is repaired. Repairs typically take one week. KDF maintains thousands of parts valued at over 4 million dollars in active stock. Most orders ship the same day [DOWNLOAD PDF](/wp-content/uploads/2022/11/Spare-Parts.pdf) ## Have questions?[ Contact KDF ](/contact-us/ )about In-line Spare Parts. --- ### [Techware Replacement Kits](https://www.kdf.com/products/original-oem-parts/kdf-upgrade-kits-mrc-upgrade-kits/techware-replacement-kits/) **Published:** September 29, 2022 **Author:** Vishal Agrawal **Content:** Techware Replacement Kits KDF UPGRADE KITS Techware Replacement Kits - Techware replacement kit for T systems Replaces obsolete Techware computer along with DC and RF power supplies, scan motor, vacuum and pressure measuring devices, along with complete cable kit.. ![image](/wp-content/uploads/2022/09/Techware-replacement-kit-for-T-systems.jpg) - Techware replacement kit for GT systems Replaces obsolete Techware computer along with support components. - Techware replacement kit for NT systems Replaces obsolete Techware computer and NT PC along with support components. - System upgrade kit for i / ix systems Upgrades the Windows 7 based control computer to Windows 10 based control computer. [View PLC Retrofit Kits](/wp-content/uploads/2022/09/PLC-Retrofit-HR-1.pdf) Particularly popular - Load lock linear transducer replacement kit Replaces mechanical switches and hydraulic cylinder with an integrated linear transducer increases the accuracy of the L/L exchange positions as well as creating a more limited fail safe for a lost position. ![image](/wp-content/uploads/2022/09/Load-lock-linear-transducer-replacement-kit.jpg) - MKS 146 gauge replacement kit Replaces obsolete 146 gauges with MKS Smart 999 and 925 along with a VAT throttling gate valve for more precise position and pressure controlling. [QUICK QUOTE]() Have questions?[ Contact KDF]() about the Upgrade Kits --- ### [MRC Upgrade Kits](https://www.kdf.com/products/original-oem-parts/kdf-upgrade-kits-mrc-upgrade-kits/mrc-upgrade-kits/) **Published:** September 29, 2022 **Author:** Vishal Agrawal **Content:** MRC Upgrade Kits MRC UPGRADE KITS MRC In-line Systems Upgrade Kits System Enhancements KDF offers a wide variety of retrofit kits that will extend the life of your existing manufacturing capabilities. KDF can help you with every aspect of your manufacturing process by supplying upgrades and retrofit kits. ![image](/wp-content/uploads/2022/09/mrc-upgradekits1.jpg) Some of these include the following: - - Network Replacement Kit Eliminate the MRC super switch, reduces maintenance and improve operation. - Gas Measurement Upgrade Increase repeatability. - DC Power Conversion Upgrade Increase repeatability. Reliability and uptime. - Low Pressure Hydraulic Upgrade Improve uptime and reliability. - Rough Line Upgrade Improve serviceability, and replace obsolete valves. - Pressure Controller Upgrade Increase reliability and serviceability. - Scan Controller Retrofit Retain repeatability, and replace obsolete motor - Cathode Retrofits Retain repeatability, and replace obsolete motor - New From KDF 900 System Cathode Removal and Insertion Tool Save your Back! Tool is designed to work on any of the KDF/MRC 900 family of systems including 902-903-942-943-954-974. Tool will work with all cathode types and all sizes 15-17-24. [Quick Quote]() Have questions?[ Contact KDF]() about the MRC Upgrade Kits --- ### [KDF Upgrade Kits](https://www.kdf.com/products/original-oem-parts/kdf-upgrade-kits-mrc-upgrade-kits/) **Published:** September 29, 2022 **Author:** Vishal Agrawal **Content:** Original OEM Parts · KDF Technologies # KDF & MRC *Upgrade Kits* KDF is committed to delivering quality upgrade kits that extend system life, modernize controls, and improve process performance across both KDF and legacy MRC sputtering platforms – engineered by the original manufacturer. [Request a Quote →](/contact-us/) [All OEM Parts](/products/original-oem-parts/) Two Kit Families Available KDF Upgrade Kits – for KDF T, GT, NT, and i/ix series systems MRC Upgrade Kits – for legacy MRC 903 and 943 series platforms Windows 10 control computer upgrades from Windows 7 Cathode retrofits including new 900 Series cathode upgrades All kits manufactured to original engineering specifications KDF Systems ## KDF *Upgrade Kits* Factory-designed upgrade kits for KDF sputtering systems – extending the service life of your tool while bringing modern control and measurement capabilities to existing platforms. Control System ### Techware Replacement Kit – KDF T Systems Complete Techware control system replacement kit for KDF T Series sputtering systems – modernizing control architecture while maintaining process recipe compatibility. Control System ### Techware Replacement Kit – KDF GT Systems Techware control system replacement kit for KDF GT Series systems – updated control hardware and software for improved process reliability and ease of operation. Control System ### Techware Replacement Kit – KDF NT Systems Techware control system replacement kit for KDF NT Series systems – preserving process compatibility while upgrading the control platform to current standards. System Upgrade ### System Upgrade Kit – KDF i/ix Systems Comprehensive system upgrade kit for KDF i and ix Series sputtering systems – covering controls, hardware improvements, and process capability enhancements. Measurement ### Load Lock Linear Transducer Kit Replacement and upgrade kit for the load lock linear transducer – improving positional accuracy and reliability of the pallet transfer system in KDF inline systems. Instrumentation ### MKS 146 Gauge Replacement Kit Complete replacement kit for the MKS 146 pressure gauge system – maintaining accurate pressure measurement and process control across the full vacuum range. [View Full KDF Upgrade Kit Details →](/products/original-oem-parts/kdf-upgrade-kits-mrc-upgrade-kits/techware-replacement-kits/) MRC Legacy Systems ## MRC *Upgrade Kits* As the OEM for MRC batch sputtering systems, KDF is the only source for original upgrade kits for legacy MRC 903 and 943 platforms – keeping your existing equipment running at full specification with modern components and improved reliability. KDF acquired MRC’s batch product lines in 1998 and has maintained uninterrupted production and support since. Our engineers hold 600+ combined person-years of MRC and KDF equipment experience – no other supplier has this depth of knowledge to design and validate MRC upgrade kits. Controls ### Network Replacement Kit Complete replacement of the legacy MRC network control system – modernizing communications and control architecture while maintaining full compatibility with existing process recipes and interlocks. Process Gas ### Gas Measurement Upgrade Upgraded gas measurement and control components for MRC systems – improving flow accuracy, repeatability, and process stability for reactive and non-reactive deposition processes. Power ### DC Power Conversion Upgrade Modernized DC power supply conversion kit for legacy MRC platforms – replacing aging power electronics with current-generation components for improved reliability and process control. Hydraulics ### Low Pressure Hydraulic Upgrade Updated hydraulic system components for MRC low-pressure circuits – reducing leak risk, improving response time, and extending the service life of pallet transport and load lock mechanisms. Vacuum ### Rough Line Upgrade Stainless steel roughing line replacement kit for MRC systems – eliminating aging elastomer lines and improving cleanliness, conductance, and pump-down performance. Process Control ### Pressure Controller Upgrade Replacement pressure controller kit for MRC systems – providing improved pressure setpoint accuracy and faster response for demanding process requirements. Scanning ### Scan Controller Retrofit Updated scan controller for MRC inline systems – improving pallet velocity control, scan profile repeatability, and integration with modern recipe management systems. Cathode ### Cathode Retrofits Factory-designed cathode retrofit kits for MRC systems – including upgrades to KDF’s latest cathode architectures for improved uniformity, target utilization, and deposition rate stability. Cathode Upgrade ### New KDF 900 Series Cathode Upgrade your MRC system with KDF’s current 900 Series cathode design – bringing 17″ cathode length, improved uniformity, and compatibility with Inset™, Planar™, and LMM™ cathode configurations. Tooling ### Removal & Insertion Tool Specialized tooling for safe and accurate cathode and component removal and insertion on MRC platforms – reducing maintenance time and eliminating the risk of component damage during service. [View Full MRC Upgrade Kit Details →](/products/original-oem-parts/kdf-upgrade-kits-mrc-upgrade-kits/mrc-upgrade-kits/) Also Available ## More OEM Parts & Services [ KDF Spare Parts View → ](/products/original-oem-parts/kdf-in-line-spare-parts-kits/) [ Sputtering Cathodes View → ](/products/original-oem-parts/sputtering-cathodes/) [ Sputtering Targets View → ](/products/original-oem-parts/sputtering-targets/) [ Backing Plates View → ](/products/original-oem-parts/backing-plates/) [ PLC Retrofit Kit View → ](/products/original-oem-parts/plc-retrofit-kit/) [ Retrofit Kits View → ](/products/original-oem-parts/retrofit-kits/) [ Repair Services View → ](/products/services-inline-sputtering-systems/repair-services/) [ MRC Heritage & Evolution Read → ](/mrc-heritage-and-evolution-honoring-a-legacy-of-innovation-and-sustaining-a-standard-of-excellence/) Get in Touch ## Need an Upgrade Kit for Your System? Our team can identify the right upgrade kit for your KDF or MRC system, confirm compatibility, and provide a fast quote. Contact us with your system model and serial number to get started. [Request a Quote →](/contact-us/) [All OEM Parts](/products/original-oem-parts/) --- ### [Thin film technology](https://www.kdf.com/products/services-inline-sputtering-systems/thin-film-technology/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Process R&D · Thin Film Science # Thin Film *Technology* KDF’s R&D team has spent 35+ years developing proprietary thin film deposition technologies that push the limits of what inline PVD sputtering can achieve – from sub-1% uniformity across full pallets to near-room-temperature ITO with metallic conductivity. These aren’t spec-sheet claims. They’re published, production-proven processes. Proprietary Technologies: ERPP™ LMM™ BMC™ Negative Sputter Ion Beam High-Rate Dielectric AlN Reactive What We Do ## Thin Film Is the Foundation of Modern Devices Thin film technology is the process of depositing and characterizing functional material layers on a substrate. These layers are the building blocks of modern devices – computer chips, medical implants, laser diodes, sensors, and more – and they require sophisticated know-how and systematic innovation to meet the ever-changing demands of high technology. KDF has the talents and tools to deposit and characterize, with high precision, various films ranging in thickness from **a few angstroms to hundreds of microns**. In addition to state-of-the-art deposition and etch equipment, KDF possesses in-house metrology tools and access to characterization facilities through collaboration with research and academic institutions. The R&D team at KDF has diversified experience in all areas of thin film engineering, devices, process development and characterization, and process integration. KDF research activities are customer-oriented and strongly focused on efficient, competitive technologies that enable production-worthy processes. #### Contact Our Technology Team For further information on R&D projects and process development: **Dr. Ammar Derraa** – Director of Technology [(201) 784-5005](tel:+12017845005) ext. 632 By the Numbers ### KDF R&D Capabilities 35+ Years of thin film process development and innovation 600+ Person-years of combined MRC/KDF engineering experience <1% Film uniformity achieved via ERPP™ planetary pallet system 15 min To deposit 1 micron SiO₂ vs. 5 hours by conventional RF sputtering 6+ Proprietary process technologies developed and patented Proprietary Technologies ## Process Innovations Built at KDF Each of the technologies below was developed, validated, and published by KDF’s engineering team – and many are now standard features on KDF production systems deployed worldwide. ERPP™ Enhanced Rotating Planetary Pallet ### Sub-1% Uniformity Across Full Pallet Area Exceptionally high uniformities and tight repeatabilities have been achieved for dielectric films on KDF 900 series sputtering tools using the proprietary ERPP™ system – a rotating planetary pallet motion combined with the tool’s standard linear scanning mode. The ERPP™ system uses a combination of linear scan velocity profiling and planetary rotation to average out non-uniformities across the full pallet surface. The result is sub-1% thickness uniformity for both metallic and dielectric films – a level of performance that conventional inline sputtering geometries cannot achieve. Published: *Vacuum Technology and Coating* · [Highly Uniform Dielectric Films Using Combined Linear Scanning, Velocity Profiling and Planetary Rotating Motion →](https://www.kdf.com/wp-content/uploads/2022/09/Highly-uniform-dielectric-films.pdf) LMM™ Linearly Moving Magnetron ### Full-Face Target Erosion & Process Stability With LMM™ technology, the plasma is swept linearly across the target to achieve uniform full-face erosion and high target utilization. Unlike stationary magnetrons where erosion is concentrated in a race-track pattern, the LMM™ cathode distributes sputtering uniformly – dramatically extending target life and reducing particle generation. The LMM™ cathode is by design a superior technology in terms of process stability and run-to-run repeatability over the target lifetime – translating to higher productivity and lower cost of ownership. Available on the 600ix and 654ix series systems. ITO Negative Sputter Ion Beam Technology ### Super-Smooth ITO at Near-Room Temperature A new ionized PVD approach – Negative Sputter Ion Beam technology – was developed at KDF for the deposition of super-smooth indium-tin oxide (ITO) thin films with highly transparent and conductive properties at near-room temperature. A limited amount of cesium vapor injected onto a conventional sputtering target surface lowers the work function of the target and produces a negatively charged sputter ion beam. The beam carries kinetic energy defined by the potential difference between cathode and substrate – enabling film quality previously achievable only at elevated temperatures. Presented: *American Vacuum Society Conference*, Denver, CO · [Download Technical Paper →](https://www.kdf.com/wp-content/uploads/2022/09/Super-smooth-indium-tin-oxide-thin-films-by-negative-sputter-ion-beam-technology.pdf) SiO₂ High-Rate Dielectric Deposition ### Dielectric Films at Metallic Deposition Rates High-rate processes for deposition of dielectric films have been developed at KDF using DC reactive sputtering on scanning batch tools. A typical high-rate process for the deposition of silicon dioxide films from a conductively doped silicon target allows the formation of **nearly 1 micron of SiO₂ in 15 minutes** – compared with nearly 5 hours by conventional RF magnetron sputtering from a quartz target. This represents an order-of-magnitude improvement in throughput for dielectric film deposition – enabling production-viable SiO₂ on platforms previously limited to metallic processes. Published: *Photonics Spectra*, pp. 30-31 AlN Aluminum Nitride Reactive Sputtering ### Production-Worthy AlN for Microelectronics & MEMS Aluminum Nitride (AlN) has generated significant research interest for microelectronic and optoelectronic applications due to its attractive piezoelectric, thermal, and optical properties. AlN films can be grown by PVD or CVD techniques – CVD can produce highly oriented epitaxial films but suffers from slow deposition rates and thermal stress from substrate heating. KDF’s reactive sputtering approach produces AlN films with high deposition rates at low substrate temperatures – enabling production-worthy AlN with the throughput characteristics that volume manufacturing demands. KDF sputtering systems are proven platforms for growing production-qualified AlN films for MEMS, RF filters, and optoelectronic devices. TCO Transparent Conducting Oxides ### Beyond ITO – A Full Family of TCO Materials In addition to its ITO negative sputter ion beam technology, KDF has developed deposition processes for a full family of transparent conducting oxides (TCOs) – including aluminum-doped zinc oxide (Al-ZnO) for applications requiring transparent conductors in photovoltaics, displays, and electrochromic devices. TCO development at KDF is driven by customer application requirements – from high-conductivity ITO for photonics to low-cost ZnO-based alternatives for solar and display applications. KDF’s inline sputtering platform enables TCO deposition at production scale with the uniformity and repeatability volume manufacturing demands. BMC™ Dry Etch-Band Magnetron Cathode ### Uniform Anisotropic Etching at Low Pressure The KDF BMC™ is a magnetron-enhanced reactive ion etcher that operates at very low pressure – typically 1-15 mTorr – providing uniform anisotropic etching with minimal radiation damage to the substrate. Operating at lower pressure than conventional reactive ion etchers, the BMC™ achieves more directional ion bombardment – enabling the precise feature definition and minimal sidewall damage required for advanced microelectronic and photonic device fabrication. In-House Capabilities ## Metrology & Characterization KDF’s Rockleigh, NJ facility houses a range of in-house metrology tools for thin film characterization – enabling process development, qualification, and troubleshooting without third-party delays. ### Film Thickness Profilometry and optical measurement tools for precise film thickness measurement across pallet – enabling uniformity mapping and process qualification. ### Sheet Resistance Four-point probe measurement for resistivity and sheet resistance characterization of metallic, alloy, and TCO films across substrate. ### Optical Properties Transmission and reflectance measurement for dielectric, TCO, and optical coating characterization – supporting photonics and display applications. ### Surface Analysis Access to XRD, XRF, SEM, and other analytical tools through KDF’s collaboration with research and academic institutions for advanced film characterization. ### Process Development Full process development capability – from target selection and gas chemistry through recipe development, uniformity optimization, and production qualification. ### Application Support KDF engineers work directly with customers to develop and validate processes before system delivery – reducing integration risk and accelerating production readiness. Technical Literature ## Published Research & Technical Papers KDF’s technology team has published peer-reviewed research and conference papers documenting the science behind our proprietary process innovations. Highly Uniform Dielectric Films Using Combined Linear Scanning, Velocity Profiling and Planetary Rotating Motion Vacuum Technology and Coating · ERPP™ Technology [Download PDF →](https://www.kdf.com/wp-content/uploads/2022/09/Highly-uniform-dielectric-films.pdf) Super-Smooth Indium-Tin Oxide Thin Films by Negative Sputter Ion Beam Technology American Vacuum Society Conference · Denver, CO · ITO Technology [Download PDF →](https://www.kdf.com/wp-content/uploads/2022/09/Super-smooth-indium-tin-oxide-thin-films-by-negative-sputter-ion-beam-technology.pdf) Dielectric Deposition at High-Metallic Rates via DC Reactive Sputtering Photonics Spectra · pp. 30-31 · High-Rate SiO₂ [Contact for Access →](/contact-us/) Work With Our Team ## Let’s Develop Your Process Together KDF’s R&D team works directly with customers to develop production-worthy processes before system delivery. Tell us your substrate, your film stack, and your performance targets – we’ll engineer the path to get there. [Start a Conversation →](/contact-us/) [View Thin Film Services →](/products/services-inline-sputtering-systems/thin-film-services-kdf-electronics/) [ammar.derraa@kdf.com – Dr. Ammar Derraa, Director of Technology](mailto:ammar.derraa@kdf.com) [(201) 784-5005 ext. 632](tel:+12017845005) --- ### [Thin Film Services KDF Technologies](https://www.kdf.com/products/services-inline-sputtering-systems/thin-film-services-kdf-electronics/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Thin Film Services & Support · KDF Technologies # Thin Film Coating Services & Process Development KDF’s 2,000 sq. ft. applications lab is equipped with production KDF sputtering systems and full metrology capabilities – giving you a direct path from feasibility to production-ready thin film processes, without the capital investment. [Request a Thin Film Quote →](/contact-us/) [All Services](/products/services-inline-sputtering-systems/) Lab Capabilities 2,000 Sq. Ft. Applications Lab <1% Film Uniformity Achievable 400°C Max Pre/Post Heat Capability 35+ Years of PVD Sputtering Expertise Overview ## KDF Thin Film Service & Process Development KDF is now providing a thin film coatings service to help speed up the feasibility and startup of customer projects in a production-like environment. Our 2,000 sq. ft. lab is fully equipped with KDF production sputtering tools and metrological equipment – the same equipment you would use in your own facility. With over 35 years of providing quality PVD equipment, KDF now offers the benefits of our sputtering expertise in the form of thin film depositions for customers. We offer standard process coatings for a host of substrates and sizes, with metal and dielectric sputtering technologies along with reactive sputtered films. KDF has the experience and expertise to tailor your sputtering needs and requirements into reality with **fully controlled processes and exceptional uniformities down to sub 1%**, depending on your application and budget. The Key Advantage ## Production Equipment, Not a Research Tool All of KDF’s thin film coating work is performed on KDF production equipment – not a scaled-down research tool. This means the process developed at KDF is directly transferable to your facility when you’re ready to bring it in-house, with no process translation required. Whether you need R&D efforts for a new project or a minimum production-like setup, KDF will work with you and put a plan together that suits your needs – from feasibility through production readiness. In addition to standard metals and dielectrics, **Transparent Conductive Oxides (TCOs)** utilizing materials like ITO and ZnO are available, along with reactive sputtered compounds and hard coatings. Deposition Capabilities ## Sputtering Modes Available ### DC Magnetron Sputtering Standard DC magnetron sputtering using KDF Inset™ Cathodes for metallic and alloy depositions. High deposition rates with excellent uniformity across the full pallet. KDF Inset™ Cathodes ### DC & Reactive Sputtering DC and reactive sputtering using KDF’s LMM™ (Linear Moving Magnetron) cathode – a patented design for stable reactive deposition of oxides and nitrides including TiN, TaN, SiO₂, and Al₂O₃. KDF LMM™ Patented Cathode ### HIPIMS High Power Impulse Magnetron Sputtering for highly ionized deposition – ideal for via fill, hard coatings, DLC, and applications requiring high film density and superior conformality. Note: Must be scheduled in advance ### RF Diode Sputtering RF diode sputtering for dielectric materials that cannot be deposited by DC methods. Enables deposition of insulating targets including SiO₂, Al₂O₃, and other oxide and nitride compounds. ### RF Magnetron Sputtering RF magnetron sputtering for dielectric deposition at significantly increased rates over RF diode sputtering – enabling higher throughput on oxide and nitride films for production-volume applications. ### Long-Throw Sputtering Long-throw sputtering for lift-off process replication and collimated sputtering requirements – enabling precise directionality for advanced patterning and step coverage applications. ### RF Pre-Clean In-situ RF pre-clean steps for substrate surface conditioning prior to deposition – removing native oxides and surface contamination for improved adhesion and interface quality. ### Pre & Post Heat Steps Substrate pre-heating and post-deposition annealing up to 400°C. Heat steps integrated into the deposition recipe for controlled thermal processing before, between, or after deposition layers. Materials ## Depositable Materials Metals & Alloys Au Ti TiW Cr Al Cu Ta Mo NiCr Pt Pd Compounds, Oxides & TCOs TiN TaN SiO₂ Al₂O₃ ITO ZnO TiO₂ DLC MoSi₂ Metrology ## Full Metrology Lab On-Site KDF’s Rockleigh facility includes a full metrology lab, enabling process development and sample runs to prove a process before a customer places an order or invests in capital equipment. – Profilometer Step height and surface roughness measurement for film thickness characterization – 4-Point Probe Sheet resistance measurement for metallic and TCO film characterization – Ellipsometer Optical film thickness and refractive index (n, k) measurement for dielectric and optical coatings – Uniformity Mapping Full-pallet film thickness uniformity mapping – achieving sub 1% with ERPP™ on qualifying applications How It Works ## From Feasibility to Production 01 ### Feasibility Discussion KDF engineers review your substrate, film requirements, and application. We confirm process feasibility and propose an approach. 