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The 900 Series In-line Products
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| The 900 Series
features dual load lock, in-line, sputter down, batch systems configured with an optional high vacuum load lock and three or four target positions. High-rate DC magnetron sputtering, single pass or multiple pass deposition and dual-level high vacuum pumped load lock features support the versatility and high-throughput of these production systems. Cathode and wafer orientation are horizontal, allowing the sputtered material to be |
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transferred vertically. The 900 series systems are extremely versatile and can be used in countless applications where unique size, shape, or substrate height is a concern. The 954 systems with the tall dome option can accommodate substrate heights up to 2 inches. The 900 Series systems are popular for their pure metal target deposition and convenient wafer-to-pallet loading abilities. The 900 series includes the 903i, 943i, 943ix, 954i, and 954ix The 954i and the 954ix offer up to four-target capability. The
ix series systems offer an extended sputter area for increased process
uniformities utilizing KDF's "X-series"™ cathodes. The
ix series also supports KDF’s new LMM™ |
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cathode along with other cathodes designed by our in house cathode design team. All 900 series systems can also be enhanced with KDF’s proprietary ERPP™ and scan velocity profiling.
The 900 series systems all meet the Semiconductor S2-0706 safety spec as part of the standard system package. A CE option for the European community is available. Pulsed DC sputtering via Advanced Energy Pinnacle Plus is also available. All 900 series system have remote PC accessibility allowing for software |
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upgrades & file repair via an Internet Ethernet connection. Full Documentation is standard and is available on std. paper, clean room paper or an electronic CD version.
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The KDF 974i tool offers
an increased pallet size
of 20 by 20 inches along
with four RF/DC target
capablility. |
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To request KDF brochures and
literature, or a system quote, click below. |
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