The 844i series is a large area, four-target, RF / DC batch sputtering system designed for processing high-density interconnect, 300 mm semiconductor wafers, solar photovoltaic cells and flat panel displays.
The 844i will accommodate glass sizes up to Gen 3. Because of its size the 844i system is an extremely cost effective way of running batches of small to large wafers or substrates.
The 844i is equipped with a high-vacuum load lock configured with a substrate pre-heat that enables the tool’s high throughput. The 844i offers a pallet area of 26.5 x 30 inches with a compact footprint that uses less than one-third the floor space of competing equipment. The tool can hold four 300 mm wafers or multiple smaller wafers and features two processing pallets, allowing an instantaneous change of wafer sizes and the ability to process both the front and backsides of wafers.
The 844i system can also be enhanced with scan velocity profiling. The 844i system meets the Semiconductor S2-0706 safety spec as part of the standard system package, a CE option for the European community is available. Pulsed DC sputtering up to 20kw via Advanced Energy Pinnacle Plus is also available.
The 844i system has remote PC accessibility allowing for software upgrades & file repair via an Internet Ethernet connection. Full Documentation is standard and is available on std. paper, clean room paper or an electronic CD version. For those applications that require an extra level of cleanliness or handling the Robotic option is available.