02 ### Process Development Trial depositions on your actual parts using KDF production equipment. Full metrology analysis confirming film properties and uniformity. 03 ### Production Runs Once the process is proven, KDF can run production coating batches in our facility – or hand off the complete recipe for integration into your own KDF system. 04 ### In-House Transfer When you’re ready, bring the process in-house on a KDF system. Because all development was done on production equipment, process transfer is seamless. Also from KDF ## More Thin Film Services & Support [ Services Repair Services View → ](/products/services-inline-sputtering-systems/repair-services/) [ Services Training View → ](/products/services-inline-sputtering-systems/training-batch-sputtering-systems-kdf-electronics/) [ Technology Thin-Film Technology View → ](/products/services-inline-sputtering-systems/thin-film-technology/) [ New – Aug 1, 2026 VaporTech PVD Support View → ](/vaportech-support/) [ Parts Original OEM Parts View → ](/products/original-oem-parts/) Get in Touch ## Ready to Discuss Your Thin Film Process? Contact KDF with your substrate, film requirements, and application. We’ll confirm feasibility and put together a plan that suits your project and budget. [Contact KDF Technologies →](/contact-us/) [All Services & Support](/products/services-inline-sputtering-systems/) --- ### [Training Courses On KDF and MRC Batch Sputtering Equipment](https://www.kdf.com/products/services-inline-sputtering-systems/training-batch-sputtering-systems-kdf-electronics/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Thin Film Services & Support # KDF & MRC *Training* Courses Factory expert training on KDF and MRC batch sputtering equipment – taught by instructors with 30+ years of hands-on experience. Sessions available at KDF’s Rockleigh, NJ facility or at your site, customized to your team’s needs and skill level. [Register for a Course →](tel:+12017845005) [Request On-Site Training](/contact-us/) 30+ Years Instructor Experience 600+ Man-Years on KDF/MRC Equipment 3 Days Full Hands-On Course 6 Max Students Per Session Training Hotline | [1-877-KDF-EDGE (533-3343)](tel:+18775333343) | Call for course schedules, registration, and to request a full syllabus [← All Services](/products/services-inline-sputtering-systems/) | [Repair Services](/products/services-inline-sputtering-systems/repair-services/) | [Training](/products/services-inline-sputtering-systems/training-batch-sputtering-systems-kdf-electronics/) | [Thin Film Services](/products/services-inline-sputtering-systems/thin-film-services-kdf-electronics/) | [Thin-Film Technology](/products/services-inline-sputtering-systems/thin-film-technology/) | [VaporTech PVD Support](/vaportech-support/) Program Overview ## Training Taught by Factory Experts As an extension of KDF’s support programs, training is available on both KDF and MRC batch sputtering equipment. All sessions are taught by factory experts with over 30 years of direct experience on MRC and KDF equipment – representing more than 600 combined man-years of platform expertise. KDF maintains fully operational models of both KDF and MRC-style equipment at its Rockleigh, NJ facility, providing a dedicated hands-on training environment. Course topics and technique levels cover the full range from beginner to advanced, and classes can be customized to fit your team’s specific needs. Delivery Options ### How Training Is Delivered #### At KDF Rockleigh, NJ Multi-day courses at KDF’s facility using fully operational training systems. Includes catered lunch, access to KDF’s engineering staff, and a dedicated training environment free from production pressures. #### At Your Site On-site training conducted at your facility, utilizing your equipment and available staff. Ideal for teams that cannot travel or prefer training in their own production environment with their actual machines. #### Custom Programs KDF offers a variety of training topics and technique levels. Classes can be customized to fit your specific needs – from single-topic refreshers to comprehensive multi-day programs covering operation, maintenance, and process optimization. Featured Course ## 600i Preventative & Corrective Maintenance Course The KDF Preventative and Corrective Maintenance Course is designed for individuals who require a comprehensive knowledge base in understanding how KDF equipment works and the appropriate methodology for maintaining it. Skills gained in this course span beginner to advanced maintenance procedures and alignments. This course is a combination of lecture and hands-on instruction, taught by factory experts at KDF’s Rockleigh, NJ location. Participants work and are trained on a live 600i-style system. Learning is reinforced at the end of each day by practical application of the day’s activities, as well as through written examinations. **Prerequisites:** Course participants should have a general background in electronics and a strong mechanical aptitude. Duration **3 full consecutive days** – catered lunch provided each day Location KDF Technologies, 10 Volvo Drive, Rockleigh, NJ 07647 Training System Live 600i Series sputtering system Class Size **Minimum 2, maximum 6 students** – limited to ensure quality and effectiveness for each participant. First come, first served. Format Lecture + hands-on lab + daily practical application + written examinations Syllabus Call [(201) 784-5005](tel:+12017845005) or contact us to request a full course outline Schedule Classes run multiple times throughout the year – call to confirm upcoming dates Lodging Multiple hotels within 5 miles of KDF’s Rockleigh facility Payment Invoiced up to 30 days before course start – net 30 from invoice date Register [1-877-KDF-EDGE (533-3343)](tel:+18775333343) or [contact KDF Technologies →](/contact-us/) [Contact KDF to Register →](/contact-us/) Also Available ## Lesker U Live! – Online Vacuum Education Complement your KDF hands-on training with Lesker U Live! – the Kurt J. Lesker Company’s comprehensive online vacuum education platform. Whether you’re new to PVD and thin film deposition or looking to deepen your understanding of vacuum science, Lesker U offers structured courses, live webinars, and on-demand content from the team behind your equipment. As a KDF customer – a Kurt J. Lesker Company – you have access to the full breadth of KJLC’s educational resources, covering vacuum fundamentals, sputtering theory, process optimization, and equipment operation across the full deposition equipment lineup. – **Live webinars** with KJLC’s vacuum and thin film application scientists – **On-demand courses** covering vacuum fundamentals, PVD processes, and deposition equipment – **Sputtering theory** – understanding magnetron sputtering, reactive processes, and film properties – **Process optimization** topics relevant to KDF system users and MRC legacy platform operators – Free to access – no subscription required for many courses [Visit Lesker U Live! →](https://www.lesker.com/vacuum-education/) ![Lesker U Live! - Vacuum Education](https://www.kdf.com/wp-content/uploads/2026/04/Logo-leskerulive-scaled.png) Enrollment & Cancellation ## Cancellation Policy KDF’s cancellation policy is structured to protect both students and the training program. Please review before registering. 20+ Days #### Full Credit Cancellations made more than 20 days before the start of the training session receive a full credit toward a future course date. 11-20 Days #### 50% Cancellation Fee Cancellations made between 11 and 20 days before the session start will incur a 50% cancellation fee of the total course price. <11 Days / No-Show #### Full Forfeiture Students canceling fewer than 11 days prior to a session, or failing to appear without prior notice, will forfeit the entire enrollment fee. Why Train with KDF ## The KDF Training Difference #### Factory Expertise KDF instructors are the same engineers and technicians who design, build, and service these systems – not third-party trainers. You learn from the people who know the equipment at the deepest level. #### Hands-On with Live Systems Training is conducted on fully operational KDF and MRC equipment – not simulators or mockups. Students perform real maintenance tasks and develop real muscle memory on the systems they’ll actually operate. #### Reduces Downtime Properly trained operators and technicians catch issues earlier, perform PM procedures correctly, and resolve faults faster – directly translating to increased tool uptime and lower cost per wafer. #### Small Class Sizes A maximum of 6 students per session ensures each participant receives individual attention from the instructor. This isn’t a lecture hall – it’s a focused, high-quality learning environment. #### Customizable Programs Standard course offerings can be modified, extended, or combined to address your team’s specific knowledge gaps – whether you need a refresher on one subsystem or a full multi-day onboarding for a new team. #### Exam & Validation The 600i course includes daily written examinations and practical skill validations – giving supervisors confidence that trained staff have genuinely acquired the knowledge and skills covered, not just attended the session. Register or Inquire ## Ready to Schedule Training? Call KDF’s training hotline or contact us to check upcoming course dates, request a full syllabus, or discuss a custom on-site training program for your team. [📞 1-877-KDF-EDGE (533-3343)](tel:+18775333343) [Request On-Site Training →](/contact-us/) [(201) 784-5005](tel:+12017845005) [✉ sales@kdf.com](mailto:sales@kdf.com) [← Back to All Services](/products/services-inline-sputtering-systems/) --- ### [Repair services](https://www.kdf.com/products/services-inline-sputtering-systems/repair-services/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Thin Film Services & Support · KDF Technologies # Repair *Services* for KDF & MRC Sputtering Equipment KDF is the original OEM for KDF and MRC batch sputtering systems – with a technical repair staff carrying 35+ years of hands-on MRC experience. We turn around most repairs in 2-3 days, with no expedite fees. [Request a Repair →](/contact-us/) [(201) 784-5005](tel:+12017845005) At a Glance 2-3 Day Typical Turnaround $0 Expedite Fees – Ever 35+ Years MRC Repair Experience OEM Original Manufacturer – All Systems KDF Number 1 Priority Program | All repair orders handled under KDF’s **Number 1 Priority Program** – typical 2-3 day turnaround with no expedite fees, ever. [← All Services](/products/services-inline-sputtering-systems/) | [Repair Services](/products/services-inline-sputtering-systems/repair-services/) | [Training](/products/services-inline-sputtering-systems/training-batch-sputtering-systems-kdf-electronics/) | [Thin Film Services](/products/services-inline-sputtering-systems/thin-film-services-kdf-electronics/) | [Thin-Film Technology](/products/services-inline-sputtering-systems/thin-film-technology/) | [VaporTech PVD Support](/vaportech-support/) The KDF Repair Advantage ## Fast. Expert. *No Hidden Fees.* KDF’s technical repair staff carries more than 35 years of direct MRC and KDF equipment experience. Unlike most OEMs whose repair shop turnaround times can take weeks to months, KDF typically returns your repaired parts in **2-3 business days**. KDF also doesn’t charge expedite fees – a practice that has become standard at most OEMs today. Your repair is already our top priority. To deliver on that commitment, KDF maintains **fully operational MRC model computers** and an operational testbed system, ensuring complete and accurate testing of every repaired assembly before it leaves the facility. For systems experiencing downtime while a unit is being repaired, KDF offers creative solutions to minimize the impact on your production. [Contact us](/contact-us/) to discuss your specific situation and the options available to you. Why KDF Repairs Are Different ## Four Reasons to Choose KDF ### 2-3 Day Turnaround Most mechanical and electrical assemblies returned within 2-3 business days – not the weeks or months typical of other OEM repair shops. ### No Expedite Fees KDF doesn’t charge expedite fees – unlike virtually every other OEM where this has become standard practice. Priority service is simply how we operate. ### Fully Tested Before Shipment KDF maintains operational MRC model computers and a live testbed system – ensuring every repaired assembly is fully verified under real operating conditions before return. ### Original OEM Knowledge KDF is the original manufacturer – our repair team carries 35+ years of direct MRC experience and has access to original engineering drawings no other supplier can match. Systems Serviced KDF 600i Series KDF 744i KDF 844i KDF 900i Series KDF 974i MRC 800 Series MRC 903 MRC 943 MRC 8667 MRC 8671 Repair Coverage ## Mechanical & Electrical *Assemblies Serviced* Virtually all mechanical and electrical assemblies from the MRC 800 Series through the KDF 600i and 900i are serviced. KDF’s repair capability spans the full system – from high-voltage power supplies and RF generators to hydraulics, vacuum hardware, and control electronics. ### RF Generators & Power Supplies RF generators, DC power supplies, RF networks, and bias power supplies. KDF maintains RF tube generators tested and ready for swap – minimizing downtime while your unit is being repaired. ### Control Computers & Electronics MRC model control computers, printed circuit boards, I/O cards, analog racks, and control system electronics. KDF maintains fully operational MRC computers for accurate board-level testing. ### Mechanical Assemblies Hydraulic pumps, manifolds, valves, and cylinders. Pallet carriers, shutter carriages, gate valves, bellows, and feed-throughs. Complete mechanical sub-assembly repair and rebuild. ### Vacuum Components Cryo pumps, compressors, roughing lines, and viewports. Ferro-fluidic feedthroughs and rotary seals. All vacuum components tested on KDF’s live testbed system before return. ### Cathode Assemblies Sputtering cathodes of all KDF configurations – Inset™, Planar, Mark II, Magterial™, LMM™, and x Series. Cathode repair, rebuild, and conversion to updated configurations. ### Gas & Process Systems Gas flow controllers, pressure controllers, flow control valves, and process gas delivery components. All calibrated and tested against specification before return. Swap Program ## MRC RF Tube Generator *Swap Program* KDF operates an RF tube generator swap program specifically designed to minimize downtime and repair costs on MRC systems. Instead of waiting for your generator to be repaired, KDF ships a tested, ready-to-install replacement unit immediately – so your system is back up while KDF repairs your original. KDF maintains a stock of RF tube generators that have been fully tested and are ready for immediate shipment. Units are swapped on an exchange basis, keeping your system running with minimal interruption to production. [Request a Generator Swap →](/contact-us/) Models Included in Swap Program MRC 112-03 In Stock MRC 112-08 In Stock MRC 112-42 In Stock MRC 112-43 In Stock MRC 112-54 In Stock MRC 112-55 In Stock Important Notice – Legacy MRC Systems ## End of Life Notice for *Legacy MRC Electronics* ! ### End of Life – Legacy MRC Electronic Components Over the past decades KDF has been keeping legacy MRC products running. However, many of the electronic components used in these systems are now end-of-life – no longer manufactured and increasingly difficult to source. KDF will continue to make every effort to service and repair legacy MRC systems as outlined above, but **KDF can no longer guarantee its ability to do so indefinitely.** Customers operating legacy MRC systems should **plan accordingly to replace them**. KDF’s current inline sputtering platforms – the 600i, 900i, and 974i Series – are direct successors to the MRC product line, backed by the same engineering heritage and KDF’s complete parts and service infrastructure. [View Current KDF Systems →](/products/in-line-products-kdf-technologies/) Also from KDF ## More Services & Support [ Services Training Courses View → ](/products/services-inline-sputtering-systems/training-batch-sputtering-systems-kdf-electronics/) [ Services Thin Film Coating Services View → ](/products/services-inline-sputtering-systems/thin-film-services-kdf-electronics/) [ OEM Parts KDF & MRC Upgrade Kits View → ](/products/original-oem-parts/kdf-upgrade-kits-mrc-upgrade-kits/) [ OEM Parts Original OEM Parts View → ](/products/original-oem-parts/) [ New – Aug 1, 2026 VaporTech PVD Support View → ](/vaportech-support/) Get in Touch ## Need a Repair on Your KDF or MRC System? Contact KDF to initiate a repair order. Our team will confirm scope, turnaround time, and return shipping – most assemblies back in 2-3 days with no expedite fees. [Request a Repair →](/contact-us/) [OEM Replacement Parts](/products/original-oem-parts/) [(201) 784-5005](tel:+12017845005) [← All Services](/products/services-inline-sputtering-systems/) --- ### [Original Batch OEM Parts](https://www.kdf.com/products/services-inline-sputtering-systems/original-oem-parts/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Thin Film Services & Support # Original *Batch* OEM Parts KDF is the authoritative OEM source for parts and components covering the full KDF and MRC batch sputtering system installed base. When you need the right part – not a substitute – KDF has it, backed by 35+ years of original documentation, drawings, and manufacturing expertise. [Request a Part →](/contact-us/) [📞 (201) 784-5005](tel:+12017845005) Supported Systems KDF 600 Series KDF 700 Series KDF 800 Series KDF 900 Series MRC 8667 MRC 8671 MRC 822 [← All Services](/products/services-inline-sputtering-systems/) | [Original OEM Parts](/products/services-inline-sputtering-systems/original-oem-parts/) | [Repair Services](/products/services-inline-sputtering-systems/repair-services/) | [Training](/products/services-inline-sputtering-systems/training-batch-sputtering-systems-kdf-electronics/) | [Thin Film Services](/products/services-inline-sputtering-systems/thin-film-services-kdf-electronics/) | [Thin-Film Technology](/products/services-inline-sputtering-systems/thin-film-technology/) Parts Catalog ## Three Categories. Complete Coverage. KDF organizes its original batch OEM parts into three major categories – consumables, replacement parts, and electrical – covering every component type across the full KDF and MRC system lineup. Category 01 ### Consumables High-wear components that require regular replacement during normal system operation. Stocking these parts minimizes unplanned downtime and keeps your process running within spec. - Shields (chamber and loadlock) - O-rings – all system types - Bearings - Heat lamps (quartz heater assemblies) - Magnets for all cathode types - Pallets – custom or standard configurations - Ion tubes - Thermocouples (TCs) Category 02 ### Replacement Parts Mechanical and process components covering the full system – from cathodes and pallet carriers to vacuum hardware and motion assemblies. All sourced or manufactured to original KDF and MRC specifications. - Cathodes – Inset™, Upsilon, Mu, Chi, Focest™, Planar, Mark II™, Magterial™, X-Series™, Q-Set - Bellows and garlock seals - Ferro-fluidic feedthroughs - Pallet carriers and shutter carriages - Shutter plates - RF networks - Solenoids and relays - Cryo pumps and compressors - Gate valves - Hydraulic