KDF RELEASE 2002 High rate processes for deposition of dielectric films have been developed using DC reactive sputtering on scanning batch tools. A typical high rate process for the deposition of silicon dioxide films from a conductively doped silicon target
KDF RELEASE 2002 Exceptionally high uniformities and tight repeatabilities have been achieved for dielectric films on KDF 900 series sputtering tools using a proprietary ERPP™ (enhanced rotating planetary pallet) in conjunction with the tool’s standard linear scanning mode. We have
KDF RELEASE 2002 KDF today announced that Plasmion Corporation has ordered a custom engineered KDF 744NT batch sputtering system for installation at Hanwha L&C’s Korean facility. The KDF 744NT was ordered as the result of a strategic alliance between Plasmion
KDF RELEASE 2002 KDF today announced that the Electronic Systems business of Raytheon Company (NYSE: RTN) has ordered a 943NT in-line sputtering tool for use in its El Segundo, California facility. Electronic Systems, which is a world leader in the
KDF RELEASE 2002 KDF today announced that it has successfully completed installation of multiple in-line sputtering systems at two Taiwanese foundries. Micro Electro Magnetical Technologies Corporation (MEMT), based in Chunan, Miaoli, Taiwan, purchased a 603NT tool for critical film applications.
ORIGINAL ARTICLE DATE: APRIL 22, 2002 By Kurt Flechsig Electronic News – A decade ago, the development of cluster tools in the IC manufacturing industry seemed to herald the end of batch processing systems. Single-wafer, multichamber tools were the wave
KDF RELEASE 2002 Sale facilitated by European representative TFEsrl KDF today announced that Alcatel Space, a world leader in space telecommunication, will install its 943NT in-line sputtering system this month. Alcatel Space, which is based in Toulouse, France, will use