pumps, manifolds, valves, and cylinders - Air packages, grippers, and valves - Etch platforms and etch hoist assemblies - Stainless steel roughing lines - Viewports - ★ Inset™, Upsilon, Mu, Chi, and Focest™ cathodes are patented – sole property of KDF Technologies. KDF owns all rights and intellectual property associated with these cathodes. Category 03 ### Electrical Components Control, power, and instrumentation electronics – sourced as original replacements to ensure system behavior matches factory specifications. Critical for process repeatability and system safety compliance. - Printed circuit boards - RF generators - Flow control valves - Gas flow controllers (MFCs) - RF power supplies - DC power supplies - Computer boards and I/O cards - Analog racks - Pressure gauges (all types) System Coverage ## Supported Systems KDF maintains original parts coverage for the following KDF and MRC batch sputtering system families. Call with your system model or original MRC job number and KDF will identify and supply the correct part. KDF Systems 600 Series 603i, 643i, 643ix, 654i, 654ix – vertical side sputtering [View System →](/products/in-line-products-kdf-technologies/600-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) 700 Series 744i – large area vertical batch sputtering [View System →](/products/in-line-products-kdf-technologies/744-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) 800 Series 844i – large area, 300mm, Gen 3.5 glass [View System →](/products/in-line-products-kdf-technologies/844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) 900 Series 903i, 943i, 943ix, 954i, 954ix, 974i – horizontal sputter-down [View System →](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) MRC Systems (Original OEM) MRC 8667 Original MRC batch sputtering system – full parts and service support MRC 8671 Original MRC batch sputtering system – full parts and service support MRC 822 Original MRC batch sputtering system – full parts and service support Limited MRC Additional limited MRC system coverage available – contact KDF with your job number #### 165,000+ Original MRC Drawings on File KDF maintains a complete drawing and documentation file of over 165,000 original MRC drawings – including unique job-level prints – ensuring the most accurate parts identification and service for your original MRC system. Call with your MRC job number for immediate lookup. Why Original OEM ## The Case for Genuine KDF Parts #### Process Integrity Original OEM parts are manufactured to the same tolerances and specifications as the original system components – ensuring process behavior, uniformity, and repeatability remain unchanged after a repair or replacement. #### Uptime & Reliability Non-OEM substitutes introduce unknown variables into a precisely engineered system. KDF original parts have known service lives, failure modes, and replacement intervals – giving you predictable maintenance cycles and maximum tool uptime. #### Full Documentation Every KDF and MRC part is backed by original engineering drawings and documentation. KDF’s 165,000+ drawing archive means even legacy MRC systems can be serviced with the same accuracy as current KDF equipment. #### Expert Support When you order from KDF, you get more than a part – you get access to KDF’s engineering and process staff who can advise on installation, root cause, and preventive maintenance to stop the same failure from recurring. #### Worldwide Availability KDF maintains two US support locations and a network of factory-trained international reps in Europe and Asia – ensuring part availability and technical support wherever your systems are running. #### Sole-Source Cathodes KDF’s patented cathodes – Inset™, Upsilon, Mu, Chi, and Focest™ – are sole property of KDF Technologies and cannot be sourced anywhere else. Genuine KDF is the only source for these performance-critical components. Get the Right Part ## Order OEM Parts Today Contact KDF’s parts team with your system model or MRC job number. Our technical staff will identify the correct part and get you back up and running as quickly as possible. [Request a Part →](/contact-us/) [📞 (201) 784-5005](tel:+12017845005) [✉ sales@kdf.com](mailto:sales@kdf.com) [← Back to All Services](/products/services-inline-sputtering-systems/) --- ### [Thin Film Services & Support](https://www.kdf.com/products/services-inline-sputtering-systems/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** KDF Technologies – Services & Support # Thin Film *Services* & Support KDF maintains global support for its worldwide installed base – covering KDF and original MRC batch sputtering systems. From original OEM parts and repair services to process development and operator training, KDF is your full-lifecycle partner. [Contact Support →](/contact-us/) [📞 (201) 784-5005](tel:+12017845005) 35+ Years of Expertise 165K+ Original MRC Drawings 2 US Support Locations Global Int’l Rep Coverage ![KDF Thin Film Services & Support](https://www.kdf.com/wp-content/uploads/2022/09/Rectangle-230.jpg) #### Worldwide Coverage Two US support locations plus factory-trained international reps in Europe and Asia ensure maximum response time for parts and service needs globally. #### Expert Technical Staff KDF engineering and process staff are available at no charge, 8:00 AM – 5:30 PM, five days a week to answer questions and offer solutions for all KDF and MRC equipment. #### Complete Customer History KDF maintains a complete customer history database, tracking problems and services to identify and offer proactive solutions to recurring customer-specific issues. What We Offer ## Five Ways KDF Supports Your Operation Whether you need a replacement part, a factory repair, hands-on training, process development assistance, or technical consulting on thin film technology – KDF has a dedicated service offering for each. 01 ### Original Batch OEM Parts As the OEM for MRC batch systems, KDF is the authoritative source for original replacement parts – covering both KDF and MRC equipment with the same engineering standards as when the system was built. - Original KDF and MRC batch system parts - Complete drawing and documentation file - 165,000+ original MRC drawings including unique job-level prints - Upgrade kits, spare parts kits, cathodes, targets, backing plates - PLC retrofit and upgrade kits [Original OEM Parts →](/products/services-inline-sputtering-systems/original-oem-parts/) 02 ### Repair Services Factory repair services for KDF and MRC batch sputtering system components – performed by KDF-trained technicians with access to full original engineering documentation and replacement parts. - Component-level repair by factory-trained technicians - KDF and MRC system coverage - Access to complete original engineering documentation - Proactive solutions based on customer history database - Field service and depot repair options [Repair Services →](/products/services-inline-sputtering-systems/repair-services/) 03 ### Operator Training Hands-on operator and maintenance training for KDF batch sputtering systems – delivered at KDF’s facility or at the customer site by experienced KDF process and engineering staff. - System operation and recipe management training - Preventive maintenance procedures - Troubleshooting and fault diagnosis - Process optimization techniques - On-site and factory training available [Training Programs →](/products/services-inline-sputtering-systems/training-batch-sputtering-systems-kdf-electronics/) 04 ### Thin Film Services KDF’s applications lab offers process development services for customers needing thin film development support. With multiple system types and an extensive target materials library, KDF can develop and qualify new processes before you run them in production. - Process development and qualification services - Fully equipped applications lab - Extensive target materials library - Multiple KDF system and option types on-site - Process transfer support to customer facilities [Thin Film Services →](/products/services-inline-sputtering-systems/thin-film-services-kdf-electronics/) 05 ### Thin-Film Technology Technical consulting and engineering support on thin film deposition technology – drawing on KDF’s deep expertise in PVD sputtering processes, cathode design, and materials science developed over 35+ years of system manufacturing. - PVD process consulting and optimization - Film uniformity and repeatability analysis - Cathode selection and process recipe development - Reactive sputtering process support - Technical documentation and application notes [Thin-Film Technology →](/products/services-inline-sputtering-systems/thin-film-technology/) OEM Authority ## The Original OEM for MRC Batch Systems 165K+ Original MRC Drawings 35+ Years as OEM 2 US Support Locations Global Worldwide Service Network As the designated OEM for MRC batch sputtering systems, KDF sustains the entire MRC batch product line – providing complete parts and service support on a worldwide basis. KDF maintains a complete drawing and documentation file of over 165,000 original MRC drawings, including unique job-level prints, ensuring the most accurate service for your original MRC system. KDF quickly develops tailored solutions and builds on its core competencies to address reoccurring customer-specific issues. All existing KDF equipment is also supported with upgrades and retrofits – extending system life and adding modern capabilities to legacy tools. MRC System Support [(201) 784-5005](tel:+12017845005)Call with your original MRC job number and let us help you. ### Expert Technical Support – At No Charge KDF engineering and process staff are available **Monday – Friday, 8:00 AM – 5:30 PM EST** to answer your questions and offer solutions for all KDF and MRC equipment. No service contract required. [📞 (201) 784-5005](tel:+12017845005) Get Support ## How Can We Help You Today? Whether you need a part, a repair, training, or process support – KDF’s technical team is ready. Contact us or submit a request and we’ll get back to you promptly. [Contact the Support Team →](/contact-us/) [📞 (201) 784-5005](tel:+12017845005) [✉ sales@kdf.com](mailto:sales@kdf.com) [📍 10 Volvo Drive, Rockleigh, NJ 07647](https://goo.gl/maps/z5Fh4fZRmCvKu2AW8) --- ### [Preowned & Remanufactured Products](https://www.kdf.com/products/in-line-products-kdf-technologies/pre-owned-remanufactured-inline-sputtering-systems-kdf/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** ## Pre-Owned Products ### PRODUCT ## Preowned & Remanufactured Products KDF makes every effort to support not only our KDF systems but our original MRC equipment customers however the MRC systems are at End Of Life and customers should plan accordingly. For our MRC system customers burdened with their obsolete components KDF offers limited assembly and component replacement kits, in house repair services (based on limited part availability), and experienced field engineers for on-site service support. For those looking to update this equipment KDF also offers trade in credit for your old MRC tool which can be used when purchasing a new or rebuilt tool. For owners of early KDF T / GT / NT / i / ix systems KDF offers a full line of upgrade kits which keeps your tools current to the technology and operating systems used today. Visit our [upgrade kit web page](/contact-us/ ) for full details and/ or[ request a quote](/contact-us/) for your specific tool. KDF currently has preowned systems available which can be purchased at a significantly reduced price vs a brand new system. Since inventory changes contact KDF Sales for our current system listing of factory refurbished MRC and KDF equipment. ### NEW! At KDF Two 654ix Systems Ready for Demo! ## 654ix Series KDF has two re-manufactured and upgraded 654ix series systems available for sale - KDF 654ix cryo based system - KDF 654ix turbo based system with CTI water pumps These systems can be delivered in half of the time of a brand new system. Both systems can be custom configured to meet customer needs. The KDF 654ix Series is a four-target, batch sputtering system, designed for processing high-density interconnect, up to 300mm semiconductor wafers, OLED and flat panel displays. The tool was developed to meet increasing customer demand for higher throughput and processes that require four targets. ![image](/wp-content/uploads/2022/09/654i-sRGB-768x519-1.jpg) - Vertical four target side sputtering system - 13″ x 13″ pallet size - Compact footprint that uses less than one third of the space required for competing equipment - High-vacuum loadlock with quartz heater lamps for efficient degassing of substrates - Capacity to process up to four 150mm wafers or multiple smaller wafers at once [Request Quote](/contact-us/ ) ### At KDF Ready for Demo! ## 744i Series The KDF 744i Series is a large area, four-target, batch sputtering system, designed for processing high-density interconnect, 200mm semiconductor wafers, OLED and flat panel displays. The tool was developed to meet increasing customer demand for higher throughput with larger substrates. ![image](/wp-content/uploads/2022/09/800i.jpg) - Vertical side sputtering system - 19″ x 19″ pallet size - Compact footprint that uses less than one third of the space required for competing equipment - High-vacuum loadlock with quartz heater lamps for efficient degassing of substrates - Capacity to process up to four 200 mm wafers or multiple smaller wafers at once - Throughput for 200mm wafer metallurgy is increased four times over that of a 600i Series system - Glass sizes up to Gen 2 - Optional integrated RGA for process and fault monitoring of gas peaks along with integrated hi vac step - New in situ pallet optical measurement hardware with integrated software allowing operators to program and control actual pallet temperature [Request Quote]() ## MRC 943 - Down sputter system - Fully automated controlled system - Recipe storage - Hi Vac & Heat Load Lock with CTI pump - CTI Cryo pumped main chamber - 10 KW DC supply - MRC 1.5 KW RF power supply - RF etch - Three RF/DC Planer cathodes - Consult factory for price and other options [Request Quote]() ## Have questions?[ Contact KDF](/contact-us/ ) about Pre-Owned Products. --- ### [Opus Robot C2C Loading System](https://www.kdf.com/products/in-line-products-kdf-technologies/opus-robot-c-to-c-inline-sputtering-batch-systems-kdf/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** ## Opus Robotic C2C Loading System ### ABOUT ## Next Level in System Integration KDF now has available for all 600 series, 744 and 844i systems an added level of system automation and cleanliness. ![image](/wp-content/uploads/2022/09/Opus-Robotic-C2C-Loading-System.jpg) The KDF robotic load option allows for system fabs to now more fully integrate their processes. The robotic loader utilizes a clean room 6-axis robot. The handler can easily accommodate 100mm thru 300 mm wafer sizes as well as a multitude of unique substrate shapes and sizes. Throughput for 150 mm wafers on a standard 600 series pallet with a 1 micron Al deposition is >35 WPH. For other system and substrate sizes please consult factory for through put numbers. Precise handling is accommodated thru a unique wafer-positioning algorithm ensuring accurate and repeatable handling. The robot is enclosed in its own class 100 clean mini environment for enhanced particle reduction. #### Design The design can be utilized as a stand-alone or in a thru the wall installation. The design also allows for servicing the load lock area without undocking the robot. The robotic loader comes with a roll around human interface terminal making system maintenance more convenient. ## Have questions?[ Contact KDF](/contact-us/ ) about the Opus Robot C to C --- ### [974i series sputtering equipment in line side sputtering batch systems kdf](https://www.kdf.com/products/in-line-products-kdf-technologies/974i-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) **Published:** December 14, 2022 **Author:** KDF Technologies **Content:** KDF Flagship – Sputter-Down Series # *974i* Series Flagship Horizontal Sputter-Down Batch System The top of the KDF sputter-down platform family – a 20″×20″ pallet, four-target system delivering 4× the throughput of the 900i Series for 200mm wafer metallurgy, with the process flexibility of an R&D tool and the reliability of a production workhorse. [Request a Quote →](/contact-us/) [Download Datasheet →](https://www.kdf.com/wp-content/uploads/2022/09/974i-Series-HR-1.pdf) Pallet Size 20″ × 20″ Target Positions 3 or 4 Max Substrate Thickness 2″ standard Loadlock Stacker Up to 5 pallets Cathode Length 24.5″ ![KDF 974i Series Sputtering System](https://www.kdf.com/wp-content/uploads/2026/03/974i-1-scaled.jpg) Flagship System | 4× throughput of 900i Series for 200mm wafer metallurgy | 20″ × 20″ pallet – largest in the sputter-down family | Optional 5-pallet loadlock stacker for continuous production [600i Series](/products/in-line-products-kdf-technologies/600-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [744i Series](/products/in-line-products-kdf-technologies/744-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [844i Series](/products/in-line-products-kdf-technologies/844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [900i Series](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [974i Series](/products/in-line-products-kdf-technologies/974i-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [Ci Cluster Tool](/products/in-line-products-kdf-technologies/ci-cluster-tool/) System Overview ## Production Scale. R&D Flexibility. The 974i is the flagship of KDF’s sputter-down platform family – designed to meet today’s most stringent production requirements while delivering the process flexibility typically found in R&D systems. With a 20″×20″ pallet and horizontal sputter-down geometry, the 974i processes dimensional substrates up to 2 inches thick, up to one Gen 2.5 substrate per pallet, and achieves 4× the throughput of the 900i Series for 200mm wafer metallurgy. ![KDF 974i Series - System Detail](https://www.kdf.com/wp-content/uploads/2026/03/974i-2-scaled.jpg) 974i Series – System Detail The 974i features high-vacuum loadlock with quartz heater lamps, and supports an optional loadlock upgrade to a 5-pallet stack for near-continuous production throughput. The system accepts KDF’s full 24.5-inch cathode lineup – including the exclusive Focest Cathode™ for high-aspect ratio deep trench fills. Like the 900i, the 974i is available with KDF’s ERPP™ planetary pallet – achieving better than ±1% uniformity and 0.5% run-to-run repeatability for dielectric materials. It is the platform of choice for defense and aerospace hybrid circuits, compound semiconductor front/backside processing, and application-critical thin film production. Key Features ### Standard System Capabilities - Horizontal cathode and substrate orientation – sputter-down geometry - 20″ × 20″ pallet – largest in the KDF sputter-down family - Processes dimensional substrates up to 2″ thick – standard - Capacity for up to one Gen 2.5 substrate per pallet - 4× throughput improvement over 900i Series for 200mm wafer metallurgy - High-rate DC magnetron sputtering – single and multiple-pass deposition - High vacuum loadlock with quartz heater lamps for substrate degassing - Optional loadlock upgrade: dual (2) to five (5) pallet stack - Optional ERPP™ planetary pallet – <±1% uniformity, <0.5% repeatability - Scan velocity profiling for enhanced deposition uniformity - Optional integrated RGA for process and fault monitoring - 24.5″ extended cathodes – Planar™, Inset™, RF/DC LMM™, Focest™ - Pulsed DC via Advanced Energy Pinnacle Plus available - Fully automated self-locking top plate support system - Complies with Semiconductor S2-0706; CE option available ★ Denotes capabilities unique to the 974i vs. 900i Series ![KDF 974i - Chamber Interior](https://www.kdf.com/wp-content/uploads/2026/03/974i-3-scaled.jpg) 974i Series – Chamber Interior ![KDF 974i - System View](https://www.kdf.com/wp-content/uploads/2026/03/974i-4-scaled.jpg) 974i Series – Production Configuration 974i vs 900i Series ## How the 974i Steps Up The 974i shares the sputter-down geometry and platform DNA of the 900i – but scales up in every dimension that matters for high-throughput production with larger substrates. Pallet Size 20″ × 20″ vs 12″ × 12″ (900i) Area 200mm Throughput 4× vs 900i Series baseline Throughput Multiplier Max Substrate Thickness 2″ vs 1.5″ standard (900i) Standard Spec Loadlock Capacity 5 vs 2 standard (900i) Max Pallet Stack Cathode Technology ## 974i Cathode Options The 974i accepts KDF’s full 24.5-inch cathode lineup – the longest in the sputter-down family. All cathodes are designed in-house and field-proven for production-critical applications. Focest Cathode™ High-Aspect Ratio · Deep Trench Fill Originally developed for high-aspect ratio deep trench fill applications, the Focest Cathode™ is capable of increasing uniformity, deposition rate, and material utilization simultaneously – making it the choice for the most demanding advanced packaging and semiconductor interconnect applications. LMM™ Cathode Patented · RF Capable · Full Face Erosion · 24.5″ KDF’s patented Linear Moving Magnetron cathode at 24.5-inch length. RF capable with full-face target erosion for low-particle applications. Delivers bulletproof high-rate reactive processes with superior run-to-run repeatability across the entire 20″×20″ pallet area. Inset Cathode™ 24.5″ Length · Metals & Precious Metals Full 24.5-inch length for the 974i, accommodating most metal and all precious metal types. Improved cathode-to-pallet aspect ratio delivers superior uniformity across the expanded 20″×20″ pallet vs. shorter cathode configurations. Planar™ & Custom Full Cathode Family · In-House Engineering The full KDF planar cathode range is available for the 974i, along with custom designs from KDF’s in-house cathode engineering team. Optional gas delivery systems enable enhanced reactive sputtering processes across all cathode types. 5Pallet Stack Option #### Optional Loadlock Upgrade – 2 to 5 Pallet Stack The 974i offers an optional loadlock upgrade that expands capacity from the standard dual (2) pallet configuration to a five (5) pallet stack. This enables near-continuous sequential processing – significantly increasing tool utilization and reducing operator intervention for high-volume production environments. ERPP™Proprietary Technology #### Enhanced Rotating Planetary Pallet – <±1% Uniformity Across 20″×20″ The ERPP™ planetary pallet option on the 974i achieves better than ±1% uniformity across the full 20″×20″ pallet and better than 0.5% run-to-run repeatability for dielectrics such as SiO₂ and TiO₂ – compared to ±15-20% for traditional pallets. With KDF cathodes in tandem, this is the highest-performance uniformity option available in the in-line batch sputtering category. Technical Specifications ## Vacuum & Facility Requirements Vacuum Performance Chamber Ultimate≤1 × 10⁻⁷ torr Chamber Leak Rate20 min to 1 × 10⁻⁴ torr HV Dome Ultimate≤1 × 10⁻⁷ torr HV Dome Leak Rate15 min to 1 × 10⁻⁴ torr Pump Down from Atm.≤110 min to 1 × 10⁻⁶ torr Overnight Pump Down2 × 10⁻⁷ torr Loadlock PumpCTI-8 cryo pump Facility Requirements Power208 VAC, 3-phase, 100A Cooling Water6.5 GPM, 70 PSI min Water Temp Range10°C – 24°C Compressed Air85 – 100 PSIG Process Gas25 PSIG, 99.999% purity Pure GasDry N₂ Process Capability Pallet Size20″ × 20″ (508mm × 508mm) Max Substrate Thickness2″ standard Glass SizeUp to Gen 2.5 Target Positions3 or 4 DC Power Supply20 kW (Adv. Energy) RF Power Supply3 kW (optional) System Detail ## Hardware, Controls & Software ### System Hardware - 20 kW low stored energy DC power supplies (Advanced Energy) – optional Pinnacle Plus pulsed DC - Integrated throttling SS VAT valve for upstream or downstream pressure control - MKS multi-component “Smart” 390 and 925 gauges for integrated vacuum measurement - Fully automated self-locking top plate support system - Process gas control: up to 4 MFCs, feedback-controlled capacitance manometer, master/slave gas select, gas ratio control - Stepper motor pallet carrier drive with optical encoder – programmable scan velocity profiling - Loadlock linear sensor – computer-controlled positioning for accuracy and fail-safe - Low-pressure hydraulics for safety and smooth operation - Optional 3 kW RF solid-state power supply (Advanced Energy) - Complies with NFPA 79; CE option available ### Computer & Control System - Windows 10 real-time GUI with 24″ LCD touchscreen on umbilical mobile HI cart - Context-sensitive recipe manager running from Microsoft SQL database - Real-time data display and logging – compatible with Excel, Lotus, and Windows applications - Report generation, remote interface, and printing capability - Optional SECS/GEM connectivity via OPC server interface - Distributed Rockwell Control System – DeviceNet and EtherNet/IP fieldbus - Full maintenance test suite with diagnostic and manual process control - Service-friendly fully enclosed electronic cabinet - Remote PC accessibility via Ethernet for software upgrades and file repair Applications ## Target Markets Defense & Aerospace Medical Devices Compound Semiconductors Space Telecom Hybrid Circuits Optical Communications High-Density Interconnect Advanced Packaging Next Steps ## Configure Your 974i System Our process engineers can help you select the right cathode configuration, loadlock option, and pallet setup for your 974i application. Download the full datasheet or contact us to start the conversation. [Let’s Talk Process →](/contact-us/) [Download 974i Datasheet →](https://www.kdf.com/wp-content/uploads/2022/09/974i-Series-HR-1.pdf) [📞 (201) 784-5005](tel:+12017845005) [✉ sales@kdf.com](mailto:sales@kdf.com) --- ### [900i Horizontal Batch-Sputtering System](https://www.kdf.com/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Production Series # *900i* Series Horizontal Sputter-Down Batch System Dual load lock, in-line sputter-down batch systems with horizontal cathode and substrate orientation – built for gentle substrate fixturing, varied substrate geometries, and the highest uniformity demands in production. [Request a Quote →](/contact-us/) [Download Datasheet →](https://www.kdf.com/wp-content/uploads/2022/09/900i-Series-HR-1.pdf) Pallet Size 12″ × 12″ Target Positions 3 or 4 Max Substrate Thickness 1.5″ (2″ optional) Orientation Horizontal / Sputter Down ![KDF 900i Series Sputtering System](https://www.kdf.com/wp-content/uploads/2026/03/944-1-scaled.jpg) [600i Series](/products/in-line-products-kdf-technologies/600-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [744i Series](/products/in-line-products-kdf-technologies/744-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [844i Series](/products/in-line-products-kdf-technologies/844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [900i Series](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [974i Series](/products/in-line-products-kdf-technologies/974i-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [Ci Cluster Tool](/products/in-line-products-kdf-technologies/ci-cluster-tool/) System Overview ## Horizontal Orientation. Vertical Deposition. The 900i Series is KDF’s sputter-down platform – a fundamentally different geometry from the side-sputtering 600i, 744i, and 844i systems. With horizontal cathode and substrate orientation, sputtered material transfers vertically downward onto the substrate, enabling gentle fixturing for varied substrate sizes, shapes, and heights up to 1.5 inches thick (2 inches with optional hardware). ![KDF 900i Series - System Interior](https://www.kdf.com/wp-content/uploads/2026/03/944-1.png) 900i Series – Chamber Interior High-rate DC magnetron sputtering with single-pass or multiple-pass deposition, dual-level high vacuum pumped load lock, and support for KDF’s proprietary ERPP™ planetary pallet make the 900i Series the platform of choice for applications demanding better than ±1% film uniformity with better than 0.5% run-to-run repeatability. The 900i Series includes the 903i, 943i, 943ix, 954i, and 954ix. The ix series features extended 17″ X-Series™ cathodes for improved uniformity and supports KDF’s LMM™ cathode for demanding reactive process applications. Key Features ### Standard System Capabilities - Horizontal cathode and substrate orientation – sputter-down geometry - 12″ × 12″ pallet with convenient wafer-to-pallet loading - Processes dimensional substrates up to 1.5″ thick (2″ with optional hardware) - Capacity to process up to one 300mm wafer or multiple smaller wafers - High-rate DC magnetron sputtering – single and multiple-pass deposition - Dual-level high vacuum pumped load lock - Optional high vacuum loadlock with quartz heater lamps for substrate degassing - Optional ERPP™ planetary substrate pallet for <±1% film uniformity - Optional pallet stacker – 5-pallet sequential operation - Scan velocity profiling for enhanced deposition uniformity - Optional integrated RGA for process and fault monitoring - LMM™ cathode available (ix series) – full-face erosion, low particles - Pulsed DC via Advanced Energy Pinnacle Plus available - Fully automated self-locking top plate support system - Complies with Semiconductor S2-0706; CE option available ![KDF 900i Series - Chamber View](https://www.kdf.com/wp-content/uploads/2026/03/944-2-scaled.jpg) 900i Series – Chamber Detail ![KDF 900i Series - System View](https://www.kdf.com/wp-content/uploads/2026/03/944-2-1-scaled.jpg) 900i Series – Production Configuration What Makes the 900i Different ## The Sputter-Down Advantage The 900i’s horizontal orientation is a deliberate design choice – not a compromise. It opens up process capabilities and substrate handling options that vertical side-sputtering systems simply cannot match. #### Gentle Substrate Fixturing Horizontal orientation allows substrates to rest flat on the pallet under gravity – no clamping, gripping, or vertical support required. This is critical for fragile substrates, thick components, and unusual geometries that would be difficult to fixture vertically. #### Dimensional Substrate Capability The 900i processes substrates up to 1.5 inches thick as standard, with optional hardware extending this to 2 inches. This accommodates packages, modules, hermetic lids, ceramic substrates, and other dimensional components that exceed the capability of flat-pallet side-sputtering tools. #### Pure Metal Target Deposition The 900i Series is particularly well-suited for pure metal target deposition and contact metallurgy processing. The sputter-down geometry and convenient wafer-to-pallet loading make it the preferred choice for hybrid circuits, defense electronics, and medical implant metallization. #### ERPP™ Uniformity Performance With KDF’s ERPP™ planetary pallet, the 900i achieves better than ±1% uniformity across the pallet and better than 0.5% run-to-run repeatability for dielectrics including SiO₂ and TiO₂ – compared to ±15-20% for traditional pallets. Unmatched for application-critical thin film production. System Variants ## 900i Series Model Lineup The 900i family spans from the base 903i to the four-target 954ix – each model building on the last with additional vacuum, process, and cathode capabilities. All share the defining sputter-down horizontal geometry. ![KDF 900i Series - System Detail](https://www.kdf.com/wp-content/uploads/2026/03/944-1-1.jpg) 900i Series – System Detail 903i Base Model · 3-Target · Rough Pump Loadlock Targeted at contact metallurgy processing for pure metal target deposition and convenient wafer-to-pallet loading. The rough-pumped load lock enables fast production exchange cycles for high-throughput manufacturing. 943i High Vacuum Loadlock · Defense & Aerospace Builds on the 903i with a high-vacuum pumped load lock and quartz heat lamps. Ideally suited for application-critical thin films for hybrid circuits in defense, aerospace, and space telecommunications – where repeatable, high-throughput processes for uniform films are non-negotiable. 954i 4-Target · GaAs · Compound Semiconductors Designed for GaAs and compound semiconductor applications. A four-target batch sputtering tool supporting both front and backside deposition – providing high utilization, cost-effectiveness, and productivity for leading-edge microelectronic component manufacturing. 943ix & 954ix X-Series™ · 17″ Extended Cathode · LMM™ KDF’s X-Series™ with 17-inch extended cathodes for improved uniformity across the full pallet. Available in Planar™, Inset™, and RF/DC LMM™ configurations. The LMM™ cathode delivers full-face erosion and bulletproof high-rate reactive processes for the most demanding applications. ERPP™Proprietary Technology #### Enhanced Rotating Planetary Pallet – <±1% Uniformity All 900i Series systems can be equipped with KDF’s proprietary ERPP™. In tandem with KDF cathodes, this option achieves better than ±1% uniformity across the pallet and better than 0.5% run-to-run repeatability for dielectrics such as SiO₂ and TiO₂ – compared to ±15-20% for traditional pallets. The ERPP™ is also available with scan velocity profiling for further optimization. Technical Specifications ## Vacuum & Facility Requirements Vacuum Performance Chamber Ultimate≤1 × 10⁻⁷ torr Chamber Leak Rate20 min to 1 × 10⁻⁴ torr HV Dome Ultimate≤1 × 10⁻⁷ torr HV Dome Leak Rate15 min to 1 × 10⁻⁴ torr Pump Down from Atm.≤110 min to 1 × 10⁻⁶ torr Overnight Pump Down2 × 10⁻⁷ torr Loadlock PumpCTI-8 cryo pump Facility Requirements Power208 VAC, 3-phase, 100A Cooling Water6.5 GPM, 70 PSI min Water Temp Range10°C – 24°C Compressed Air85 – 100 PSIG Process Gas25 PSIG, 99.999% purity Pure GasDry N₂ Process Capability Pallet Size12″ × 12″ (304mm × 304mm) Max Substrate Thickness1.5″ (2″ optional) Max Wafer1 × 300mm Target Positions3 or 4 DC Power Supply12 kW (Adv. Energy) RF Power Supply1.25 kW standard System Detail ## Hardware, Controls & Software ### System Hardware - 12 kW low stored energy DC power supplies (Advanced Energy) – optional Pinnacle Plus pulsed DC - Integrated throttling SS VAT valve for upstream or downstream pressure control - MKS multi-component “Smart” 390 and 925 gauges for integrated vacuum measurement - Fully automated self-locking top plate support system - Process gas control: up to 4 MFCs, feedback-controlled capacitance manometer, master/slave gas select, gas ratio control - Stepper motor pallet carrier drive with optical encoder – programmable scan velocity profiling - Low-pressure hydraulics for safety and smooth operation - Loadlock linear sensor – computer-controlled positioning for accuracy and fail-safe - Optional pallet stacker – 6-shelf hanger for 5-pallet sequential operation - 1.25 kW RF solid-state power supply (Advanced Energy) standard - Complies with NFPA 79; CE option available ### Computer & Control System - Windows 10 real-time GUI with 24″ LCD touchscreen on umbilical mobile HI cart - Context-sensitive recipe manager running from Microsoft SQL database - Real-time data display and logging – compatible with Excel, Lotus, and Windows applications - Report generation, remote interface, and printing capability - Optional SECS/GEM connectivity via OPC server interface - Distributed Rockwell Control System – DeviceNet and EtherNet/IP fieldbus - Full maintenance test suite with diagnostic and manual process control - Service-friendly fully enclosed electronic cabinet - Remote PC accessibility via Ethernet for software upgrades and file repair Applications ## Target Markets Defense & Aerospace Medical Devices Compound Semiconductors Space Telecom Hybrid Circuits Optical Communications Emerging Materials Mainstream Silicon Next Steps ## Configure Your 900i System Our process engineers can help you select the right 900i variant, pallet configuration, and cathode options for your application. Download the full datasheet or contact us to start the conversation. [Let’s Talk Process →](/contact-us/) [Download 900i Datasheet →](https://www.kdf.com/wp-content/uploads/2022/09/900i-Series-HR-1.pdf) [📞 (201) 784-5005](tel:+12017845005) [✉ ](mailto:sales@kdf.com) --- ### [What is pvd and sputtering](https://www.kdf.com/products/what-is-pvd-and-sputtering/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** PVD Technology Guide # What Is PVD and Sputtering? Physical Vapor Deposition (PVD) sputtering is the foundation of modern thin film manufacturing – used in semiconductor fabrication, medical device production, photonics, sensors, and more. This guide explains how it works and why KDF’s inline sputtering systems are trusted by manufacturers worldwide. Jump to: [How It Works](#how-it-works) [Geometries](#geometries) [Sputtering Modes](#modes) [Software](#software) [FAQ](#faq) ![Physical vapor deposition PVD sputtering process diagram - KDF Technologies](https://www.kdf.com/wp-content/uploads/2022/09/What-is-PVD-and-Sputtering.png) The Fundamentals ## What Is Physical Vapor Deposition (PVD)? Physical Vapor Deposition (PVD) sputtering is the most widely used method for thin film deposition in semiconductor and industrial manufacturing. A solid target material is physically ejected by ion bombardment and deposited as a precise, uniform thin film onto a substrate in a high vacuum environment. KDF has decades of PVD sputtering experience – with the capability to deposit films ranging from a few angstroms to hundreds of microns across a wide range of materials, substrates, and production environments. ![Simple diagram of a PVD sputtering system showing target, plasma, and substrate](https://www.kdf.com/wp-content/uploads/2022/09/Simple-diagram-of-a-PVD-system.png) Simplified diagram of a PVD sputtering system The Process ## How Does Sputtering Work? Argon gas is introduced into a vacuum chamber and ionized into a plasma. The positively charged argon ions are accelerated toward the target material, where ion bombardment ejects target atoms that then travel through the chamber and deposit as a thin film on the substrate. The result is a precisely controlled thin film with excellent adhesion, purity, and uniformity – qualities that make sputtering the preferred deposition method for high-value substrates in semiconductor, medical device, and advanced materials manufacturing. ![KDF inline sputtering system in production operation](https://www.kdf.com/wp-content/uploads/2026/03/974-internal.jpg) KDF inline sputtering system in production operation Sputtering Configurations ## Sputtering Geometries: Side, Down & Up KDF inline sputtering systems are available in multiple geometric configurations – each optimized for specific substrate types, film requirements, and production environments. ![PVD sputtering system diagram](https://www.kdf.com/wp-content/uploads/2022/09/Simple-diagram-of-a-PVD-system.png)PVD System Overview ![Side sputtering configuration diagram - low particulate inline PVD](https://www.kdf.com/wp-content/uploads/2022/09/Side-sputtering.png)Side Sputtering ![Down sputtering configuration diagram - sub-1% uniformity PVD](https://www.kdf.com/wp-content/uploads/2022/09/Down-sputtering-2.png)Down Sputtering 600i · 744i · 844i Series ### Side Sputtering Targets are mounted on the sides of the chamber, depositing material horizontally onto the substrate. Gravity pulls any particulates away from the substrate surface – making side sputtering the preferred geometry for low-particulate, high-quality PVD thin films in production environments. 900i · 974i Series ### Down Sputtering Targets are mounted above the substrate and deposit material downward. KDF’s down sputter systems achieve sub-1% film uniformity with the planetary pallet option – ideal for applications requiring the tightest thickness tolerances across the substrate. Process Modes ## Sputtering Modes – Explained Modern thin film sputtering encompasses several distinct process modes – each with specific advantages for different materials and applications. All KDF inline sputtering systems support multiple modes on the same platform. DC Magnetron ### DC Magnetron Sputtering The workhorse of production thin film deposition. DC magnetron sputtering uses a magnetic field perpendicular to the electric field to increase plasma ionization efficiency and confine electrons near the target – achieving deposition rates an order of magnitude higher than conventional DC sputtering. A set of magnets mounted behind the target generates the confining magnetic field. Best suited for conductive metals and alloys including aluminum, titanium, copper, and molybdenum. RF Sputtering ### RF Sputtering RF sputtering applies an alternating radio frequency voltage to the target to prevent charge buildup on the target surface. This enables sputtering of insulating and dielectric materials – such as quartz, alumina, and other non-conductive targets – that DC sputtering cannot process. RF sputtering can operate in both diode and magnetron-enhanced configurations, expanding the range of materials that can be deposited on a single platform. Pulsed DC ### Pulsed DC Sputtering Pulsed DC sputtering minimizes arcing and target poisoning during reactive deposition processes. The applied voltage is pulsed at a frequency between 1-360 kHz, with a brief voltage reversal (approximately 1 microsecond) that clears reactive buildup from the target surface before it can form an insulating layer. This results in more stable process conditions, improved film quality, and longer target life when depositing oxides and nitrides. Reactive ### Reactive Sputtering Reactive sputtering introduces a reactive gas – typically oxygen (O₂) or nitrogen (N₂) – into the sputtering chamber during deposition. The reactive gas combines with the sputtered target atoms to form compound thin films directly on the substrate. Common reactive sputtering applications include titanium nitride (TiN) for wear-resistant coatings, aluminum nitride (AlN) for piezoelectric devices, and silicon dioxide (SiO₂) for optical and dielectric applications. Reactive sputtering is compatible with both DC and RF modes. HIPIMS ### HIPIMS – High Power Impulse Magnetron Sputtering HIPIMS is an advanced sputtering technique that uses special high-voltage power supplies to deliver short, extremely high-power pulses – up to megawatt peak power – to the sputtering target. This generates a highly dense, highly ionized plasma that conventional magnetron sputtering cannot achieve. The result is thin films with exceptional density, hardness, surface smoothness, and step coverage in high-aspect-ratio features. KDF has extensive HIPIMS process development experience and has deployed optimized HIPIMS processes in active manufacturing environments. Process Control ## Automated Software Platform All KDF inline sputtering systems feature a fully automated software platform for tool operation and recipe management – controlling power, pressure, gas flows, timing, and substrate transport with full data logging. The platform is versatile out of the box and customizable for specific applications, including HIPIMS pulse programming and multi-step reactive processes. KDF’s engineers work directly with customers to develop and integrate custom process sequences. ![KDF 954i inline sputtering system interior showing process chamber and automation](https://www.kdf.com/wp-content/uploads/2024/08/954i-Interior.png) KDF 954i system interior – fully automated process control Common Questions ## PVD & Sputtering – Frequently Asked Questions What is Physical Vapor Deposition (PVD)? +Physical Vapor Deposition (PVD) is a vacuum-based coating process in which a solid material is vaporized and deposited as a thin film onto a substrate. Sputtering is the most widely used PVD method in semiconductor and industrial manufacturing. PVD thin films can range in thickness from a few angstroms to hundreds of microns and are used in the production of semiconductors, medical devices, optical components, sensors, and more. What is the difference between DC magnetron and RF sputtering? +DC magnetron sputtering uses a direct current electric field combined with a magnetic field to confine the plasma near the target, achieving high deposition rates for conductive metals and alloys. RF sputtering uses a radio frequency alternating voltage to prevent charge buildup, enabling deposition of insulating and dielectric materials that DC cannot process. Both modes can be combined with reactive gases for compound film deposition. What is HIPIMS sputtering and when should I use it? +HIPIMS (High Power Impulse Magnetron Sputtering) uses short, high-power pulses to generate an extremely dense and ionized plasma – producing films with exceptional density, hardness, smoothness, and step coverage. It’s the preferred mode for hard coatings, high-aspect-ratio features, and applications requiring superior film mechanical properties. KDF has extensive production-proven HIPIMS process experience. What is reactive sputtering? +Reactive sputtering introduces a reactive gas (O₂ or N₂) during deposition, causing the sputtered target atoms to form compound films – such as TiN, AlN, or SiO₂ – directly on the substrate. It’s compatible with DC, RF, and Pulsed DC modes. Pulsed DC is typically preferred for reactive processes because it minimizes target poisoning and arcing. What is the difference between side sputtering and down sputtering? +In side sputtering, targets are mounted on chamber walls and deposit horizontally – gravity carries particulates away from the substrate, making it ideal for low-particulate production environments. In down sputtering, targets are above the substrate depositing downward – this geometry excels at achieving very high film uniformity, with KDF’s down sputter systems reaching sub-1% uniformity using a planetary pallet option. What is inline sputtering? +Inline sputtering is a production-oriented PVD architecture where substrates travel through process chambers on pallets in a continuous or batch flow – enabling high-throughput coating of multiple substrates per run with consistent film properties. KDF Technologies specializes exclusively in inline sputtering and operates one of the world’s largest installed bases of inline PVD equipment, with 2,000+ systems deployed globally. Ready to Go Further? ## Talk to a KDF Sputtering Engineer Whether you’re developing a new thin film process or evaluating inline sputtering systems for production, our team can help you select the right platform and validate your process in our Rockleigh, NJ facility. [Request a Quote](/contact-us/) [View Sputtering Systems](/products/in-line-products-kdf-technologies/) --- ### [Careers](https://www.kdf.com/company/careers/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Join Us # Build the Technology Behind Tomorrow’s Devices KDF Technologies – a Kurt J. Lesker Company – is a small, highly specialized team working at the frontier of physical vapor deposition. The work is technical, the problems are real, and the films we help produce end up in medical implants, defense systems, and semiconductor devices worldwide. [View Open Positions](https://lesker.applytojob.com/apply/jobs) [About KDF](/company/about-kdf-technologies-inline-sputtering-equipment/) Why KDF ## What It’s Like to Work Here Technically Deep Work You’ll work on engineering problems that matter – from cathode design and process development to automation and vacuum systems. This isn’t a place where work gets watered down. Small Team, Real Impact KDF is a focused, experienced team. Your contributions are visible, your ideas are heard, and the work you do directly shapes systems that end up in production at NASA, Intel, and leading medical device manufacturers. Backed by KJLC As a Kurt J. Lesker Company, KDF combines the stability and resources of an established global leader in vacuum technology with the focus and culture of a specialized business unit. 35+ Years of Innovation KDF has been advancing inline sputtering technology for over three decades. There’s deep institutional knowledge here – and room to push it further with patented technologies like LMM™, ERPP™, and Upsilon Inset™. ## Open Positions All KDF Technologies positions are posted through the Kurt J. Lesker Company careers portal. Browse current openings and apply directly. [View All Open Positions](https://lesker.applytojob.com/apply/jobs)Hosted by Kurt J. Lesker Company · lesker.applytojob.com --- ### [KDF Worldwide Locations](https://www.kdf.com/company/worldwide-locations-kdf-electronics/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** KDF Technologies # Worldwide *Locations* KDF Technologies and our global network of authorized representatives are ready to support your thin film sputtering needs wherever you are. KDF Headquarters KDF Electronic & Vacuum Services Inc. ![Phone](https://www.kdf.com/wp-content/uploads/2022/09/phone-light.svg) [(201) 784-5005](tel:+12017845005) ![Fax](https://www.kdf.com/wp-content/uploads/2022/09/fax-light.svg) (201) 784-0202 ![Email](https://www.kdf.com/wp-content/uploads/2022/09/envelope-light.svg) ![Address](https://www.kdf.com/wp-content/uploads/2022/09/location-dot-light.svg) [10 Volvo Drive, Rockleigh, NJ 07647](https://goo.gl/maps/z5Fh4fZRmCvKu2AW8) ![KDF Headquarters](https://www.kdf.com/wp-content/uploads/2022/09/Group-129.jpg) Global Network Worldwide Locations KDF Electronics China ![Phone](https://www.kdf.com/wp-content/uploads/2022/09/phone-light.svg) [+86 21 50115900](tel:+862150115900) ![Fax](https://www.kdf.com/wp-content/uploads/2022/09/fax-light.svg) +86 21 50115863 ![Address](https://www.kdf.com/wp-content/uploads/2022/09/location-dot-light.svg) Kurt Lesker (Shanghai) Trading Company Building 31-32, Lane 1000 Zhangheng Road, Pudong New Area Shanghai 201203, P.R. China Europe ![Phone](https://www.kdf.com/wp-content/uploads/2022/09/phone-light.svg) [+44 1424 458 143](tel:+441424458143) ![Email](https://www.kdf.com/wp-content/uploads/2022/09/envelope-light.svg) ![Address](https://www.kdf.com/wp-content/uploads/2022/09/location-dot-light.svg) KDF Technologies Austin House Sidney Little Road Churchfields Industrial Estate St. Leonards on Sea East Sussex TN38 9PU United Kingdom Israel ![Phone](https://www.kdf.com/wp-content/uploads/2022/09/phone-light.svg) [(972)-3-5714333](tel:97235714333) ![Fax](https://www.kdf.com/wp-content/uploads/2022/09/fax-light.svg) (972)-3-5713985 ![Email](https://www.kdf.com/wp-content/uploads/2022/09/envelope-light.svg) ![Address](https://www.kdf.com/wp-content/uploads/2022/09/location-dot-light.svg) G-Electronics 3, Tefutsot Israel Street Givatayim 53583 Israel Japan ![Phone](https://www.kdf.com/wp-content/uploads/2022/09/phone-light.svg) [03-3750-3681](tel:+810337503681) ![Fax](https://www.kdf.com/wp-content/uploads/2022/09/fax-light.svg) 03-3750-2990 ![Email](https://www.kdf.com/wp-content/uploads/2022/09/envelope-light.svg) ![Address](https://www.kdf.com/wp-content/uploads/2022/09/location-dot-light.svg) Izumo Electric Co., Ltd. 4-10-3 Simomaruko ota-ku Tokyo 1460092 Japan Korea ![Phone](https://www.kdf.com/wp-content/uploads/2022/09/phone-light.svg) [201-784-5005](tel:+12017845005) ![Fax](https://www.kdf.com/wp-content/uploads/2022/09/fax-light.svg) 201-784-0202 ![Email](https://www.kdf.com/wp-content/uploads/2022/09/envelope-light.svg) ![Address](https://www.kdf.com/wp-content/uploads/2022/09/location-dot-light.svg) 10 Volvo Drive Rockleigh, NJ 07647 Taiwan ![Phone](https://www.kdf.com/wp-content/uploads/2022/09/phone-light.svg) [(886) 3-520-9637](tel:+88635209637) ![Fax](https://www.kdf.com/wp-content/uploads/2022/09/fax-light.svg) (886) 3-520-9913 ![Email](https://www.kdf.com/wp-content/uploads/2022/09/envelope-light.svg) ![Address](https://www.kdf.com/wp-content/uploads/2022/09/location-dot-light.svg) KDF Taiwan No. 218, Chung-Shan Road HsinChu City, Taiwan India ![Phone](https://www.kdf.com/wp-content/uploads/2022/09/phone-light.svg) [+91 40 23237214](tel:+914023237214) ![Email](https://www.kdf.com/wp-content/uploads/2022/09/envelope-light.svg) ![Address](https://www.kdf.com/wp-content/uploads/2022/09/location-dot-light.svg) Electronic Enterprises (India) Pvt Ltd. 216, Regal Industrial Estate Acharya Donde Marg, Sewri Mumbai 400015 ![Phone](https://www.kdf.com/wp-content/uploads/2022/09/phone-light.svg) [+91 22 24137096](tel:+912224137096) – S.K. Joglekar: Mumbai ![Email](https://www.kdf.com/wp-content/uploads/2022/09/envelope-light.svg) ![Phone](https://www.kdf.com/wp-content/uploads/2022/09/phone-light.svg) [+91 80 23380451](tel:+918023380451) – V.P. Raut: Bangalore ![Email](https://www.kdf.com/wp-content/uploads/2022/09/envelope-light.svg) Malaysia · Philippines · Indonesia · Singapore ![Phone](https://www.kdf.com/wp-content/uploads/2022/09/phone-light.svg) [(65) 6248 3818](tel:+6562483818) ![Email](https://www.kdf.com/wp-content/uploads/2022/09/envelope-light.svg) [mavis\_tai@premier-sols.com](mailto:mavis_tai@premier-sols.com) ![Address](https://www.kdf.com/wp-content/uploads/2022/09/location-dot-light.svg) Premier Solutions Pte Ltd. 100 AM, #16-01 Singapore 079027 Contact: Mavis Tai, General Manager ![Website](https://www.kdf.com/wp-content/uploads/2022/09/globe-light.svg) [www.premier-sols.com](https://www.premier-sols.com/) Get in Touch ## Need to Reach *KDF Directly?* Our headquarters team is available to support sales, service, and technical inquiries worldwide. [Contact Us →](/contact-us/) --- ### [KDF Clientele](https://www.kdf.com/company/kdf-clientele/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Who We Work With # Trusted By the Industries Where *Thin Films Matter Most* KDF systems are installed across the globe – in cleanrooms, production lines, and R&D labs at some of the world’s most demanding companies. From compound semiconductors to life-saving implantables, our customers share one thing: they can’t afford a process that isn’t right. 100s Systems Installed Globally 6 Industry Verticals 35+ Years in Production Global Americas · Europe · Asia A Sample of Our Customers ## Companies That Rely on KDF KDF systems are in production at organizations ranging from Fortune 500 semiconductor manufacturers to specialized medical device companies and government research programs. NASA IBM Intel HP Lockheed Martin Northrop Grumman And hundreds of medical device, photonics, compound semiconductor, and defense manufacturers worldwide. Markets We Serve ## If Your Process Requires Precise Thin Films, We Have a Solution KDF systems are configured for virtually any PVD application. The industries below represent our deepest application experience – but if your market isn’t listed, that’s not a signal. [Talk to us about your process.](/contact-us/) Medical Medical Devices Corrosion, wear, and body rejection are the defining challenges of medical device manufacturing. KDF sputtering systems are in active production at leading medical device companies depositing biocompatible and functional films on implants, surgical instruments, drug delivery systems, and optical medical devices. Applications include diamond-like carbon (DLC) for wear resistance and osseointegration, hard biocompatible coatings protecting both implant and surrounding tissue, surface modification on surgical instruments, and optical filter coatings for imaging and diagnostics. AuTiWIrAgZrTaTaNTiTiNDLC [Learn more →](/products/in-line-products-kdf-technologies/kdf-medical-device-in-line-sputter-coating-technology/) Implantables Hermetic Sealing & Biocompatible Implants Hermetic sealing plays a pivotal role in the longevity of implantable devices – preventing ingress of bodily fluids, gases, and particles while remaining compatible with human tissue over decades. KDF’s precision deposition enables uniform, defect-free barrier layers essential to device reliability. Devices that depend on KDF-produced hermetic thin films: Pacemakers Cochlear Implants ICDs Neurostimulators Biosensors Drug Delivery Si₃N₄Al₂O₃PtAuPd [Learn more →](/products/in-line-products-kdf-technologies/kdf-hermetic-sealing-feedthroughs/) Semiconductor Compound Semiconductors KDF has hundreds of systems installed in the compound semiconductor sector globally – one of the deepest installed bases of any market we serve. III-V materials like GaAs, InP, and GaN present demanding process requirements: precise metallization stacks, temperature-sensitive substrates, and tight uniformity requirements across the full wafer or pallet. KDF’s inline batch architecture delivers the throughput compound semiconductor production demands, while ERPP™ and LMM™ cathode technology deliver the film quality the process requires. GaAsInPGaNTi/AuTiWAuGe [View systems →](/products/in-line-products-kdf-technologies/) Photonics Photonics, Laser Diodes & Quantum Photonic and quantum devices demand film uniformity and stoichiometry control that leaves no margin for drift. KDF’s Plasma Emission Monitoring (PEM) provides real-time reactive gas control for the dielectric and TCO films that define photonic device performance. KDF systems achieve near-metallic deposition rates for SiO₂ – forming nearly 1 micron in 15 minutes vs. ~5 hours by conventional RF sputtering. KDF has also developed a negative sputter ion beam approach for depositing super-smooth ITO with highly transparent and conductive properties at near-room temperature. ITOAlNSiO₂Si₃N₄Al-ZnOAl₂O₃ [Learn more →](/products/in-line-products-kdf-technologies/kdf-laser-diodes-photonics-quantumtechnology/) Components Integrated Passive Devices & Thin Film Circuits Integrated passive devices and thin film circuits require the most consistent run-to-run film properties of any application – because even small variations in resistivity, thickness, or stoichiometry directly shift component values and circuit performance. KDF’s sub-1% uniformity (ERPP™), ARA target wear compensation, and PEM reactive control are the enabling technologies for this market. Batch inline throughput means production economics work without sacrificing process discipline. TaNNiCrSiO₂Si₃N₄TiAu [Learn more →](/products/in-line-products-kdf-technologies/kdf-integrateddevices-components-thin-film-circuits/) Sensing Sensors & Monitoring KDF Technologies has a long history supplying thin film sputtering systems to the reed switch and sensing market. Modern sensors increasingly depend on sputtered thin films for their core function – from polyaniline chemical sensors to high-temperature PdCr strain gauges operating up to 1100°C, to waveguide-based optical chemical sensors. KDF’s process stability and material flexibility support the full breadth of sensing applications, from MEMS-scale devices to large-area environmental monitors. PdCrAuTiTiNTaN [Learn more →](/products/in-line-products-kdf-technologies/kdf-sensors-and-monitoring/) Also in Our Portfolio #### Wear Coatings & Hard Surface Applications HIPIMS enables highly dense, smooth, and adherent films with superior conformality – the defining requirement for protective wear coatings on cutting tools, precision components, and high-wear surfaces. [Learn more →](/products/in-line-products-kdf-technologies/kdf-wear-coatings/) Not Listed? That’s Not a Signal. #### Mainstream Silicon, FPD, Solar, R&D & More KDF systems are also deployed in mainstream silicon, flat panel display, solar, optical communications, and academic R&D environments. If your application isn’t listed, contact us to discuss your process. [Talk to Us →](/contact-us/) Defense & Aerospace ## Trusted by NASA, Lockheed Martin & Northrop Grumman These programs require not just process performance but full documentation, standards compliance, and quality management systems built to MIL-spec rigor. KDF’s manufacturing operates under a documented MIL-spec quality system – providing the audit trail and process documentation that defense and aerospace customers require. KDF systems meet or exceed UL, CE, and SEMI S2-0200 industry standards. NASA Space systems, satellite components, precision optical coatings Lockheed Martin Defense electronics, advanced materials, aerospace components Northrop Grumman Defense systems, sensors, mission-critical thin film applications Worldwide ## KDF Systems Are Installed Across the Globe Production facilities, research institutions, and government programs in North America, Europe, and Asia rely on KDF inline sputtering systems for daily production. Americas North American headquarters with primary engineering, manufacturing, and support based in Rockleigh, NJ. Serving semiconductor, medical device, and defense customers across the U.S. and Canada. Europe Installations across Western and Northern Europe serving photonics, compound semiconductor, and medical device manufacturers with the same application engineering support as domestic customers. Asia-Pacific Compound semiconductor and flat panel display customers across the Asia-Pacific region, with systems operating in volume production environments across multiple countries. Work With KDF ## Is Your Application on This List? If your process involves high-value substrates, demanding film specs, or geometries that most systems can’t handle – let’s talk. [Request a Consultation →](/contact-us/) [View Products →](/products/in-line-products-kdf-technologies/)### WHO WE WORK WITH ## Our Clients KDF systems are installed around the globe , we have hundreds of system installed in the Compound Semiconductor sector, along with Military, Medical, Solar, Photonics, and pure R&D efforts. Here is a small sample of just some of our customers. ![nasa logo (300 × 300 px)](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-300-×-300-px.png "nasa logo (300 × 300 px)") ![IBM (300 × 300 px) (1)](https://www.kdf.com/wp-content/uploads/2022/09/IBM-300-×-300-px-1-1.png "IBM (300 × 300 px) (1)") ![HP (300 × 300 px) (3)](https://www.kdf.com/wp-content/uploads/2022/09/HP-300-×-300-px-3-1.png "HP (300 × 300 px) (3)") ![Intel (300 × 300 px) (4)](https://www.kdf.com/wp-content/uploads/2022/09/Intel-300-×-300-px-4-1.png "Intel (300 × 300 px) (4)") ![Lockheed](https://www.kdf.com/wp-content/uploads/2022/10/Lockheed-300-×-300-px-5.png "Lockheed-(300-×-300-px)-(5)") ![Northrop-Grumman](https://www.kdf.com/wp-content/uploads/2022/10/Northrop-Grumman.png "Northrop-Grumman") ![nasa logo (-1](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-1-1.png "nasa logo (-1") ![IBM (-1](https://www.kdf.com/wp-content/uploads/2022/09/IBM-1-1.png "IBM (-1") ![HP (-1](https://www.kdf.com/wp-content/uploads/2022/09/HP-1-1.png "HP (-1") ![Intel (-1](https://www.kdf.com/wp-content/uploads/2022/09/Intel-1-1.png "Intel (-1") ![Lockheed (-2](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-2-1.png "Lockheed (-2") ![Northrop Grumman (-2](https://www.kdf.com/wp-content/uploads/2022/09/Northrop-Grumman-2.png "Northrop Grumman (-2") ![nasa logo (-2](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-2-1.png "nasa logo (-2") ![IBM (-2](https://www.kdf.com/wp-content/uploads/2022/09/IBM-2-1.png "IBM (-2") ![HP (-2](https://www.kdf.com/wp-content/uploads/2022/09/HP-2-1.png "HP (-2") ![Intel (-2](https://www.kdf.com/wp-content/uploads/2022/09/Intel-2-1.png "Intel (-2") ![Lockheed (-4](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-4-1.png "Lockheed (-4") ![Northrop Grumman (-4](https://www.kdf.com/wp-content/uploads/2022/09/Northrop-Grumman-4.png "Northrop Grumman (-4") ![samsung](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-300-×-300-px-1.png "nasa logo (300 × 300 px)") ![IBM (-6](https://www.kdf.com/wp-content/uploads/2022/09/IBM-6-1.png "IBM (-6") ![HP (-6](https://www.kdf.com/wp-content/uploads/2022/09/HP-6.png "HP (-6") ![Intel (-6](https://www.kdf.com/wp-content/uploads/2022/09/Intel-6.png "Intel (-6") ![Lockheed (-6](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-6.png "Lockheed (-6") ![Northrop Grumman (-6](https://www.kdf.com/wp-content/uploads/2022/09/Northrop-Grumman-6.png "Northrop Grumman (-6") ![client](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-300-×-300-px-2.png "nasa logo (300 × 300 px)") ![client](https://www.kdf.com/wp-content/uploads/2022/09/IBM-7-1.png "IBM (-7") ![client](https://www.kdf.com/wp-content/uploads/2022/09/HP-7-1.png "HP (-7") ![client](https://www.kdf.com/wp-content/uploads/2022/09/Intel-7-1.png "Intel (-7") ![client](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-7-1.png "Lockheed (-7") ![client](https://www.kdf.com/wp-content/uploads/2022/09/Northrop-Grumman-7.png "Northrop Grumman (-7") ![client](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-3-1.png "nasa logo (-3") ![client](https://www.kdf.com/wp-content/uploads/2022/09/IBM-3.png "IBM (-3") ![client](https://www.kdf.com/wp-content/uploads/2022/09/HP-3.png "HP (-3") ![client](https://www.kdf.com/wp-content/uploads/2022/09/Intel-3.png "Intel (-3") ![client](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-1-1.png "Lockheed (-1") ![client](https://www.kdf.com/wp-content/uploads/2022/09/Northrop-Grumman-1.png "Northrop Grumman (-1") ![client](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-4.png "nasa logo (-4") ![client](https://www.kdf.com/wp-content/uploads/2022/09/IBM-9-1.png "IBM (-9") ![client](https://www.kdf.com/wp-content/uploads/2022/09/HP-4-1.png "HP (-4") ![client](https://www.kdf.com/wp-content/uploads/2022/09/Intel-4-1.png "Intel (-4") ![client](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-3-1.png "Lockheed (-3") ![client](https://www.kdf.com/wp-content/uploads/2022/09/HP-12-1.png "HP (-12") ![client](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-5.png "nasa logo (-5") ![client](https://www.kdf.com/wp-content/uploads/2022/09/IBM-5.png "IBM (-5") ![client](https://www.kdf.com/wp-content/uploads/2022/09/HP-5.png "HP (-5") ![client](https://www.kdf.com/wp-content/uploads/2022/09/Intel-5.png "Intel (-5") ![client](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-5-1.png "Lockheed (-5") ![client](https://www.kdf.com/wp-content/uploads/2022/09/Northrop-Grumman-2-1.png "Northrop Grumman (-2") ![nasa logo (-8](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-8.png "nasa logo (-8") ![IBM (-8](https://www.kdf.com/wp-content/uploads/2022/09/IBM-8.png "IBM (-8") ![HP (-8](https://www.kdf.com/wp-content/uploads/2022/09/HP-8.png "HP (-8") ![Intel (-8](https://www.kdf.com/wp-content/uploads/2022/09/Intel-8.png "Intel (-8") ![Lockheed (-8](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-8.png "Lockheed (-8") ![Northrop Grumman (-8](https://www.kdf.com/wp-content/uploads/2022/09/Northrop-Grumman-8.png "Northrop Grumman (-8") ![nasa logo (-9](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-9.png "nasa logo (-9") ![client](https://www.kdf.com/wp-content/uploads/2022/09/IBM-9-1.png "IBM (-9") ![HP (-9](https://www.kdf.com/wp-content/uploads/2022/09/HP-9-1.png "HP (-9") ![Intel (-9](https://www.kdf.com/wp-content/uploads/2022/09/Intel-9-1.png "Intel (-9") ![Lockheed (-9](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-9.png "Lockheed (-9") ![Northrop Grumman (-9 (1)](https://www.kdf.com/wp-content/uploads/2022/09/Northrop-Grumman-9-1.png "Northrop Grumman (-9 (1)") ![nasa logo (-10](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-10.png "nasa logo (-10") ![IBM (-10](https://www.kdf.com/wp-content/uploads/2022/09/IBM-10-1.png "IBM (-10") ![HP (-10](https://www.kdf.com/wp-content/uploads/2022/09/HP-10-1.png "HP (-10") ![Intel (-10](https://www.kdf.com/wp-content/uploads/2022/09/Intel-10-1.png "Intel (-10") ![Lockheed (-10](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-10.png "Lockheed (-10") ![Northrop Grumman (-11](https://www.kdf.com/wp-content/uploads/2022/09/Northrop-Grumman-11.png "Northrop Grumman (-11") ![nasa logo (-11](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-11.png "nasa logo (-11") ![IBM (-11](https://www.kdf.com/wp-content/uploads/2022/09/IBM-11-1.png "IBM (-11") ![HP (-11](https://www.kdf.com/wp-content/uploads/2022/09/HP-11-1.png "HP (-11") ![Intel (-11](https://www.kdf.com/wp-content/uploads/2022/09/Intel-11.png "Intel (-11") ![Lockheed (-11](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-11.png "Lockheed (-11") ![Northrop Grumman (-12](https://www.kdf.com/wp-content/uploads/2022/09/Northrop-Grumman-12.png "Northrop Grumman (-12") ![nasa logo (-12](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-12.png "nasa logo (-12") ![IBM (-12](https://www.kdf.com/wp-content/uploads/2022/09/IBM-12-1.png "IBM (-12") ![nasa logo (-14](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-14.png "nasa logo (-14") ![Northrop Grumman (-13](https://www.kdf.com/wp-content/uploads/2022/09/Northrop-Grumman-13.png "Northrop Grumman (-13") ![Lockheed (-12](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-12.png "Lockheed (-12") ![IBM (-14](https://www.kdf.com/wp-content/uploads/2022/09/IBM-14.png "IBM (-14") ![nasa logo (-13](https://www.kdf.com/wp-content/uploads/2022/09/nasa-logo-13.png "nasa logo (-13") ![IBM (-13](https://www.kdf.com/wp-content/uploads/2022/09/IBM-13.png "IBM (-13") ![HP (-13](https://www.kdf.com/wp-content/uploads/2022/09/HP-13-1.png "HP (-13") ![Intel (-2](https://www.kdf.com/wp-content/uploads/2022/09/Intel-2-1.png "Intel (-2") ![Lockheed (-13](https://www.kdf.com/wp-content/uploads/2022/09/Lockheed-13-1.png "Lockheed (-13") --- ### [Inline Sputtering Systems Product Literature](https://www.kdf.com/company/inline-sputtering-systems-product-literature/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** ## Product Literature ### INFORMATION ## KDF Product Literature ![prodlit-600-thumbnail](https://www.kdf.com/wp-content/uploads/2022/09/prodlit-600-thumbnail.jpg "prodlit-600-thumbnail") ### 600 Series [DOWNLOAD ![download](/wp-content/uploads/2022/09/download-solid.svg)](/wp-content/uploads/2022/09/600i-Series-HR.pdf) ![prodlit-744-thumbnail](https://www.kdf.com/wp-content/uploads/2022/09/prodlit-744-thumbnail.jpg "prodlit-744-thumbnail") ### 744i Series [DOWNLOAD ![download](/wp-content/uploads/2022/09/download-solid.svg)](/wp-content/uploads/2022/09/744i-Series-HR.pdf) ![prodlit-844-thumbnail](https://www.kdf.com/wp-content/uploads/2022/09/prodlit-844-thumbnail.jpg "prodlit-844-thumbnail") ### 844i Series [DOWNLOAD ![download](/wp-content/uploads/2022/09/download-solid.svg)](/wp-content/uploads/2022/09/844i-Series-HR.pdf) ![prodlit-900-thumbnail](https://www.kdf.com/wp-content/uploads/2022/09/prodlit-900-thumbnail.jpg "prodlit-900-thumbnail") ### 900i Series [DOWNLOAD ![download](/wp-content/uploads/2022/09/download-solid.svg)](/wp-content/uploads/2022/09/900i-Series-HR.pdf) ![prodlit-974](https://www.kdf.com/wp-content/uploads/2022/09/prodlit-974.jpg "prodlit-974") ### 974i Series [DOWNLOAD ![download](/wp-content/uploads/2022/09/download-solid.svg)](/wp-content/uploads/2022/09/974i-Series-HR.pdf) ![prodlit-plc](https://www.kdf.com/wp-content/uploads/2022/09/prodlit-plc.jpg "prodlit-plc") ### PLC Retrofit [DOWNLOAD ![download](/wp-content/uploads/2022/09/download-solid.svg)](/wp-content/uploads/2022/09/PLC-Retrofit-HR.pdf) ![prodlit-spareparts-thumbnail](https://www.kdf.com/wp-content/uploads/2022/09/prodlit-spareparts-thumbnail.jpg "prodlit-spareparts-thumbnail") ### Spare Parts [DOWNLOAD ![download](/wp-content/uploads/2022/09/download-solid.svg)](/wp-content/uploads/2022/09/Spare-Parts.pdf) ![prodlit-cluster-thumbnail](https://www.kdf.com/wp-content/uploads/2022/09/prodlit-cluster-thumbnail.jpg "prodlit-cluster-thumbnail") ### Ci Cluster [DOWNLOAD ![download](/wp-content/uploads/2022/09/download-solid.svg)](/wp-content/uploads/2022/09/Ci-Cluster-Tool.pdf) ![prodlit-retrofit-thumbnail](https://www.kdf.com/wp-content/uploads/2022/09/prodlit-retrofit-thumbnail.jpg "prodlit-retrofit-thumbnail") ### Backing Plates [DOWNLOAD ![download](/wp-content/uploads/2022/09/download-solid.svg)](/wp-content/uploads/2022/09/Target-Backing-Plates.pdf) ![prodlit-plc-1](https://www.kdf.com/wp-content/uploads/2022/09/prodlit-plc-1.jpg "prodlit-plc-1") ### Retrofit Kits [DOWNLOAD ![download](/wp-content/uploads/2022/09/download-solid.svg)](/wp-content/uploads/2022/09/Retrofit-Kits.pdf) --- ### [Events](https://www.kdf.com/company/events/) **Published:** August 24, 2022 **Author:** Vishal Agrawal **Content:** KDF Events KDF EVENTS Upcoming Events \[events\_list\] --- ### [Benefits Of Buying Sputtering Equipment From KDF](https://www.kdf.com/company/benefits-of-buying-sputtering-equipment-from-kdf/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Why KDF Technologies # When Your Substrates Can’t Afford *a Second Try* Medical implants. Compound semiconductors. Photonics. Precision defense components. The industries that trust KDF are defined by substrate cost, process sensitivity, and zero tolerance for failure. We engineer for that reality. <1% Film Uniformity (ERPP) 600+ Man-Years PVD Expertise 35+ Years in Production 100% Factory Process-Qualified Core Capabilities ## Built for the Hardest Thin Film Problems Every KDF system is engineered around a simple premise: your substrate is valuable, your process tolerances are tight, and your production schedule cannot absorb rework. These are the capabilities that make that possible. 01 ### Sub-1% Film Uniformity KDF’s proprietary ERPP™ (Enhanced Rotating Planetary Pallet) achieves exceptionally tight uniformity – independently validated to sub-1% – critical for dielectric stacks, TCO films, and multilayer PVD processes where thickness variation directly impacts device yield. ERPP™ · Linear Scanning · Velocity Profiling 02 ### Substrate-Safe Processing Sensitive substrates – biocompatible implant components, fragile III-V wafers, temperature-limited assemblies – require precise thermal management. KDF systems feature water-cooled chambers, shields and cathodes, and integrated IR pyrometer pallet temperature measurement with recipe-controlled hold steps. IR Temp Monitoring · Water Cooling 03 ### Precious Metal Deposition KDF’s Upsilon Inset™ cathode is purpose-engineered for high thermal conductivity, high-value target materials – Gold, Platinum, Palladium, Silver. The LMM™ magnetron’s full-face erosion maximizes target utilization, minimizing waste on materials that cost more than the system run. Upsilon Inset™ · LMM™ 04 ### HIPIMS for Dense, Hard Films High Power Impulse Magnetron Sputtering produces highly dense, smooth, and adherent films with superior conformality for high-aspect-ratio geometries – essential for wear coatings, barrier layers, and applications where standard DC magnetron sputtering cannot achieve the required film density or step coverage. HIPIMS · Pulsed DC 05 ### Reactive Process Control KDF’s Plasma Emission Monitoring (PEM) actively controls reactive gas flow in real time, maintaining deposition rate and film stoichiometry run-to-run. Optimally designed gas rings and precision MFCs positioned close to injection ports eliminate transients that destroy batch-to-batch repeatability in reactive nitride and oxide processes. PEM · Pulsed DC · RF Reactive 06 ### Run-to-Run Process Stability Auto Rate Adjust (ARA) automatically compensates scan speed or deposition power as a target wears – maintaining a stable, calibrated process from first run to end-of-target-life. Combined with scan velocity profiling and PEM, your process holds. ARA · Scan Velocity Control · PEM 07 ### 3D and Complex Part Loading Parts up to 4 inches in thickness can be loaded into tall horizontal 900-series systems. Pallets accommodate total loaded weights up to 150 lbs – supporting production of pacemaker housings, hermetic feedthroughs, and other non-planar geometries without fixturing compromises that affect film quality. 900 Series · Horizontal Loading · 150 lb Capacity 08 ### In-House Process Development KDF’s R&D team has deep expertise in thin film engineering, device physics, and process integration. Our in-house metrology center, fully functional PVD tools, and tool SEM mean you’re not developing a novel reactive nitride or new dielectric stack alone in production. Metrology Center · Tool SEM · Applications Engineering Markets We Serve ## Applications That Demand This Level of Precision KDF systems are installed globally across the industries where thin film failure is not an option. #### Medical Devices Pacemakers, cochlear implants, ICDs, neurostimulators – hermetic sealing & biocompatible films #### Compound Semiconductors III-V wafers, GaN, InP – hundreds of KDF systems installed globally in this sector #### Photonics & Quantum Laser diodes, optical components, quantum devices – ITO, AlN, ultra-uniform dielectric films #### Integrated Passive Devices IPDs, thin film circuits, resistors – demanding uniformity and tight process control #### Sensors & MEMS MEMS sensors, pressure transducers, environmental monitors – stable, calibrated thin films #### Defense & Aerospace NASA, Lockheed Martin, Northrop Grumman – MIL-spec processes, documented and repeatable Process Depth ## Every Sputtering Mode. Every Material Class. KDF systems are configured for any combination of sputtering mode, substrate geometry, and material – so as your process evolves, your platform doesn’t become a constraint. ### Sputtering Modes - DC Magnetron Sputtering - RF Sputtering (in-house tuned matching networks) - Pulsed DC Sputtering - Reactive Sputtering (with PEM feedback control) - HIPIMS (High Power Impulse Magnetron Sputtering) ### Material Capabilities - Precious metals: Au, Pt, Pd, Ag - Refractory metals: Ti, TiW, Ta, Zr, Ir, Al - Nitrides: TiN, TaN, AlN, Si₃N₄ - Oxides: SiO₂, Al₂O₃, ITO, Al-doped ZnO - Dielectrics at high metallic deposition rates ### System Geometries - Side sputtering – 600i, 744i, 844i Series - Down sputtering – 900i, 974i Series - Deposition areas from 12×12″ to 26×30″ - 3D parts up to 4″ substrate thickness - High-vacuum loadlock + pre-heat option ### Process Control Options - Plasma Emission Monitoring (PEM) - Auto Rate Adjust (ARA) – target wear compensation - Scan velocity profiling - IR pyrometer pallet temperature measurement - Rockwell Automation iSeries PLC Trusted By Industry Leaders NASA IBM Intel HP Lockheed Martin Northrop Grumman And hundreds of medical device, photonics, and compound semiconductor manufacturers worldwide Common Questions ## Frequently Asked Questions What makes KDF suitable for high-value substrate applications like medical implants?+KDF systems are designed from the ground up for substrate protection. Water cooling on chambers, shields, and cathodes controls thermal load throughout the process. Integrated IR pyrometer pallet temperature measurement gives real-time feedback with recipe-controlled hold steps. HIPIMS allows dense film deposition at lower average power, reducing heat input to sensitive substrates. These features are why leading medical device manufacturers choose KDF for depositing biocompatible films on implantable components. What film uniformity can KDF systems achieve?+KDF’s proprietary ERPP™ (Enhanced Rotating Planetary Pallet) achieves uniformity in the sub-1% range on 900-series platforms, validated in peer-reviewed literature (Vacuum Technology and Coating, December 2002). This is achieved by combining ERPP planetary rotation with the tool’s linear scanning and scan velocity profiling – giving precise uniformity control across the full pallet area for both metals and dielectrics. Can KDF deposit precious metals without excessive material waste?+Yes. KDF’s Upsilon Inset™ cathode is specifically engineered for high thermal conductivity, high-value target materials – Gold, Platinum, Palladium, and Silver. Combined with the LMM™ (Linearly Moving Magnetron) which achieves full-face target erosion rather than the deep groove erosion of a stationary magnetron, KDF maximizes target utilization and reduces cost-per-run on materials that represent significant process cost. How does KDF maintain process repeatability as targets wear?+Three interlocked systems address this. Auto Rate Adjust (ARA) automatically compensates scan speed or deposition power for the decrease in rate as a target wears. Plasma Emission Monitoring (PEM) provides real-time closed-loop control of reactive gas concentration. The LMM™ cathode’s full-face erosion profile means deposition characteristics change predictably over target life – together ensuring run-to-run repeatability from a fresh target through end-of-life without manual intervention. Does KDF provide process development support before system purchase?+Yes. KDF has an in-house R&D team with deep experience in thin film engineering, device physics, process development, and process integration. We operate a metrology center and fully functional KDF PVD tools for development – including a tool SEM. To discuss your application, contact Dr. Ammar Derraa, Director of Technology, at or (201) 784-5005 ext. 632. Work With KDF ## Let’s Talk About Your Process Tell us your substrate, your film stack, and your throughput requirements. We’ll tell you exactly how KDF can solve it. [Request a Consultation →](/contact-us/) [View Products →](/products/in-line-products-kdf-technologies/) --- ### [Sputtering Products](https://www.kdf.com/products/in-line-products-kdf-technologies/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** KDF Technologies · Sputtering Systems # Inline PVD *Sputtering* Systems A complete family of inline physical vapor deposition sputtering systems – from compact R&D-capable platforms to high-throughput production tools. All engineered for consistent, repeatable thin film coatings your process demands. [Request a Quote →](/contact-us/) [What Is PVD? →](/products/what-is-pvd-and-sputtering/) Process Modes: DC Magnetron RF Sputtering Pulsed DC Reactive HIPIMS ![KDF inline PVD sputtering system interior](https://www.kdf.com/wp-content/uploads/2026/03/974-internal.jpg) [All Systems](/products/in-line-products-kdf-technologies/) | [600i Series](/products/in-line-products-kdf-technologies/600-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [744i Series](/products/in-line-products-kdf-technologies/744-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [844i Series](/products/in-line-products-kdf-technologies/844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [900i Series](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [974i Series](/products/in-line-products-kdf-technologies/974i-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [Ci Cluster Tool](/products/in-line-products-kdf-technologies/ci-cluster-tool/) KDF Sputtering Systems ## Choose the Right Platform for Your Process Every KDF inline sputtering system is built on decades of MRC and KDF engineering heritage – redesigned and improved to meet today’s most demanding thin film applications. All systems are customizable to your substrate, film stack, and throughput requirements. Flagship ![KDF 974i Series Inline Sputtering System](https://www.kdf.com/wp-content/uploads/2026/03/974-internal.jpg) Gen 2.5 Capable · Down Sputter · Flagship 974i Series Large-format down sputter – the highest-performance platform in the KDF lineup - 20 × 20 inch pallet area - 4 target system - Sub-1% uniformity with ERPP™ planetary pallet - HIPIMS capable – ultra-dense film architecture - PEM reactive gas control for dielectric precision DC Magnetron RF Pulsed DC Reactive HIPIMS [View 974i Full Specifications →](/products/in-line-products-kdf-technologies/974i-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) ![KDF 900i Series Inline Sputtering System](https://www.kdf.com/wp-content/uploads/2024/08/954i-Interior.png) Down Sputter · Sub-1% Uniformity 900i Series Models: 903i, 943i, 943ix, 954i, 954ix - 12 × 12 inch pallet area - 3 or 4 target configuration - Sub-1% uniformity with planetary pallet option - Full-production down sputter architecture DC Magnetron RF Pulsed DC Reactive HIPIMS [View 900i Full Specifications →](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) ![KDF 844i Series Inline Sputtering System](https://www.kdf.com/wp-content/uploads/2026/03/844-external.jpg) Gen 3.5 Capable · Highest Throughput 844i Series Largest pallet area in the KDF lineup - 26.5 × 30 inch pallet area - 4 target system - Low particulate side sputter architecture - Maximum throughput for high-volume production DC Magnetron RF Pulsed DC Reactive HIPIMS [View 844i Full Specifications →](/products/in-line-products-kdf-technologies/844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) ![KDF 744i Series Inline Sputtering System](https://www.kdf.com/wp-content/uploads/2026/03/744-external.jpg) Gen 2 Capable · Side Sputter 744i Series Production-grade side sputter platform - 19 × 19 inch pallet area - 4 target system - Low particulate side sputter advantage - High quality PVD thin films DC Magnetron RF Pulsed DC Reactive HIPIMS [View 744i Full Specifications →](/products/in-line-products-kdf-technologies/744-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) ![KDF 600i Series Compact Inline Sputtering System](https://www.kdf.com/wp-content/uploads/2026/03/643-external.jpg) Side Sputter · Compact Platform 600i Series Models: 603i, 643i, 643ix, 654i, 654ix - 13 × 13 inch pallet area - 3 or 4 target configuration - LMM™ cathode available on ix series - Ideal for sensitive, low-particulate applications RF Pulsed DC Reactive HIPIMS [View 600i Full Specifications →](/products/in-line-products-kdf-technologies/600-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) ![KDF Ci Cluster Tool Multi-Chamber Sputtering System](https://www.kdf.com/wp-content/uploads/2026/03/974-internal.jpg) Cluster Architecture · Multi-Chamber Ci Cluster Modular multi-process cluster tool - Multi-chamber cluster architecture - Combines sputtering, etch, and CVD processes - Robotic substrate handling - Configurable for complex multi-step processes DC Magnetron RF Reactive Etch [View Ci Cluster Details →](/products/in-line-products-kdf-technologies/ci-cluster-tool/) Process Capabilities ## Five Sputtering Modes. One Platform Family. All KDF inline sputtering systems support multiple deposition modes – giving process engineers the flexibility to deposit a wide range of metals, alloys, oxides, and nitrides on the same platform. ### DC Magnetron High-rate deposition of conductive metals and alloys. The workhorse mode for semiconductor and industrial production. ### RF Sputtering Enables deposition of insulating and dielectric materials where DC sputtering is not applicable. ### Pulsed DC Reduces arcing during reactive sputtering of oxides and nitrides – improving film quality and process stability. ### Reactive Introduces reactive gases (O₂, N₂) during deposition to form compound films such as TiN, AlN, and SiO₂. ### HIPIMS High-power impulse magnetron sputtering for ultra-dense, high-adhesion films with exceptional surface quality. Beyond the System ## Parts, Service & Process Support KDF doesn’t just sell equipment – we back every system with the deepest service and support network in inline sputtering. ### OEM Parts & Spares Original KDF and MRC replacement parts, sputter targets, cathodes, backing plates, and upgrade kits – all from the authorized source. [View Parts →](/products/original-oem-parts/)### Service & Support Field service, repair, training, and thin film process development from engineers with 600+ man-years of MRC/KDF equipment experience. [View Services →](/products/services-inline-sputtering-systems/)### Pre-Owned Systems Remanufactured KDF and MRC inline sputtering systems – fully refurbished and supported with the same warranty and service as new equipment. [View Pre-Owned →](/products/in-line-products-kdf-technologies/pre-owned-remanufactured-inline-sputtering-systems-kdf/) Let’s Talk ## Not Sure Which System Is Right for You? Our engineers can help you match the right KDF platform to your substrate, film stack, pallet size, and throughput requirements – and validate your process in our Rockleigh, NJ facility before you commit. [Request a Quote →](/contact-us/) [Thin Film Services →](/products/services-inline-sputtering-systems/thin-film-services-kdf-electronics/) --- ### [600 Series Vertical Sputtering Batch System](https://www.kdf.com/products/in-line-products-kdf-technologies/600-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** Entry Production Series # *600i* Series Vertical Batch Sputtering System Dual load lock, in-line RF/DC side sputtering batch systems built for sensitive applications requiring the lowest defect rates. Full KDF process heritage in a compact, cost-effective platform. [Request a Quote →](/contact-us/) [Download Datasheet →](https://www.kdf.com/wp-content/uploads/2022/09/600i-Series-HR-1.pdf) Pallet Size 12″ × 12″ Target Positions 3 or 4 Wafer Capacity Up to 36 × 2″ Series 603i · 643i · 654i · ix ![KDF 600i Series Sputtering System](https://www.kdf.com/wp-content/uploads/2026/03/643-external.jpg) [600i Series](/products/in-line-products-kdf-technologies/600-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [744i Series](/products/in-line-products-kdf-technologies/744-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [844i Series](/products/in-line-products-kdf-technologies/844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [900i Series](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [974i Series](/products/in-line-products-kdf-technologies/974i-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [Ci Cluster Tool](/products/in-line-products-kdf-technologies/ci-cluster-tool/) System Overview ## Built for Sensitive Applications The 600i Series is KDF’s entry production platform – purpose-built for applications using target materials that produce unusually high particulate contamination. These systems surpass the criteria for thin film deposition in high-density devices and applications requiring absolutely minimal defects. ![KDF 600i Series - Interior View](https://www.kdf.com/wp-content/uploads/2022/09/600i.jpg) 600i Series – Chamber Interior The 600i Series supports multi-process sputtering for maximum process flexibility. The 600ix family features KDF’s patented Linear Moving Magnetron™ (LMM™) cathode – engineered for high-rate reactive processes, full-face target erosion, and low particle generation. All 600i systems handle one 8″ wafer or up to thirty-six 2″ wafers, with optional gas delivery systems for enhanced reactive processes. Remote PC accessibility via Ethernet is standard for software upgrades and diagnostics. Key Features ### Standard System Capabilities - Vertical side sputtering – small footprint - 12″ × 12″ pallet with unique pallet designs available - Dual-process loadlock for production exchange cycles - Optional high vacuum loadlock with quartz heater lamps - Multiple bias types enabling denser films and planarization - Multi-size capability – substrate size changeable run to run - Scan velocity profiling for enhanced uniformity - Optional robot for particulate-free cassette-to-cassette handling - Optional integrated RGA for process and fault monitoring - In-situ pallet optical temperature measurement and control - LMM™ cathode available (ix series) – full-face erosion, low particles - Pulsed DC via Advanced Energy Pinnacle Plus available - SECS/GEM connectivity via OPC server interface - Complies with NFPA 79 and Semiconductor S2-0706 safety specs System Variants ## 600i Series Model Lineup The 600i family spans from the base 603i to the four-target 654ix – each model building on the last with additional vacuum, process, and cathode capabilities. 603i Base Model · 3-Target The entry-level 600i configuration. Rough-pumped load lock for fast production exchange cycles. Optimized for sensitive applications with high-particulate target materials. Widely used in telecommunications manufacturing, chip resistor, and resistor network applications. 643i 4-Target · High Vacuum Loadlock Builds on the 603i with a high-vacuum pumped load lock with quartz heat lamps for tighter process control. Features palletized batch processing with instantaneous wafer size changes run to run. KDF maintains an extensive pallet library for a wide range of substrate applications including GaAs front/back-side processes. 654i 4-Target · Telecom & Compound Semi Developed for the telecommunications and compound semiconductor markets. Four-target versatility supports the full range of leading-edge microelectronic component manufacturing. Enhanced etch and deposition uniformity with high-speed batch processing capability. 643ix & 654ix X-Series™ · Extended Cathode · LMM™ KDF’s X-Series™ with 17″ extended cathodes for improved uniformity across the entire pallet. Available in Planar™, Inset™, and RF/DC LMM™ configurations. The LMM™ cathode delivers bulletproof high-rate reactive processes with full-face target erosion and industry-leading low particle generation. Technical Specifications ## Vacuum & Facility Requirements Vacuum Performance Chamber Ultimate ≤1 × 10⁻⁷ torr Chamber Leak Rate 20 min to 1 × 10⁻⁴ torr HV Dome Ultimate ≤1 × 10⁻⁷ torr HV Dome Leak Rate 15 min to 1 × 10⁻⁴ torr Pump Down from Atm. ≤110 min to 1 × 10⁻⁶ torr Overnight Pump Down 2 × 10⁻⁷ torr Facility Requirements Power 208 VAC, 3-phase, 100A Cooling Water 6.5 GPM, 70 PSI min Water Temp Range 10°C – 24°C Compressed Air 85 – 100 PSIG Process Gas 25 PSIG, 99.999% purity Pure Gas Dry N₂ Process Capability Pallet Size 12″ × 12″ (304mm × 304mm) Max Wafer (single) 1 × 8″ Max 2″ Wafers 36 Target Positions 3 or 4 DC Power Supply 12 kW (Adv. Energy) RF Power Supply 1.25 or 3.0 kW (opt.) System Detail ## Hardware, Controls & Software ### System Hardware - 12 kW low stored energy DC power supplies (Advanced Energy) – optional Pinnacle Plus pulsed DC - Integrated throttling SS VAT valve for upstream or downstream pressure control - MKS multi-component “Smart” 390 and 925 gauges for integrated vacuum measurement - Process gas control: up to 4 MFCs, feedback-controlled capacitance manometer, master/slave gas select, gas ratio control - Stepper motor pallet carrier drive with optical encoder – programmable scan velocity profiling - Low-pressure hydraulics for safety and smooth operation - Loadlock linear sensor – computer-controlled positioning for increased accuracy and fail-safe - Optional 1.25 or 3.0 kW RF solid-state power supply (Advanced Energy) - Complies with NFPA 79 guidelines; CE option available ### Computer & Control System - Windows 10 real-time GUI with 24″ LCD touchscreen on umbilical mobile HI cart - Context-sensitive recipe manager running from Microsoft SQL database - Real-time data display and logging – compatible with Excel, Lotus, and Windows applications - Report generation, remote interface, and printing capability - Optional SECS/GEM connectivity via OPC server interface - Distributed Rockwell Control System – DeviceNet and EtherNet/IP fieldbus - Full maintenance test suite with diagnostic and manual process control - Service-friendly fully enclosed electronic cabinet - Remote PC accessibility via Ethernet for software upgrades and file repair Applications ## Target Markets Medical Devices Optical Communications Compound Semiconductors Flat Panel Displays Chip Resistors & Networks Telecom Manufacturing Emerging Materials Mainstream Silicon Next Steps ## Configure Your 600i System Our process engineers can help you select the right 600i variant and options for your application. Download the full datasheet or contact us to start the conversation. [Let’s Talk Process →](/contact-us/) [Download 600i Datasheet →](https://www.kdf.com/wp-content/uploads/2022/09/600i-Series-HR-1.pdf) [📞 (201) 784-5005](tel:+12017845005) [✉ ](mailto:sales@kdf.com) --- ### [Benefits of buying sputtering equipment from kdf](https://www.kdf.com/products/services-inline-sputtering-systems/benefits-of-buying-sputtering-equipment-from-kdf/) **Published:** August 23, 2022 **Author:** Vishal Agrawal --- ### [Original Batch OEM Parts](https://www.kdf.com/products/original-oem-parts/) **Published:** September 29, 2022 **Author:** Vishal Agrawal **Content:** Original OEM Parts · KDF Technologies # Original *OEM* Sputtering Parts Original Materials Research Corporation (MRC) and KDF Technologies OEM parts – manufactured to exact specifications, backed by the deepest bench of inline sputtering knowledge in the industry. [Request Parts & Pricing →](/contact-us/) [View Upgrade Kits](/products/original-oem-parts/kdf-upgrade-kits-mrc-upgrade-kits/) 600+ Combined Person-Years of MRC & KDF Experience 3 Part Categories: Consumables, Replacement & Electrical OEM Parts Manufactured to Original Specifications MRC+ KDF, MRC, 700, 800, 900 Series Models Supported Compatible Systems KDF 900 Series KDF 800 Series KDF 700 Series KDF 600 Series MRC 8667 MRC 8671 MRC 822 Limited MRC Part Categories ## Three Categories. Everything Your System Needs. KDF stocks and manufactures original OEM parts across three major categories for MRC and KDF inline sputtering systems – ensuring your tools stay running at specification regardless of age or model. ### Consumables High-frequency replacement items engineered to original MRC and KDF specifications – critical for maintaining process stability and system cleanliness between maintenance cycles. - Shields - O-rings - Bearings - Heat lamps - Magnets (all cathode types) - Pallets – custom or standard - Ion tubes - Thermocouples (TCs) ### Replacement Parts Structural and process-critical components manufactured to original engineering drawings – including KDF’s patented cathode designs, which are the sole intellectual property of KDF Technologies. - Cathodes – Inset™ (Upsilon, Mu, Chi, Focest) - Cathodes – Planar, Mark II, Magterial™, X-Series™, Q-Set - Bellows and garlock seals - Feedthroughs (ferro-fluidic) - Pallet carriers and shutter carriages - RF networks and solenoids - Cryo pumps and compressors - Gate valves and grippers - Hydraulic pumps, manifolds, valves & cylinders - Air packages and etch platforms - Stainless steel roughing lines and viewports ### Electrical Electronic and control system components maintained to original specification – including modern upgrades that extend system life while preserving process compatibility with your existing recipes. - Printed circuit boards - RF generators - Flow control valves - Gas flow controllers - Power supplies – RF and DC - Computer boards and I/O cards - Analog racks - Pressure gauges - Windows 10 control computer upgrade (from Windows 7) Browse by Category ## Explore Specific Part Lines [ Upgrades KDF & MRC Upgrade Kits Modernize your existing KDF or MRC system with factory-designed upgrade kits – controls, power, and more. View Upgrade Kits → ](/products/original-oem-parts/kdf-upgrade-kits-mrc-upgrade-kits/) [ Spare Parts KDF Spare Parts Kits Pre-configured spare parts kits for KDF inline sputtering systems – ready to ship for fast maintenance turnaround. View Spare Parts → ](/products/original-oem-parts/kdf-in-line-spare-parts-kits/) [ Cathodes Sputtering Cathodes KDF’s patented cathode designs including Inset™ Upsilon, Mu, Chi, and Focest – plus Planar, Mark II, LMM™, and X-Series™. View Cathodes → ](/products/original-oem-parts/sputtering-cathodes/) [ Targets Sputtering Targets High-purity sputtering targets in a wide range of materials and geometries for KDF and MRC system cathode configurations. View Targets → ](/products/original-oem-parts/sputtering-targets/) [ Backing Plates Backing Plates MRC-style and KDF backing plates manufactured to original specifications for all supported cathode and target configurations. View Backing Plates → ](/products/original-oem-parts/backing-plates/) [ Controls PLC Retrofit Kit Modernize your system’s control architecture with KDF’s PLC retrofit – extending system life and improving process reliability. View PLC Retrofit → ](/products/original-oem-parts/plc-retrofit-kit/) [ Retrofit Retrofit Kits Complete retrofit packages for KDF and MRC systems – hardware, controls, and process upgrades engineered by the OEM. View Retrofit Kits → ](/products/original-oem-parts/retrofit-kits/) [ MRC Legacy MRC Upgrade Kits Dedicated upgrade kits for legacy MRC 903 and 943 series platforms – keeping your original equipment running at full specification. View MRC Upgrades → ](/products/original-oem-parts/kdf-upgrade-kits-mrc-upgrade-kits/mrc-upgrade-kits/) Why OEM Matters ## The Case for Original KDF & MRC Parts Aftermarket parts for inline sputtering systems can introduce process variability, vacuum incompatibility, and reliability risks that are difficult to diagnose and costly to remediate. KDF’s original OEM parts eliminate that risk entirely. KDF is the OEM for MRC batch systems – the only source with access to original engineering drawings, design intent, and the institutional knowledge required to manufacture parts that perform to specification. **No other supplier can offer this.** KDF’s support for legacy MRC systems is backed by engineers with **600+ combined person-years** of MRC and KDF equipment experience – the deepest bench of inline sputtering knowledge in the industry. [Request Parts & Pricing →](/contact-us/)#### Process Integrity Parts engineered to original specifications maintain your validated process parameters and film properties. #### Vacuum Compatibility OEM materials and finishes are selected for vacuum service – eliminating outgassing risks from aftermarket substitutes. #### System Longevity Correctly dimensioned parts reduce wear on adjacent components and extend overall system life. #### IP-Protected Cathodes KDF’s patented Inset™ cathode designs are sole KDF intellectual property – only available from KDF. #### Original Drawings As the MRC OEM, KDF retains and actively uses original engineering drawings not available to any other supplier. #### Worldwide Support Parts shipped globally with full documentation – supporting MRC and KDF systems in production worldwide. Get in Touch ## Need Parts for Your KDF or MRC System? Our team can identify the right parts for your system, confirm compatibility, and provide fast turnaround on consumables, replacement components, and electrical parts. [Request Parts & Pricing →](/contact-us/) [Original Batch OEM Parts](/products/services-inline-sputtering-systems/original-oem-parts/) --- ### [844i Vertical Batch-Sputtering System](https://www.kdf.com/products/in-line-products-kdf-technologies/844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) **Published:** September 29, 2022 **Author:** Vishal Agrawal **Content:** Large Area Production Series # *844i* Series Large Area Vertical Batch Sputtering System A large area, four-target RF/DC batch sputtering system for 300mm semiconductor wafers, solar photovoltaics, and flat panel displays up to Gen 3.5 – with through-the-wall cleanroom compatibility and dual cryo pump performance. [Request a Quote →](/contact-us/) [Download Datasheet →](https://www.kdf.com/wp-content/uploads/2022/09/844i-Series-HR-1.pdf) Pallet Size 26.5″ × 30″ Target Positions 4 300mm Wafer Capacity Up to 4 Glass Size Up to Gen 3.5 ![KDF 844i Series Sputtering System](https://www.kdf.com/wp-content/uploads/2026/03/844-6-scaled.jpg) [600i Series](/products/in-line-products-kdf-technologies/600-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [744i Series](/products/in-line-products-kdf-technologies/744-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [844i Series](/products/in-line-products-kdf-technologies/844-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [900i Series](/products/in-line-products-kdf-technologies/900-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [974i Series](/products/in-line-products-kdf-technologies/974i-series-sputtering-equipment-in-line-side-sputtering-batch-systems-kdf/) | [Ci Cluster Tool](/products/in-line-products-kdf-technologies/ci-cluster-tool/) System Overview ## 300mm Scale. Cleanroom Ready. The 844i is KDF’s largest area production platform – a second-generation redesign with an expanded pallet, reduced footprint, and upgrades across hardware and software. It handles the demanding process requirements of high-density interconnect, 300mm semiconductor wafers, OLED, solar photovoltaics, and flat panel display manufacturing. ![KDF 844i Series - System Detail](https://www.kdf.com/wp-content/uploads/2026/03/844-5-scaled.jpg) 844i Series – Production Configuration The 844i features a fully redesigned 3-door front access to the main chamber, dual CTI 10 cryo pumps with optional isolated water pump, and fully shielded chamber walls for faster cleaning and reduced cleanroom contamination. A through-the-wall design enables direct cleanroom integration. Two processing pallets allow instantaneous wafer size changes and front/backside processing. The pallet assist tool (PAT) handles payloads up to 100 lbs safely and repeatably. Target utilization rate is up to 60%. Key Features ### Standard System Capabilities - Vertical side sputtering – compact footprint, <⅓ floor space of competing tools - 26.5″ × 30″ pallet – largest area in the KDF product line - Four-target main chamber configuration - Dual-process high-vacuum loadlock with substrate pre-heat - Processes up to four 300mm wafers simultaneously - 4× throughput improvement over 600i Series for 300mm wafer metallurgy - Glass sizes up to Gen 3.5 - Pallet assist tool (PAT) for payloads up to 100 lbs - Through-the-wall design for cleanroom compatibility - 3-door front access to main chamber – second generation redesign - Dual CTI 10 cryo pumps; optional isolated water pump - Fully shielded chamber – faster cleaning, less cleanroom contamination - Scan velocity profiling for enhanced deposition uniformity - Target utilization rate up to 60% - Optional robot for particulate-free cassette-to-cassette handling - Pulsed DC up to 20 kW via Advanced Energy Pinnacle Plus - Complies with Semiconductor S2-0706; CE option available ![KDF 844i - Chamber Interior](https://www.kdf.com/wp-content/uploads/2026/03/844-3-scaled.jpg) 844i Series – Chamber Interior ![KDF 844i - System View](https://www.kdf.com/wp-content/uploads/2026/03/844-4-scaled.jpg) 844i Series – System Detail Second Generation Design ## What’s New in the 844i Gen 2 KDF’s second generation 844i builds on the original with expanded pallet size, reduced footprint, and significant hardware and software upgrades – engineered to meet increasing customer demand for higher throughput with larger substrates. #### Expanded Pallet Area Increased pallet size to 26.5″ × 30″ to accommodate higher throughput demands with larger substrates, including Gen 3.5 glass and four 300mm wafers simultaneously. #### Dual Cryo Pump System Equipped with dual CTI 10 cryo pumps for superior pumping performance. Optional CTI isolated water pump available for the ultimate in vacuum performance and process repeatability. #### Through-the-Wall Design Purpose-built for cleanroom integration. The through-the-wall configuration allows the process chamber to interface directly with the cleanroom environment while keeping support equipment in the facility chase. #### 3-Door Front Access Completely redesigned main chamber access with 3-door front entry – reducing downtime for maintenance, target changes, and chamber cleaning. Fully shielded walls minimize cross-contamination. #### 60% Target Utilization Targets on the 844i Series achieve up to 60% utilization – significantly reducing material cost per wafer and extending target service intervals for lower total cost of ownership. #### PAT – 100 lb Payload The pallet assist tool (PAT) safely handles pallet payloads up to 100 lbs in a repeatable, ergonomic manner – critical for large area substrates and high-density pallet configurations. Cathode Technology ## KDF Cathode Options The 844i accepts KDF’s full cathode range – all designed in-house and validated in customer and field applications. Each cathode is optimized for specific target materials, deposition modes, and uniformity requirements. Inset Cathode™ Up to 30.5″ Length · Metals & Precious Metals Up to 30.5 inches in length – the longest in the KDF lineup. Accommodates most metal and all precious metal types with improved cathode-to-pallet aspect ratio for superior uniformity across the full 844i pallet area. Magterial Cathode™ Planar Type · Ferrous Metals A planar-type cathode ideal for magnetron sputtering of ferrous metals such as nickel and iron – delivering high deposition rates and high uniformity for demanding metallization applications including HDI and power device fabrication. LMM™ Cathode Patented · RF Capable · Full Face Erosion KDF’s newest patented Linear Moving Magnetron cathode – now available with RF option for the 844i. Delivers full-face target erosion for low-particle applications with bulletproof high-rate reactive process stability and run-to-run repeatability. Custom Designs In-House Engineering · Reactive Options KDF’s in-house engineering team models and designs all cathodes to customer and field-proven specifications. Optional gas delivery systems enable enhanced reactive sputtering processes across all cathode types. Technical Specifications ## Vacuum & Facility Requirements Vacuum Performance Chamber Ultimate<9.0 × 10⁻⁸ torr Chamber Leak Rate25 min to 1 × 10⁻⁴ torr HV Dome Ultimate<9.0 × 10⁻⁸ torr HV Dome Leak Rate15 min to 1 × 10⁻⁴ torr Pump Down from Atm.≤110 min to 1 × 10⁻⁶ torr Overnight Pump Down1.0 × 10⁻⁷ torr Facility Requirements Power208 VAC, 3-phase, 225A Cooling Water8 GPM, 70 PSI min Water Temp Range10°C – 24°C Compressed Air85 – 100 PSIG Process Gas25 PSIG, 99.999% purity Pure GasDry N₂ Process Capability Pallet Size26.5″ × 30″ (673mm × 762mm) 300mm WafersUp to 4 Glass SizeUp to Gen 3.5 Target Positions4 DC Power Supply20 kW (Adv. Energy) Target UtilizationUp to 60% System Detail ## Hardware, Controls & Software ### System Hardware - 20 kW low stored energy DC power supplies (Advanced Energy) – optional Pinnacle Plus pulsed DC - Integrated dual throttling SS VAT valves for upstream or downstream gas pressure control - MKS multi-component “Smart” 390 and 925 gauges for integrated vacuum measurement - Process gas control: up to 4 MFCs, feedback-controlled capacitance manometer, master/slave gas select, gas ratio control - Stepper motor pallet carrier and shutter drive with optical encoder – scan velocity profiling available - Low-pressure hydraulics for safety and smooth operation - Stepper-driven automated load lock door - Loadlock linear sensor – computer-controlled positioning for accuracy and fail-safe - Fully shielded chamber for faster cleaning and reduced contamination - Complies with NFPA 79; CE option available ### Computer & Control System - Windows 10 real-time GUI with 24″ LCD touchscreen on umbilical mobile HI cart - Context-sensitive recipe manager running from Microsoft SQL database - Real-time data display and logging – compatible with Excel, Lotus, and Windows applications - Report generation, remote interface, and printing capability - Optional SECS/GEM connectivity via OPC server interface - Distributed Rockwell Control System – DeviceNet and EtherNet/IP fieldbus - Full maintenance test suite with diagnostic and manual process control - Service-friendly fully enclosed electronic cabinet - Remote PC accessibility via Ethernet for software upgrades and file repair Applications ## Target Markets Solar Photovoltaics Flat Panel Displays 300mm Semiconductor OLED Technology High-Density Interconnect Medical Devices Optical Communications Emerging Materials Next Steps ## Configure Your 844i System Our process engineers can help you select the right cathode configuration and cleanroom integration options for your 844i. Download the full datasheet or contact us to start the conversation. [Let’s Talk Process →](/contact-us/) [Download 844i Datasheet →](https://www.kdf.com/wp-content/uploads/2022/09/844i-Series-HR-1.pdf) [📞 (201) 784-5005](tel:+12017845005) [✉ ](mailto:sales@kdf.com) --- ### [richardadmin](https://www.kdf.com/kdf-1500i-2/) **Published:** March 4, 2026 **Author:** KDF Technologies **Content:** KDF-1500i™ | High-Capacity PVD & DLC Coating System with Magnetron Sputtering | KDF Technologies - [◎Overview](#overview) - [⬡Sweet Spot](#sweetspot) - [⚡Technology](#technology) - [????Coatings](#coatings) - [◈Capabilities](#capabilities) - [⚙Applications](#applications) - [????Specs](#specs) - [????FAQ](#faq) - [⊞Related](#related) - [✉Contact](#contact) KDF Technologies – High-Capacity PVD & DLC Coating Systems # KDF-1500i™ System *High-Capacity PVD & DLC with Optional Magnetron Sputtering* The mid-size KDFi Series powerhouse – combining cathodic arc and optional magnetron sputtering in a compact, price-competitive platform. 10 racks, parts up to 100 cm, and up to 3 PVD sources for manufacturers and coating service providers who need high throughput without a large footprint. Cathodic Arc + Magnetron Sputtering Up to 3 PVD Sources 10 Racks per Batch 7.98 m² Coating Area Parts to 100 cm PVD + DLC / PECVD TiN · CrN · ZrN Price Competitive [Request a Consultation](#contact) [View Specifications](#specs) ![KDF-1500i high-capacity PVD and DLC coating system with magnetron sputtering](https://www.kdf.com/wp-content/uploads/2026/03/Kdf-1500i.jpg) Overview ## High Throughput. Compact Footprint. Exceptional Value. The KDF-1500i™ is the mid-size system in KDF Technologies’ KDFi Series – purpose-built for manufacturers and coating service providers who need high-volume production capability without the footprint or capital investment of the largest industrial systems. It delivers the performance of a large coater in a compact, price-competitive package. What sets the 1500i apart is its unique combination of cathodic arc and optional magnetron sputtering technologies in the same machine – up to 3 PVD sources – giving operators the flexibility to deposit a broader range of coating materials and compositions than single-technology systems: - 10 high-capacity racks for maximum parts-per-batch and low cost per coated part - Parts up to 100 cm (39 in) long – suitable for a wide range of industrial part sizes - Cathodic arc (LTAVD®) plus optional magnetron sputtering – up to 3 PVD sources - Decorative PVD color coatings including bright and dark metallic finishes - PECVD diamond-like carbon (DLC) coatings for wear and functional applications - Compact 4.4m × 2.0m footprint – designed for easy factory integration 10Rack Positions 7.98 m²Coating Area per Batch 100 cmMax Part Length 3 SourcesUp to 3 PVD Sources The Sweet Spot ## Why the KDF-1500i Is the Right Fit for Growing Operations The KDF-1500i sits at the ideal intersection of capacity, flexibility, and cost – more throughput and coating capability than the KDF-1000i, at a significantly lower footprint and investment than the KDF-3000i. ⚖### Mid-Size, Maximum Value 10 racks and 7.98 m² of coating area per batch deliver high-volume output at a price point and footprint designed for growing operations – not just large enterprises. ????### Two Technologies, One System Cathodic arc and optional magnetron sputtering in the same machine give you access to a broader coating material library than cathodic arc alone – without needing two separate systems. ????### Built for Service Providers The 1500i’s capacity, flexibility, and competitive economics make it an ideal platform for coating service providers offering PVD and DLC services to multiple customers across multiple industries. ????### Compact for Its Class A 4.4m × 2.0m footprint delivers 10-rack high-throughput production in significantly less floor space than comparable mid-size coating systems. Dual Deposition Technology ## Cathodic Arc + Magnetron Sputtering – In One System The KDF-1500i combines two complementary PVD deposition technologies in a single chamber – giving operators the ability to optimize coating processes for a wider range of applications, materials, and performance targets than any single-technology system. Standard ### Cathodic Arc (LTAVD®) KDF Technologies’ proprietary Low-Temperature Arc Vapor Deposition (LTAVD®) is the foundation of the KDF-1500i – delivering high deposition rates, excellent coating adhesion, and consistent results across decorative and functional PVD applications. - High deposition rates for efficient production cycles - Excellent coating adhesion on metal and prepared plastic substrates - Ideal for decorative color PVD – gold, black, bronze, chrome, and more - Supports DLC/PECVD coating process in the same chamber - Lower processing temperatures than many competing technologies Optional Add-On ### Magnetron Sputtering Optional magnetron sputtering sources expand the KDF-1500i’s coating material library and enable deposition of coating compositions and structures that are difficult or impossible to achieve with cathodic arc alone. - Access to a broader range of coating materials and alloy compositions - Smoother coating surfaces than cathodic arc for select applications - Enables advanced multilayer and gradient coating architectures - Ideal for specialized functional and optical coating applications - Up to 3 total PVD sources when combined with cathodic arc PVD Coatings ## Decorative Color PVD & High-Performance Functional Coatings The KDF-1500i deposits the complete range of KDF Technologies’ decorative PVD color coatings alongside high-performance functional and wear coatings. Optional magnetron sputtering expands the available coating palette beyond what cathodic arc alone can achieve. #### Gold / Champagne PVD Rich zirconium nitride (ZrN) and titanium nitride (TiN) gold tones – durable, vibrant, and corrosion resistant. #### Black PVD Deep matte and gloss black via zirconium carbonitride and chromium nitride – consistently one of the most in-demand decorative PVD finishes. #### Chrome / Silver PVD A hard, environmentally responsible chrome alternative – no hexavalent chromium, no hazardous waste, full visual impact. #### Bronze & Warm Tones Oil-rubbed bronze, antique copper, and warm metallic PVD finishes for plumbing, hardware, and architectural applications. #### Full Color PVD Spectrum Blues, greens, purples, rose gold, gunmetal, and custom color tones for consumer goods, luxury products, and specialty applications. #### DLC (Diamond-Like Carbon) PECVD diamond-like carbon coatings – ultra-hard, low-friction surfaces for medical devices, automotive parts, cutting tools, and firearms. #### Wear Coatings (TiN · CrN · ZrN) Industrial nitride and carbonitride wear coatings that extend tool and component life under abrasion, heat, and mechanical stress. #### Zirconium PVD Zirconium-based coatings offering exceptional hardness, a wide decorative color range, and superior corrosion resistance. Key Capabilities ## What the KDF-1500i Delivers ????### Compact High-Throughput 10 racks and 7.98 m² of coating area in a 4.4m × 2.0m footprint – exceptional production capacity per square meter of floor space. ????### Dual Technology Flexibility Cathodic arc (LTAVD®) plus optional magnetron sputtering – up to 3 PVD sources in a single system for a wider coating material library. ????### Price Competitive High-capacity performance at a price point designed to be accessible for mid-volume manufacturers and coating service providers. ⤢### Large Part Capacity Parts up to 100 cm (39 in) long on racks measuring 100 cm × 25.4 cm Ø across 10 racks per batch. ????### DLC Capability Built In Full PECVD diamond-like carbon (DLC) coating capability included – no separate system required for medical, automotive, firearms, and precision applications. ????### Easy to Operate KDF Technologies’ intuitive software interface and full training program ensure your team is productive from day one. Industries & Applications ## Who Uses the KDF-1500i The KDF-1500i serves mid-to-high volume manufacturers and coating service providers across a broad range of industries. Its combination of throughput, part size capacity, and dual deposition technology makes it equally at home in decorative hardware finishing and high-performance industrial coating operations. ????#### Plumbing & Home Hardware High-volume decorative PVD color coatings for faucets, door hardware, cabinet pulls, and architectural fixtures. ????#### Medical Devices DLC and hard nitride coatings for surgical instruments, orthopedic implants, and precision medical components. ????#### Cutting Tools & Tooling TiN, CrN, and ZrN wear coatings at production scale for drills, end mills, inserts, and forming tools. ????#### Automotive Parts Wear-resistant and decorative coatings for engine components, trim, fasteners, and precision assemblies. ⚙#### Molds & Dies Hard DLC and CrN coatings that reduce adhesion and extend mold life in injection molding and stamping operations. ????#### Firearms Black DLC, TiN, and decorative PVD coatings for pistols, rifles, and firearm component finishing operations. ????#### Precision Components Functional thin-film coatings for bearings, shafts, gears, and precision-engineered parts requiring tight tolerances. ????#### Coating Service Providers The 1500i’s capacity, flexibility, and competitive economics make it a preferred platform for PVD and DLC coating service operations. Technical Specifications ## KDF-1500i System Specifications ParameterValue System Capacity System Footprint4.4m × 2.0m Coating Area per Batch7.98 m² Number of Racks10 Rack Size100 cm × 25.4 cm Ø Coating Technologies Deposition Technologies- Low-temperature cathodic arc vapor deposition (LTAVD®) – standard - Magnetron sputtering – optional (up to 3 total PVD sources) Coating Processes Processes- Physical vapor deposition (PVD) - Plasma-enhanced chemical vapor deposition (PECVD) for diamond-like carbon (DLC) coatings Available Coatings Functional / Wear CoatingsTiN, CrN, ZrN, TiCN, and DLC (diamond-like carbon) Decorative Color PVDGold, black, chrome, bronze, rose gold, blue, champagne, gunmetal, and custom colors Base MaterialsPure, alloyed, or reacted zirconium, titanium, chromium, and carbon Substrate Compatibility MaterialsSteel, stainless steel, brass, zinc, aluminum, and prepared plastic substrates \* Contact KDF Technologies for magnetron sputtering configuration options and site preparation requirements. Frequently Asked Questions ## KDF-1500i – Common Questions What makes the KDF-1500i different from the KDF-1000i and KDF-3000i?The KDF-1500i is the mid-size system in the KDF Technologies KDFi Series, sitting between the compact KDF-1000i and the large-scale KDF-3000i. It offers significantly more coating capacity than the 1000i – 10 racks versus 6, and 7.98 m² versus 4.79 m² per batch – while remaining more compact and price-competitive than the 3000i. Its key differentiator is the addition of optional magnetron sputtering alongside cathodic arc, giving it a broader coating capability than either the 1000i or 3000i at its price point. Is magnetron sputtering required or is it optional?Magnetron sputtering is optional on the KDF-1500i. The system ships standard with cathodic arc (LTAVD®) technology and can be configured with up to 2 additional magnetron sputtering sources for a total of up to 3 PVD sources. Contact KDF Technologies to discuss which configuration is best suited for your specific coating applications. What decorative PVD colors can the KDF-1500i produce?The KDF-1500i produces the full range of KDF Technologies’ decorative PVD colors – including gold, satin gold, champagne, rose gold, black, matte black, gunmetal, chrome/silver, bronze, oil-rubbed bronze, blue, and custom color specifications. The addition of optional magnetron sputtering expands the available color palette and enables additional coating compositions beyond what cathodic arc alone can achieve. What is the footprint and rack capacity of the KDF-1500i?The KDF-1500i has a footprint of 4.4m × 2.0m (14.4 ft. × 6.7 ft.) – compact for a 10-rack high-throughput system. It accommodates 10 racks of 100 cm × 25.4 cm Ø each, providing a total coating area of 7.98 m² per batch and the ability to coat parts up to 100 cm (39 in) long. Is the KDF-1500i suitable for coating service providers?Yes – the KDF-1500i is one of KDF Technologies’ most popular systems for coating service providers. Its 10-rack capacity, dual technology flexibility, and competitive price point deliver the economics and versatility needed to profitably serve multiple customers across multiple industries – from decorative hardware finishing to industrial wear coating applications. What functional and wear coatings can the KDF-1500i apply?The KDF-1500i deposits titanium nitride (TiN), chromium nitride (CrN), zirconium nitride (ZrN), titanium carbonitride (TiCN), and diamond-like carbon (DLC) functional coatings via its PECVD capability – alongside the full range of decorative PVD color finishes. What industries does the KDF-1500i serve?The KDF-1500i serves plumbing and home hardware manufacturers, medical device companies, cutting tool and tooling producers, automotive suppliers, mold and die makers, firearms manufacturers, precision component producers, blade and cutlery brands, and coating service providers. Also from KDF Technologies ## Explore Other Systems #### KDF-1000i™ System A compact, easy-to-operate PVD and DLC coating system – the right entry point for smaller operations bringing in-house coating capability online for the first time. [Learn More →](#)#### KDF-3000i™ System KDF’s highest-capacity cathodic arc coating machine – 16 racks and parts up to 122 cm for large-scale industrial and consumer product operations. [Learn More →](#)#### KDF MAX1500™ System KDF’s most flexible industrial PVD system – combining cathodic arc, magnetron sputtering, PECVD/DLC, and plasma nitriding in a single compact platform. [Learn More →](#) ## Ready to Find Your Coating Sweet Spot? Talk to a KDF Technologies specialist about the KDF-1500i’s configuration options, throughput capabilities, and whether it’s the right fit for your operation. [Request a Consultation](#) [Download Brochure](#) © 2026 KDF Technologies, LLC – A subsidiary of Kurt J. Lesker Company. All rights reserved. | [Privacy Policy](#) | [Terms of Use](#) | [Contact](#) --- ### [Backing plates](https://www.kdf.com/products/process-materials/backing-plates/) **Published:** August 23, 2022 **Author:** Vishal Agrawal **Content:** MRC Style Backing Plates | KDF Technologies Original OEM Parts · KDF Technologies # MRC Style Backing Plates KDF holds all manufacturing rights to MRC style backing plates – stocked for immediate delivery. Manufactured on NC equipment to original specifications, guaranteeing dimensional tolerances and absolute reproducibility. [Request a Quote →](/contact-us/) [Download PDF](https://www.kdf.com/wp-content/uploads/2022/11/Target-Backing-Plates.pdf) At a Glance OEM All MRC & KDF Specs $2M+ Working Stock Inventory Days Typical Delivery from Stock OEM Manufacturing ## MRC & KDF Backing Plates KDF holds all manufacturing rights to MRC style backing plates and stocks all MRC backing plates for immediate delivery. Custom manufactured backing plates can be manufactured to meet individual customer requirements and system specifications. In all cases, backing plates are manufactured on **numerically controlled (NC) equipment** to the original specifications – guaranteeing required dimensional tolerances and absolute reproducibility across every order. KDF is constantly making improvements and design changes to enhance and improve the performance of these products. KDF is the original OEM for its **i Series, ix Series, NTX, 744, and 844** backing plates. Compatible Systems ## Stocked for All KDF & MRC Platforms KDF i Series KDF ix Series NTX KDF 744 KDF 844 MRC 903 MRC 943 MRC 8667 Custom **Do not be fooled by third-party pirated parts.** KDF manufactures all backing plates from original MRC documentation located and maintained at KDF – the only source with access to these engineering drawings. Bonding Services ## Target Bonding to Backing Plates ### Indium Bonding Indium and indium alloys develop a high-strength bond and ensure the thermal transfer and conduction needed for today’s high-powered sputtering systems. The preferred method for thermally demanding applications. ### Epoxy Bonding Epoxy bonding combined with indium and indium alloys allows KDF to bond targets with highly dissimilar coefficients of thermal expansion – enabling a wider range of material pairings than indium alone. ### Picture Frame Bonding Available for SiO₂, Pyrex, and ITO targets. KDF’s picture frame bonding technique maintains target flatness and integrity across the full bonded assembly – critical for fragile and brittle target materials. KDF enjoys a highly regarded reputation for **void-free and defect-free bonding**. Each backing plate, target, and assembly is individually inspected and properly packaged to ensure all customer requirements are satisfied. Full Product Line ## KDF Supplies Everything Your System Needs ### Sputtering Targets High purity metals, alloys, non-metallic materials, and cermets in planar, circular, rectangular, Upsilon™, conical, ring, delta, and custom geometries. Chi, Mu, Muset, and Upsilon Inset Cathode™ target materials available. [View Targets →](/products/original-oem-parts/sputtering-targets/)### Evaporation Materials High purity evaporation materials available as pellets, rods, tablets, slugs, granular, cones, powder, wire, and foil – covering the full range of thermal and e-beam evaporation process requirements. [Request a Quote →](/contact-us/)### Sputtering Cathodes Inset™ (Upsilon, Mu, Chi, Focest), Magterial™, LMM™, G12™, and x Series cathodes. Conversion kits available to switch between Inset™ cathode configurations. 17″ x Series offers enhanced pallet uniformity. [View Cathodes →](/products/original-oem-parts/sputtering-cathodes/)### Bonding Services Indium, indium alloy, and epoxy bonding of targets to backing plates. Picture frame bonding for SiO₂, Pyrex, and ITO. Void-free and defect-free bonding with full inspection and packaging. [Request Bonding →](/contact-us/)### Target Stocking Programs KDF can help develop and implement a target stocking program using JIT techniques – minimizing your inventory investment while maximizing production capabilities and eliminating unplanned downtime from stock-outs. [Discuss a Program →](/contact-us/)### Parts & Retrofit Kits Full line of replacement parts for KDF and MRC systems – manufactured from original MRC documentation. Over $2M in working stock inventory delivers most parts within days. Retrofit kits and upgrade kits also available. [All OEM Parts →](/products/original-oem-parts/) Get in Touch ## Need Backing Plates for Your KDF or MRC System? Contact our team with your system model and cathode configuration. Most MRC and KDF backing plates ship from stock within days. [Request a Quote →](/contact-us/) [Download PDF](https://www.kdf.com/wp-content/uploads/2022/11/Target-Backing-Plates.pdf) [All OEM Parts](/products/original-oem-parts/) --- ### [Thank You](https://www.kdf.com/thank-you/) **Published:** June 24, 2021 **Author:** Alex Miranda **Content:** ## Thank You For Contacting Us ## Contact us [ 10 Volvo Drive, Rockleigh, NJ 07647](#)[(201) 784-5005](tel:+12017845005)[ (201) 784-0202](tel:+12017840202)![check icon](https://www.kdf.com/wp-content/uploads/2022/09/check-circle-solid.svg)## Thank You! 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modes](https://www.kdf.com/tag/sputtering-modes/) --- ### [PVD sputtering](https://www.kdf.com/tag/pvd-sputtering/) --- ### [thin-film technology](https://www.kdf.com/tag/thin-film-technology/) --- ### [DC sputtering](https://www.kdf.com/tag/dc-sputtering/) --- ### [cathode design](https://www.kdf.com/tag/cathode-design/) --- ### [planetary pallet](https://www.kdf.com/tag/planetary-pallet/) --- ### [system enhancements](https://www.kdf.com/tag/system-enhancements/) --- ### [LMM cathode](https://www.kdf.com/tag/lmm-cathode/) --- ### [sputtering technology​](https://www.kdf.com/tag/sputtering-technology/) --- ### [sputter system upgrades](https://www.kdf.com/tag/sputter-system-upgrades/) --- ### [obsolete controllers​](https://www.kdf.com/tag/obsolete-controllers/) --- ### [MRC sputtering systems](https://www.kdf.com/tag/mrc-sputtering-systems/) --- ### [equipment migration​](https://www.kdf.com/tag/equipment-migration/) --- ### [KDF history](https://www.kdf.com/tag/kdf-history/) --- ### [vacuum processing​](https://www.kdf.com/tag/vacuum-processing/) --- ### [IP piracy](https://www.kdf.com/tag/ip-piracy/) --- ### [semiconductor industry​](https://www.kdf.com/tag/semiconductor-industry/) --- ### [PV solar cells](https://www.kdf.com/tag/pv-solar-cells/) --- ### [pacemaker manufacturing](https://www.kdf.com/tag/pacemaker-manufacturing/) --- ### [Pallet Assist Tool](https://www.kdf.com/tag/pallet-assist-tool/) --- ### [substrate handling​](https://www.kdf.com/tag/substrate-handling/) --- ### [G-12 cathode](https://www.kdf.com/tag/g-12-cathode/) --- ### [LMM cathodes](https://www.kdf.com/tag/lmm-cathodes/) --- ### [sputtering efficiency​](https://www.kdf.com/tag/sputtering-efficiency/) --- ### [844i sputtering system](https://www.kdf.com/tag/844i-sputtering-system/) --- ### [batch sputtering enhancements​](https://www.kdf.com/tag/batch-sputtering-enhancements/) --- ### [i Series controls](https://www.kdf.com/tag/i-series-controls/) --- ### [sputtering automation​](https://www.kdf.com/tag/sputtering-automation/) --- ### [medical equipment manufacturing](https://www.kdf.com/tag/medical-equipment-manufacturing/) --- ### [batch sputtering systems​](https://www.kdf.com/tag/batch-sputtering-systems/) --- ### [digital X-ray production](https://www.kdf.com/tag/digital-x-ray-production/) --- ### [844i sputtering systems​](https://www.kdf.com/tag/844i-sputtering-systems/) --- ### [Ci Cluster Tool](https://www.kdf.com/tag/ci-cluster-tool/) --- ### [phase-change memory​](https://www.kdf.com/tag/phase-change-memory/) --- ### [KDF 904i](https://www.kdf.com/tag/kdf-904i/) --- ### [Beijing Microelectronics Institute​](https://www.kdf.com/tag/beijing-microelectronics-institute/) --- ### [wafer bumping](https://www.kdf.com/tag/wafer-bumping/) --- ### [LCD IC manufacturing​](https://www.kdf.com/tag/lcd-ic-manufacturing/) --- ### [flexible display research](https://www.kdf.com/tag/flexible-display-research/) --- ### [batch sputtering system​](https://www.kdf.com/tag/batch-sputtering-system/) --- ### [KDF 954NTX​](https://www.kdf.com/tag/kdf-954ntx/) --- ### [surface acoustic wave](https://www.kdf.com/tag/surface-acoustic-wave/) --- ### [sputtering system​](https://www.kdf.com/tag/sputtering-system/) --- ### [Ammar Derraa](https://www.kdf.com/tag/ammar-derraa/) --- ### [KDF Director of Technology​](https://www.kdf.com/tag/kdf-director-of-technology/) --- ### [943NT sputtering system](https://www.kdf.com/tag/943nt-sputtering-system/) --- ### [aerospace manufacturing​](https://www.kdf.com/tag/aerospace-manufacturing/) --- ### [943NTX sputtering system​](https://www.kdf.com/tag/943ntx-sputtering-system/) --- ### [DC reactive sputtering](https://www.kdf.com/tag/dc-reactive-sputtering/) --- ### [dielectric film deposition​](https://www.kdf.com/tag/dielectric-film-deposition/) --- ### [dielectric film uniformity](https://www.kdf.com/tag/dielectric-film-uniformity/) --- ### [ERPP technology​](https://www.kdf.com/tag/erpp-technology/) --- ### [OLED production](https://www.kdf.com/tag/oled-production/) --- ### [defense electronics manufacturing​](https://www.kdf.com/tag/defense-electronics-manufacturing/) --- ### [semiconductor manufacturing​](https://www.kdf.com/tag/semiconductor-manufacturing/) --- ### [batch processing](https://www.kdf.com/tag/batch-processing/) --- ### [IC manufacturing​](https://www.kdf.com/tag/ic-manufacturing/) --- ### [space telecommunications​](https://www.kdf.com/tag/space-telecommunications/) --- ### [KDF Technologies](https://www.kdf.com/tag/kdf-technologies/) --- ### [Plasma Emission Monitoring](https://www.kdf.com/tag/plasma-emission-monitoring/) ---